ZHCSTK2 October   2023 BQ25185

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 说明（续）
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Thermal Information
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1 Battery Charging Process
        1. 8.1.1.1 Trickle Charge
        2. 8.1.1.2 Pre-Charge
        3. 8.1.1.3 Fast Charge
        4. 8.1.1.4 ISET Pin Detection
        5. 8.1.1.5 Termination
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Input Voltage Based Dynamic Power Management (VINDPM)
      2. 8.3.2  Dynamic Power Path Management Mode (DPPM)
      3. 8.3.3  Battery Supplement Mode
      4. 8.3.4  Sleep Mode
      5. 8.3.5  SYS Regulation
      6. 8.3.6  ILIM/VSET Control
      7. 8.3.7  Protection Mechanisms
        1. 8.3.7.1 Input Overvoltage Protection
        2. 8.3.7.2 Battery Undervoltage Lockout
        3. 8.3.7.3 Battery Overcurrent Protection
        4. 8.3.7.4 System Overvoltage Protection
        5. 8.3.7.5 System Short Protection
        6. 8.3.7.6 Thermal Protection and Thermal Regulation
        7. 8.3.7.7 Safety Timer
      8. 8.3.8  Pushbutton Wake and Reset Input
        1. 8.3.8.1 Pushbutton Long Button Press Function - Factory mode
      9. 8.3.9  External NTC Monitoring (TS)
        1. 8.3.9.1 TS Biasing and Function
      10. 8.3.10 Status Pins
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Input Current and Battery Regulation Voltage - ILIM/VSET
        2. 9.2.2.2 Fast Charge Current- ISET
        3. 9.2.2.3 Recommended Passive Components
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 第三方米6体育平台手机版_好二三四免责声明
    2. 10.2 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.3 Thermal Information

THERMAL METRIC(1) BQ25185 UNIT
DLH
10
RθJA Junction-to-ambient thermal resistance (JEDEC(1)) 68.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 77.2 °C/W
RθJB Junction-to-board thermal resistance 34.7 °C/W
ΨJT Junction-to-top characterization parameter 2.0 °C/W
ΨJB Junction-to-board characterization parameter 34.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 10.7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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