ZHCSHF5A May   2017  – January 2018

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     简化原理图
  4. 4 修订历史记录
  5. 5 说明 （续）
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
    1.     Pin Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Requirements
    7. 8.7 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Ship Mode
        1. 9.3.1.1 Ship Mode Entry and Exit
      2. 9.3.2  High Impedance Mode
      3. 9.3.3  Active Battery Only Connected
      4. 9.3.4  Voltage Based Battery Monitor
      5. 9.3.5  Sleep Mode
      6. 9.3.6  Input Voltage Based Dynamic Power Management (VIN(DPM))
      7. 9.3.7  Input Overvoltage Protection and Undervoltage Status Indication
      8. 9.3.8  Battery Charging Process and Charge Profile
      9. 9.3.9  Dynamic Power Path Management Mode
      10. 9.3.10 Battery Supplement Mode
      11. 9.3.11 Default Mode
      12. 9.3.12 Termination and Pre-Charge Current Programming by External Components (IPRETERM)
      13. 9.3.13 Input Current Limit Programming by External Components (ILIM)
      14. 9.3.14 Charge Current Programming by External Components (ISET)
      15. 9.3.15 Safety Timer and Watchdog Timer
      16. 9.3.16 External NTC Monitoring (TS)
      17. 9.3.17 Thermal Protection
      18. 9.3.18 Typical Application Power Dissipation
      19. 9.3.19 Status Indicators (PG and INT)
      20. 9.3.20 Chip Disable (CD)
      21. 9.3.21 Buck (PWM) Output
      22. 9.3.22 Load Switch / LDO Output and Control
      23. 9.3.23 Manual Reset Timer and Reset Output (MR and RESET)
    4. 9.4 Device Functional Modes
    5. 9.5 Programming
      1. 9.5.1 Serial Interface Description
      2. 9.5.2 F/S Mode Protocol
    6. 9.6 Register Maps
      1. 9.6.1  Status and Ship Mode Control Register
        1. Table 12. Status and Ship Mode Control Register
      2. 9.6.2  Faults and Faults Mask Register
        1. Table 13. Faults and Faults Mask Register
      3. 9.6.3  TS Control and Faults Masks Register
        1. Table 14. TS Control and Faults Masks Register, Memory Location 0010
      4. 9.6.4  Fast Charge Control Register
        1. Table 15. Fast Charge Control Register
      5. 9.6.5  Termination/Pre-Charge and I2C Address Register
        1. Table 16. Termination/Pre-Charge and I2C Address Register
      6. 9.6.6  Battery Voltage Control Register
        1. Table 17. Battery Voltage Control Register
      7. 9.6.7  SYS VOUT Control Register
        1. Table 18. SYS VOUT Control Register
      8. 9.6.8  Load Switch and LDO Control Register
        1. Table 20. Load Switch and LDO Control Register
      9. 9.6.9  Push-button Control Register
        1. Table 21. Push-button Control Register
      10. 9.6.10 ILIM and Battery UVLO Control Register
        1. Table 22. ILIM and Battery UVLO Control Register, Memory Location 1001
      11. 9.6.11 Voltage Based Battery Monitor Register
        1. Table 23. Voltage Based Battery Monitor Register, Memory Location 1010
      12. 9.6.12 VIN_DPM and Timers Register
        1. Table 24. VIN_DPM and Timers Register
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Default Settings
        2. 10.2.2.2 Choose the Correct Inductance and Capacitance
        3. 10.2.2.3 Calculations
          1. 10.2.2.3.1 Program the Fast Charge Current (ISET)
          2. 10.2.2.3.2 Program the Input Current Limit (ILIM)
          3. 10.2.2.3.3 Program the Pre-charge/termination Threshold (IPRETERM)
          4. 10.2.2.3.4 TS Resistors (TS)
      3. 10.2.3 Application Performance Curves
        1. 10.2.3.1 Charger Curves
        2. 10.2.3.2 SYS Output Curves
        3. 10.2.3.3 Load Switch and LDO Curves
        4. 10.2.3.4 LS/LDO Output Curves
        5. 10.2.3.5 Timing Waveforms Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 器件支持
      1. 13.1.1 第三方米6体育平台手机版_好二三四免责声明
    2. 13.2 商标
    3. 13.3 静电放电警告
    4. 13.4 Glossary
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

9.3.1.1 Ship Mode Entry and Exit

The device may only enter Ship Mode when there is not a valid VIN supply present (VIN< VUVLO). Once the IN supply is removed there are two ways for the device to enter Ship Mode: through I2C command using the EN_SHIPMODE bit and by doing a long button press when MRREC bit is set to 0. If the EN_SHIPMODE bit is set while the IN supply is present, the device will enter Ship Mode upon removal of the supply. The EN_SHIPMODE bit can be cleared using the I2C interface as well while the IN input is valid.

In addition to VIN< VUVLO, CD and MR must be high. Once all of these conditions are met the device will begin the transition to Ship Mode. All three conditions must remain unchanged for a period of tQUIET to ensure proper operation. Figure 15 and Figure 16show the correct sequencing to ensure proper entry into the Ship Mode through I2C command and MR button press respectively.

bq25120A bq25120A_ShipEntry_I2C.gifFigure 15. CD, MR and VIN Sequencing for Ship Mode Entry Through I2C Command
bq25120A bq25120A_ShipEntry_MR.gifFigure 16. CD, MR and VIN Sequencing for Ship Mode Entry Through Long MR button press

The end user can enable the device (exit Ship Mode) by connecting an adapter to IN (VIN> VBAT + VSLP) or by toggling the MR button. Note that in the case where an adapter is connected while the MR is still held low and immediately after the RESET timer has expired (MR low for tRESET), the device will not enter Ship Mode, but may enter it upon adapter removal (Same behavior as setting the EN_SHIPMODE bit when the adapter is present). This will not be the case if MR has gone high when the adapter is connected or MR continues to be held low for a period longer than tWAKE1 after the adapter is connected.

To exit Ship Mode through and MR press the battery voltage must be above the maximum programmable BUVLO threshold when VIN is not present. Once MR goes low, the device will start to exit Ship Mode, powering PMID. The device will not complete the transition from Ship Mode until MR has been held low for at least tWAKE1. Only after the transition is complete may the host start I2C communication if the device has not entered High Impedance Mode.
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