ZHCS240C December   2012  – June 2016

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Thermal Information
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Supply Current
    6. 6.6  Digital Input and Output DC Characteristics
    7. 6.7  Power-on Reset
    8. 6.8  2.5-V LDO Regulator
    9. 6.9  Internal Clock Oscillators
    10. 6.10 ADC (Temperature and Cell Measurement) Characteristics
    11. 6.11 Integrating ADC (Coulomb Counter) Characteristics
    12. 6.12 Data Flash Memory Characteristics
    13. 6.13 I2C-Compatible Interface Communication Timing Characteristics
    14. 6.14 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Functional Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Modes
        1. 7.4.1.1 BAT INSERT CHECK Mode
        2. 7.4.1.2 NORMAL Mode
        3. 7.4.1.3 SLEEP Mode
      2. 7.4.2 SLEEP+ Mode
      3. 7.4.3 HIBERNATE Mode
    5. 7.5 Programming
      1. 7.5.1 Standard Data Commands
      2. 7.5.2 Control(): 0x00/0x01
      3. 7.5.3 Communications
        1. 7.5.3.1 I2C Interface
        2. 7.5.3.2 I2C Time Out
        3. 7.5.3.3 I2C Command Waiting Time
        4. 7.5.3.4 I2C Clock Stretching
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 BAT Voltage Sense Input
        2. 8.2.2.2 SRP and SRN Current Sense Inputs
        3. 8.2.2.3 Sense Resistor Selection
        4. 8.2.2.4 TS Temperature Sense Input
        5. 8.2.2.5 Thermistor Selection
        6. 8.2.2.6 REGIN Power Supply Input Filtering
        7. 8.2.2.7 VCC LDO Output Filtering
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Power Supply Decoupling
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Sense Resistor Connections
      2. 10.1.2 Thermistor Connections
      3. 10.1.3 High-Current and Low-Current Path Separation
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 接收文档更新通知
    2. 11.2 社区资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 器件和文档支持

11.1 接收文档更新通知

要接收文档更新通知，请导航至 ti.com 上的器件米6体育平台手机版_好二三四文件夹。单击右上角的提醒我注册后，即可收到任何米6体育平台手机版_好二三四的每周摘要

11.2 社区资源

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.3 商标

Impedance Track, NanoFree, E2E are trademarks of Texas Instruments.

I2C is a trademark of NXP B.V. Corp Netherlands.

All other trademarks are the property of their respective owners.

11.4 静电放电警告

esds-image

这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损伤。

11.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.
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