ZHCSEV6A February   2016  – March 2016

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current
    6. 7.6  Digital Input and Output DC Characteristics
    7. 7.7  Power-On Reset
    8. 7.8  2.5-V LDO Regulator
    9. 7.9  Internal Clock Oscillators
    10. 7.10 ADC (Temperature and Cell Measurement) Characteristics
    11. 7.11 Integrating ADC (Coulomb Counter) Characteristics
    12. 7.12 Data Flash Memory Characteristics
    13. 7.13 I2C-Compatible Interface Communication Timing Characteristics
    14. 7.14 SDQ Switching Characteristics
    15. 7.15 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Data Commands
        1. 8.3.1.1 Standard Data Commands
          1. 8.3.1.1.1 Control(): 0x00/0x01
      2. 8.3.2 SDQ Signaling
      3. 8.3.3 Reset and Presence Pulse
      4. 8.3.4 WRITE
      5. 8.3.5 READ
      6. 8.3.6 Program Pulse
      7. 8.3.7 IDLE
      8. 8.3.8 CRC Generation
      9. 8.3.9 Communications
        1. 8.3.9.1 I2C Interface
        2. 8.3.9.2 I2C Time Out
        3. 8.3.9.3 I2C Command Waiting Time
        4. 8.3.9.4 I2C Clock Stretching
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 BAT Voltage Sense Input
        2. 9.2.2.2 SRP and SRN Current Sense Inputs
        3. 9.2.2.3 Sense Resistor Selection
        4. 9.2.2.4 TS Temperature Sense Input
        5. 9.2.2.5 Thermistor Selection
        6. 9.2.2.6 REGIN Power Supply Input Filtering
        7. 9.2.2.7 VCC LDO Output Filtering
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Decoupling
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Sense Resistor Connections
      2. 11.1.2 Thermistor Connections
      3. 11.1.3 High-Current and Low-Current Path Separation
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档　
    2. 12.2 社区资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Pin Configuration and Functions



Pin Functions

PIN TYPE DESCRIPTION
NAME NUMBER
SRP A1 IA(1) Analog input pin connected to the internal coulomb counter with a Kelvin connection where SRP is nearest the PACK– connection. Connect to 5-mΩ to 20-mΩ sense resistor.
SRN B1 IA Analog input pin connected to the internal coulomb counter with a Kelvin connection where SRN is nearest the Vss connection. Connect to 5-mΩ to 20-mΩ sense resistor.
VSS C1, C2 P Device ground
VCC D1 P Regulator output and bq27320 processor power. Decouple with 1-μF ceramic capacitor to Vss.
REGIN E1 P Regulator input. Decouple with 0.1-μF ceramic capacitor to VSS.
SOC_INT A2 O SOC state interrupts output. Generates a pulse under the conditions specified by (1). Open drain output
BAT_GD B2 O Battery Good push-pull indicator output. Active-low and output disabled by default. Polarity is configured via Op Config [BATG_POL] and the output is enabled via OpConfig C [BATGSPUEN].
CE D2 I Chip Enable. Internal LDO is disconnected from REGIN when driven low. Note: CE has an internal ESD protection diode connected to REGIN. Recommend maintaining VCE ≤ VREGIN under all conditions.
BAT E2 I Cell-voltage measurement input. ADC input. Recommend 4.8V maximum for conversion accuracy.
SCL A3 I Slave I2C serial communications clock input line for communication with system (Master). Open-drain I/O. Use with 10-kΩ pull-up resistor (typical).
SDA B3 I/O Slave I2C serial communications data line for communication with system (Master). Open-drain I/O. Use with 10-kΩ pull-up resistor (typical).
SDQ C3 O Communication interface to Authentication ID IC, using the SDQ protocol
TS D3 IA Pack thermistor voltage sense (use 103AT-type thermistor). ADC input
BI/TOUT E3 I/O Battery-insertion detection input. Power pin for pack thermistor network. Thermistor-multiplexer control pin. Use with pull-up resistor >1MΩ (1.8 MΩ typical).
(1) I/O = Digital input/output, IA = Analog input, P = Power connection
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