ZHCSC23D January   2014  – April 2017

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
  4. 修订历史记录
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current
    6. 7.6  Digital Input and Output DC Characteristics
    7. 7.7  LDO Regulator, Wake-Up, and Auto-Shutdown DC Characteristics
    8. 7.8  ADC (Temperature and Cell Measurement) Characteristics
    9. 7.9  Integrating ADC (Coulomb Counter) Characteristics
    10. 7.10 I2C-Compatible Interface Communication Timing Characteristics
    11. 7.11 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
    5. 8.5 Programming
      1. 8.5.1 Standard Data Commands
      2. 8.5.2 Control(): 0x00 and 0x01
      3. 8.5.3 Extended Data Commands
      4. 8.5.4 Communications
        1. 8.5.4.1 I2C Interface
        2. 8.5.4.2 I2C Time Out
        3. 8.5.4.3 I2C Command Waiting Time
        4. 8.5.4.4 I2C Clock Stretching
  9. Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 High-Side or Low-Side Sense Resistor
        2. 9.2.2.2 BAT Voltage Sense Input
        3. 9.2.2.3 Sense Resistor Selection
        4. 9.2.2.4 Communication Interface Lines
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendation
    1. 10.1 Power Supply Decoupling
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档
      2. 12.1.2 社区资源
    2. 12.2 商标
    3. 12.3 静电放电警告
    4. 12.4 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Pin Configuration and Functions

Pin Functions

NUMBER NAME TYPE(1) DESCRIPTION
1 SDA DIO Slave I2C serial bus for communication with system (Master). Open-drain pins. Use with external 5- to 10-kΩ pullup resistors (typical) for each pin. If the external pullup resistors will be disconnected from these pins during normal operation, recommend using external 1.0-MΩ pulldown resistors to VSS at each pin to avoid floating inputs.
2 SCL DIO
3 VSS PI Ground pin
4 NC No internal connection. May be left floating or tied to VSS.
5 VDD PO 1.8-V Regulator Output. Decouple with 0.47-μF ceramic capacitor to VSS. This pin is not intended to provide power for other devices in the system.
6 BAT PI, AI LDO regulator input, battery voltage input, and coulomb counter input typically connected to the PACK+ terminal. Connect a capacitor (1 µF) between BAT to VSS. Place the capacitor close to gauge.
7 SRN AI Coulomb counter differential inputs expecting an external 10-mΩ, 1% sense resistor. Connect SRP to BAT (CELLP) and connect SRN to PACKP.
Low-side current sensing can be enabled by connecting SRN to BATN and SRP to PACKN.
Refer to the typical application diagrams in Typical Applications.
8 SRP AI
9 NC No internal connection. May be left floating or tied to VSS.
10 TEST DI This digital factory TEST pin must be pulled low for proper operation in customer's application. Recommend terminating with a 1.0-MΩ (typical) pulldown resistor to VSS for reduced power consumption.
11 NC No internal connection. May be left floating or tied to VSS.
12 PROG DO Programming voltage input for the One Time Programmable (OTP) memory to be used during customer factory configuration. To avoid a floating input condition, recommend terminating with a 1.0-MΩ (typical) pulldown resistor to VSS for reduced power consumption.
If the device is in SHUTDOWN mode, toggling PROG causes the gauge exit SHUTDOWN. It is recommended to connect PROG to the SDA line through a 470-KΩ resistor, so that in case of any inadvertent shutdown condition, the gauge can be commanded to come out of SHUTDOWN.
DIO = Digital input-output, AI = Analog input, P = Power connection