ZHCSNB8A February   2021  – January 2024 BQ25730

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 说明（续）
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics(BQ25730)
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Power-Up Sequence
      2. 8.3.2  Two-Level Battery Discharge Current Limit
      3. 8.3.3  Fast Role Swap Feature
      4. 8.3.4  CHRG_OK Indicator
      5. 8.3.5  Input and Charge Current Sensing
      6. 8.3.6  Input Voltage and Current Limit Setup
      7. 8.3.7  Battery Cell Configuration
      8. 8.3.8  Device HIZ State
      9. 8.3.9  USB On-The-Go (OTG)
      10. 8.3.10 Converter Operation
      11. 8.3.11 Inductance Detection Through IADPT Pin
      12. 8.3.12 Converter Compensation
      13. 8.3.13 Continuous Conduction Mode (CCM)
      14. 8.3.14 Pulse Frequency Modulation (PFM)
      15. 8.3.15 Switching Frequency and Dithering Feature
      16. 8.3.16 Current and Power Monitor
        1. 8.3.16.1 High-Accuracy Current Sense Amplifier (IADPT and IBAT)
        2. 8.3.16.2 High-Accuracy Power Sense Amplifier (PSYS)
      17. 8.3.17 Input Source Dynamic Power Management
      18. 8.3.18 Input Current Optimizer (ICO)
      19. 8.3.19 Two-Level Adapter Current Limit (Peak Power Mode)
      20. 8.3.20 Processor Hot Indication
        1. 8.3.20.1 PROCHOT During Low Power Mode
        2. 8.3.20.2 PROCHOT Status
      21. 8.3.21 Device Protection
        1. 8.3.21.1 Watchdog Timer
        2. 8.3.21.2 Input Overvoltage Protection (ACOV)
        3. 8.3.21.3 Input Overcurrent Protection (ACOC)
        4. 8.3.21.4 System Overvoltage Protection (SYSOVP)
        5. 8.3.21.5 Battery Overvoltage Protection (BATOVP)
        6. 8.3.21.6 Battery Discharge Overcurrent Protection (BATOC)
        7. 8.3.21.7 Battery Short Protection (BATSP)
        8. 8.3.21.8 System Undervoltage Lockout (VSYS_UVP) and Hiccup Mode
        9. 8.3.21.9 Thermal Shutdown (TSHUT)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Forward Mode
        1. 8.4.1.1 System Voltage Regulation with Narrow VDC Architecture
        2. 8.4.1.2 Battery Charging
      2. 8.4.2 USB On-The-Go
      3. 8.4.3 Pass Through Mode (PTM)-Patented Technology
    5. 8.5 Programming
      1. 8.5.1 I2C Serial Interface
        1. 8.5.1.1 Timing Diagrams
        2. 8.5.1.2 Data Validity
        3. 8.5.1.3 START and STOP Conditions
        4. 8.5.1.4 Byte Format
        5. 8.5.1.5 Acknowledge (ACK) and Not Acknowledge (NACK)
        6. 8.5.1.6 Target Address and Data Direction Bit
        7. 8.5.1.7 Single Read and Write
        8. 8.5.1.8 Multi-Read and Multi-Write
        9. 8.5.1.9 Write 2-Byte I2C Commands
    6. 8.6 Register Map
      1. 8.6.1  ChargeOption0 Register (I2C address = 01/00h) [reset = E70Eh]
      2. 8.6.2  ChargeCurrent Register (I2C address = 03/02h) [reset = 0000h]
        1. 8.6.2.1 Battery Pre-Charge Current Clamp
      3. 8.6.3  ChargeVoltage Register (I2C address = 05/04h) [reset value based on CELL_BATPRESZ pin setting]
      4. 8.6.4  ChargerStatus Register (I2C address = 21/20h) [reset = 0000h]
      5. 8.6.5  ProchotStatus Register (I2C address = 23/22h) [reset = B800h]
      6. 8.6.6  IIN_DPM Register (I2C address = 25/24h) [reset = 4100h]
      7. 8.6.7  ADCVBUS/PSYS Register (I2C address = 27/26h)
      8. 8.6.8  ADCIBAT Register (I2C address = 29/28h)
      9. 8.6.9  ADCIIN/CMPIN Register (I2C address = 2B/2Ah)
      10. 8.6.10 ADCVSYS/VBAT Register (I2C address = 2D/2Ch)
      11. 8.6.11 ChargeOption1 Register (I2C address = 31/30h) [reset = 3F00h]
      12. 8.6.12 ChargeOption2 Register (I2C address = 33/32h) [reset = 00B7]
      13. 8.6.13 ChargeOption3 Register (I2C address = 35/34h) [reset = 0434h]
      14. 8.6.14 ProchotOption0 Register (I2C address = 37/36h) [reset = 4A81h(2S~5s) 4A09(1S)]
      15. 8.6.15 ProchotOption1 Register (I2C address = 39/38h) [reset = 41A0h]
      16. 8.6.16 ADCOption Register (I2C address = 3B/3Ah) [reset = 2000h]
      17. 8.6.17 ChargeOption4 Register (I2C address = 3D/3Ch) [reset = 0048h]
      18. 8.6.18 Vmin Active Protection Register (I2C address = 3F/3Eh) [reset = 006Ch(2s~5s)/0004h(1S)]
      19. 8.6.19 OTGVoltage Register (I2C address = 07/06h) [reset = 09C4h]
      20. 8.6.20 OTGCurrent Register (I2C address = 09/08h) [reset = 3C00h]
      21. 8.6.21 InputVoltage(VINDPM) Register (I2C address = 0B/0Ah) [reset =VBUS-1.28V]
      22. 8.6.22 VSYS_MIN Register (I2C address = 0D/0Ch) [reset value based on CELL_BATPRESZ pin setting]
      23. 8.6.23 IIN_HOST Register (I2C address = 0F/0Eh) [reset = 2000h]
      24. 8.6.24 ID Registers
        1. 8.6.24.1 ManufactureID Register (I2C address = 2Eh) [reset = 40h]
        2. 8.6.24.2 Device ID (DeviceAddress) Register (I2C address = 2Fh) [reset = D5h]
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Input Snubber and Filter for Voltage Spike Damping
        2. 9.2.2.2 ACP-ACN Input Filter
        3. 9.2.2.3 Inductor Selection
        4. 9.2.2.4 Input Capacitor
        5. 9.2.2.5 Output Capacitor
        6. 9.2.2.6 Power MOSFETs Selection
      3. 9.2.3 Application Curves
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
      1. 11.2.1 Layout Example Reference Top View
      2. 11.2.2 Inner Layer Layout and Routing Example
  13. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 第三方米6体育平台手机版_好二三四免责声明
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 接收文档更新通知
    4. 12.4 支持资源
    5. 12.5 Trademarks
    6. 12.6 静电放电警告
    7. 12.7 术语表
  14. 13Revision History
  15. 14Mechanical, Packaging, and Orderable Information

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7.6 Timing Requirements

MIN NOM MAX UNIT
I2C TIMING CHARACTERISTICS
tr SCL/SDA rise time 300 ns
tf SCL/SDA fall time 300 ns
tHIGH SCL pulse width high 0.6 50 µs
tLOW SCL pulse width low 1.3 µs
tSU:STA Setup time for START condition 0.6 µs
tHD:STA Start condition hold time after which first clock pulse is generated 0.6 µs
tSU:DAT Data setup time 100 ns
tHD:DAT Data hold time 300 ns
tSU:STO Set up time for STOP condition 0.6 µs
tBUF Bus free time between START and STOP conditions 1.3 µs
fSCL Clock frequency 10 400 kHz
HOST COMMUNICATION FAILURE
tTIMEOUT I2C bus release timeout(1) 25 35 ms
tBOOT Deglitch for watchdog reset signal 10 ms
tWDI Watchdog timeout period, REG0x01[6:5]=01 4 5.5 7 s
Watchdog timeout period, REG0x01[6:5]=10 70 88 105 s
Watchdog timeout period, REG0x01[6:5]=11 140 175 210 s
(1) Devices participating in a transfer timeout when any clock low exceeds the 25-ms minimum timeout period. Devices that have detected a timeout condition must reset the communication no later than the 35-ms maximum timeout period. Both a host and a target must adhere to the maximum value specified because it incorporates the cumulative stretch limit for both a host (10 ms) and a target (25 ms).
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