ZHCSPT0 June   2022 BQ25172

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Device Power Up from Input Source
        1. 7.3.1.1 ISET Pin Detection
        2. 7.3.1.2 TMR Pin Detection
        3. 7.3.1.3 VSET Pin Detection
        4. 7.3.1.4 Charger Power Up
      2. 7.3.2 Battery Charging Features
        1. 7.3.2.1 NiMH Battery Charging Profile
        2. 7.3.2.2 Charging Safety Timers
        3. 7.3.2.3 Battery Cold, Hot Temperature Qualification (TS Pin)
      3. 7.3.3 Status Outputs (STAT)
        1. 7.3.3.1 Charging Status Indicator (STAT)
      4. 7.3.4 Protection Features
        1. 7.3.4.1 Input Overvoltage Protection (VIN OVP)
        2. 7.3.4.2 Output Overvoltage Protection (BAT OVP)
        3. 7.3.4.3 Output Overcurrent Protection (BAT OCP)
        4. 7.3.4.4 Thermal Regulation and Thermal Shutdown (TREG and TSHUT)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown or Undervoltage Lockout (UVLO)
      2. 7.4.2 Sleep Mode
      3. 7.4.3 Active Mode
        1. 7.4.3.1 Standby Mode
      4. 7.4.4 Fault Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 NiMH Charger Design Example
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 第三方米6体育平台手机版_好二三四免责声明
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
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订购信息

5 Pin Configuration and Functions

GUID-20220513-SS0I-51MR-PDSH-MBKRTJBTMZGW-low.gifFigure 5-1 DSG PackageWSON 8-PinTop View
Table 5-1 Pin Functions
PINI/ODESCRIPTION
NAMENUMBER
IN1PInput power, connected to external DC supply. Bypass IN with a ≥1-μF capacitor to GND, placed close to the IC.
ISET2IPrograms the device charge current. External resistor from ISET to GND defines charge current value. Expected range is 30 kΩ (10 mA) to 375 Ω (800 mA). ICHG = KISET / RISET.
TS3ITemperature qualification voltage input. Connect a negative temperature coefficient (NTC) thermistor directly from TS to GND (AT103-2 recommended). Charge suspends when the TS pin voltage is out of range. VOUT_OVP is reduced in cool region. If TS function is not needed, connect an external 10-kΩ resistor from this pin to GND. Pulling VTS < VTS_ENZ disables the charger.
GND4–Ground pin
STAT5OOpen drain charge status indication output. Connect to the pullup rail via a 10-kΩ resistor. LOW indicates charge in progress. HIGH indicates charge complete or charge disabled. When a fault condition is detected, the STAT pin blinks at 1 Hz.
TMR6IConnect to a pulldown resistor to program charge safety timer duration. Valid resistor range is 3.6 kΩ to 36 kΩ. Refer to Section 7.3.1.2.
VSET7IPrograms the number of series NiMH cells. Valid resistor range is 3.6 kΩ to 62 kΩ. Recommend using a ±1% tolerance resistor with <200 ppm/ºC temperature coefficient. Refer to Section 7.3.1.3.
OUT8PBattery connection. System load may be connected in parallel to the battery. Bypass OUT with a ≥1-μF capacitor to GND, placed close to the IC.
Thermal Pad——Exposed pad beneath the IC for heat dissipation. Solder thermal pad to the board with vias connecting to solid GND plane.
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