ZHCSSP1 july   2023 BQ25173-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Device Power Up from Input Source
        1. 7.3.1.1 ISET Pin Detection
      2. 7.3.2 Supercapacitor Regulation Voltage
      3. 7.3.3 Supercapacitor Charging Profile
      4. 7.3.4 Status Outputs (PG, STAT)
        1. 7.3.4.1 Power Good Indicator (PG Pin)
        2. 7.3.4.2 Charging Status Indicator (STAT)
      5. 7.3.5 Protection Features
        1. 7.3.5.1 Input Overvoltage Protection (VIN OVP)
        2. 7.3.5.2 Output Overcurrent Protection (OUT OCP)
        3. 7.3.5.3 Thermal Regulation and Thermal Shutdown (TREG and TSHUT)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown or Undervoltage Lockout (UVLO)
      2. 7.4.2 Sleep Mode
      3. 7.4.3 Active Mode
        1. 7.4.3.1 Standby Mode
      4. 7.4.4 Fault Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 1s Supercapacitor Charger Design Example
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 4s Supercapacitor Charger Design Example
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 第三方米6体育平台手机版_好二三四免责声明
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 术语表
  13. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) BQ25173-Q1 UNIT
DRC
10 PINS
RθJA Junction-to-ambient thermal resistance (JEDEC(1)) 60.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 73.1 °C/W
RθJB Junction-to-board thermal resistance 34.2 °C/W
ΨJT Junction-to-top characterization parameter 6.0 °C/W
ΨJB Junction-to-board characterization parameter 34.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 16.7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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