To obtain optimal performance, the decoupling capacitor from IN to GND, the capacitor from SYS to GND, and the BAT to GND capacitor should be placed as close as possible to the device.
A solid ground plane should be used that is tied to the GND pin and thermal pad
The pushbutton GND should be connected as close to the device as possible
The high current charge paths into IN, SYS, and BAT must be sized appropriately for the
maximum charge current in order to avoid voltage drops in these traces