7.4 Thermal Information
| THERMAL METRIC(1) |
BQ24650 |
UNIT |
| RVA (VQFN) |
| 16 PINS |
| RθJA |
Junction-to-ambient thermal resistance(2) |
43.8 |
°C/W |
| RθJC(top) |
Junction-to-case (top) thermal resistance |
81 |
°C/W |
| RθJB |
Junction-to-board thermal resistance |
16 |
°C/W |
| ψJT |
Junction-to-top characterization parameter(3) |
0.6 |
°C/W |
| ψJB |
Junction-to-board characterization parameter(4) |
15.77 |
°C/W |
| RθJC(bot) |
Junction-to-case (bottom) thermal resistance |
4 |
°C/W |
(1) For more information about traditional and new thermal metrics, see the
Semiconductor and IC Package Thermal Metrics application report,
SPRA953.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a
(3) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining RθJA, using a procedure described in JESD51-2a (sections 6 and 7).
(4) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining RθJA, using a procedure described in JESD51-2a (sections 6 and 7).