ZHCSEV6A February   2016  – March 2016

PRODUCTION DATA.  

1. 1 特性
2. 2 应用
3. 3 说明
4. 4 修订历史记录
5. 5 Device Comparison Table
6. 6 Pin Configuration and Functions
7. 7 Specifications
   1. 7.1  Absolute Maximum Ratings
   2. 7.2  ESD Ratings
   3. 7.3  Recommended Operating Conditions
   4. 7.4  Thermal Information
   5. 7.5  Supply Current
   6. 7.6  Digital Input and Output DC Characteristics
   7. 7.7  Power-On Reset
   8. 7.8  2.5-V LDO Regulator
   9. 7.9  Internal Clock Oscillators
   10. 7.10 ADC (Temperature and Cell Measurement) Characteristics
   11. 7.11 Integrating ADC (Coulomb Counter) Characteristics
   12. 7.12 Data Flash Memory Characteristics
   13. 7.13 I2C-Compatible Interface Communication Timing Characteristics
   14. 7.14 SDQ Switching Characteristics
   15. 7.15 Typical Characteristics
8. 8 Detailed Description
   1. 8.1 Overview
   2. 8.2 Functional Block Diagram
   3. 8.3 Feature Description
      1. 8.3.1 Data Commands
         1. 8.3.1.1 Standard Data Commands
            1. 8.3.1.1.1 Control(): 0x00/0x01
      2. 8.3.2 SDQ Signaling
      3. 8.3.3 Reset and Presence Pulse
      4. 8.3.4 WRITE
      5. 8.3.5 READ
      6. 8.3.6 Program Pulse
      7. 8.3.7 IDLE
      8. 8.3.8 CRC Generation
      9. 8.3.9 Communications
         1. 8.3.9.1 I2C Interface
         2. 8.3.9.2 I2C Time Out
         3. 8.3.9.3 I2C Command Waiting Time
         4. 8.3.9.4 I2C Clock Stretching
   4. 8.4 Device Functional Modes
9. 9 Application and Implementation
   1. 9.1 Application Information
   2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
         1. 9.2.2.1 BAT Voltage Sense Input
         2. 9.2.2.2 SRP and SRN Current Sense Inputs
         3. 9.2.2.3 Sense Resistor Selection
         4. 9.2.2.4 TS Temperature Sense Input
         5. 9.2.2.5 Thermistor Selection
         6. 9.2.2.6 REGIN Power Supply Input Filtering
         7. 9.2.2.7 VCC LDO Output Filtering
      3. 9.2.3 Application Curves
10. 10Power Supply Recommendations
    1. 10.1 Power Supply Decoupling
11. 11Layout
    1. 11.1 Layout Guidelines
       1. 11.1.1 Sense Resistor Connections
       2. 11.1.2 Thermistor Connections
       3. 11.1.3 High-Current and Low-Current Path Separation
    2. 11.2 Layout Example
12. 12器件和文档支持
    1. 12.1 文档支持
       1. 12.1.1 相关文档　
    2. 12.2 社区资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 Glossary
13. 13机械、封装和可订购信息