ZHCSCT0 September   2014

PRODUCTION DATA.  

  1. 1 特性
  2. 2  应用
  3. 3  说明
  4. 4 简化电路原理图
  5. 5 修订历史记录
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  Handling Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current
    6. 7.6  Digital Input and Output DC Electrical Characteristics
    7. 7.7  Power-on Reset
    8. 7.8  2.5-V LDO Regulator
    9. 7.9  Internal Clock Oscillators
    10. 7.10 ADC (Temperature and Cell Measurement) Characteristics
    11. 7.11 Integrating ADC (Coulomb Counter) Characteristics
    12. 7.12 Data Flash Memory Characteristics
    13. 7.13 I2C-compatible Interface Communication Timing Characteristics
    14. 7.14 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Functional Description
    5. 8.5 Programming
      1. 8.5.1 Standard Data Commands
      2. 8.5.2 Control( ): 0x00 and 0x01
      3. 8.5.3 Charger Data Commands
      4. 8.5.4 Communications
        1. 8.5.4.1 I2C Interface
        2. 8.5.4.2 I2C Time Out
        3. 8.5.4.3 I2C Command Waiting Time
        4. 8.5.4.4 I2C Clock Stretching
  9. 9 Application and Implementation
    1. 9.1 Typical Application
      1. 9.1.1 Design Requirements
      2. 9.1.2 Detailed Design Procedure
        1. 9.1.2.1 BAT Voltage Sense Input
        2. 9.1.2.2 SRP and SRN Current Sense Inputs
        3. 9.1.2.3 Sense Resistor Selection
        4. 9.1.2.4 TS Temperature Sense Input
        5. 9.1.2.5 Thermistor Selection
        6. 9.1.2.6 REGIN Power Supply Input Filtering
        7. 9.1.2.7 VCC LDO Output Filtering
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Decoupling
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Sense Resistor Connections
      2. 11.1.2 Thermistor Connections
      3. 11.1.3 High-Current and Low-Current Path Separation
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档　
    2. 12.2 商标
    3. 12.3 静电放电警告
    4. 12.4 术语表
  13. 13机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VREGIN Regulator input range –0.3 5.5 V
–0.3 6.0 (2) V
VCE CE input pin –0.3 VREGIN + 0.3 V
VCC Supply voltage range –0.3 2.75 V
VIOD Open-drain IO pins (SDA, SCL, SOC_INT) –0.3 5.5 V
VBAT BAT input pin –0.3 5.5 V
–0.3 6.0 (2) V
VI Input voltage range to all other pins
(BI/TOUT, TS, SRP, SRN, BSCL, BSDA)		 –0.3 VCC + 0.3 V
TA Operating free-air temperature range –40 85 °C
(1) Stresses beyond those listed as absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated as recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Condition not to exceed 100 hours at 25°C lifetime.

7.2 Handling Ratings

MIN MAX UNIT
Tstg Storage temperature range –65 150 °C
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001, BAT pin (1) 0 1.5 kV
Charged device model (CDM), per JEDEC specification JESD22-C101, all other pins(2) 0 2
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

TA = –40°C to 85°C, VREGIN = VBAT = 3.6 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
VREGIN Supply voltage No operating restrictions 2.8 4.5 V
No flash writes 2.45 2.8
CREGIN External input capacitor for internal LDO between REGIN and VSS Nominal capacitor values specified. Recommend a 5% ceramic X5R-type capacitor located close to the device. 0.1 μF
CLDO25 External output capacitor for internal LDO between VCC and VSS 0.47 1 μF
tPUCD Power-up communication delay 250 ms

7.4 Thermal Information

THERMAL METRIC(1) CSP
(15 PINS)		 UNIT
RθJA Junction-to-ambient thermal resistance 70 °C/W
RJC(top) Junction-to-case (top) thermal resistance 17
RθJB Junction-to-board thermal resistance 20
ψJT Junction-to-top characterization parameter 1
ψJB Junction-to-board characterization parameter 18
RθJC(bottom) Junction-to-case (bottom) thermal resistance n/a
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

7.5 Supply Current

TA = 25°C and VREGIN = VBAT = 3.6 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ICC(1) Normal operating-mode current Fuel gauge in NORMAL mode
ILOAD > Sleep current		 118 μA
ISLP+(1) Sleep+ operating-mode current Fuel gauge in SLEEP+ mode
ILOAD < Sleep current		 62 μA
ISLP(1) Low-power storage-mode current Fuel gauge in SLEEP mode
ILOAD < Sleep current		 23 μA
IHIB(1) Hibernate operating-mode current Fuel gauge in HIBERNATE mode
ILOAD < Hibernate current		 8 μA
(1) Specified by design. Not production tested. Actual supply current consumption will vary slightly depending on firmware operation and dataflash configuration.

7.6 Digital Input and Output DC Electrical Characteristics

TA = –40°C to 85°C, typical values at TA = 25°C and VREGIN = 3.6 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOL Output voltage, low (SCL, SDA, SOC_INT, BSDA, BSCL) IOL = 3 mA 0.4 V
VOH(PP) Output voltage, high (BSDA, BSCL) IOH = –1 mA VCC – 0.5 V
VOH(OD) Output voltage, high (SDA, SCL, SOC_INT) External pullup resistor connected to VCC VCC – 0.5
VIL Input voltage, low (SDA, SCL) –0.3 0.6 V
Input voltage, low (BI/TOUT) BAT INSERT CHECK MODE active –0.3 0.6
VIH Input voltage, high (SDA, SCL) 1.2 V
Input voltage, high (BI/TOUT) BAT INSERT CHECK MODE active 1.2 VCC + 0.3
VIL(CE) Input voltage, low (CE) VREGIN = 2.8 to 4.5 V 0.8 V
VIH(CE) Input voltage, high (CE) 2.65
Ilkg(1) Input leakage current (IO pins) 0.3 μA
(1) Specified by design. Not production tested.

7.7 Power-on Reset

TA = –40°C to 85°C, typical values at TA = 25°C and VREGIN = 3.6 V (unless otherwise noted)
PARAMETER MIN TYP MAX UNIT
VIT+ Positive-going battery voltage input at VCC 2.05 2.15 2.20 V
VHYS Power-on reset hysteresis 115 mV

7.8 2.5-V LDO Regulator

TA = –40°C to 85°C, CLDO25 = 1 μF, VREGIN = 3.6 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
VREG25 Regulator output voltage (VCC) 2.8 V ≤ VREGIN ≤ 4.5 V, IOUT ≤ 16 mA(1) 2.3 2.5 2.6 V
2.45 V ≤ VREGIN < 2.8 V (low battery),
IOUT ≤ 3 mA 		2.3 V
(1) LDO output current, IOUT, is the total load current. LDO regulator should be used to power internal fuel gauge only.

7.9 Internal Clock Oscillators

TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted)
PARAMETER MIN TYP MAX UNIT
fOSC High-frequency oscillator 8.389 MHz
fLOSC Low-frequency oscillator 32.768 kHz

7.10 ADC (Temperature and Cell Measurement) Characteristics

TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VADC1 Input voltage range (TS) VSS – 0.125 2 V
VADC2 Input voltage range (BAT) VSS – 0.125 5 V
VIN(ADC) Input voltage range 0.05 1 V
GTEMP Internal temperature sensor voltage gain –2 mV/°C
tADC_CONV Conversion time 125 ms
Resolution 14 15 bits
VOS(ADC) Input offset 1 mV
ZADC1(1) Effective input resistance (TS) 8 MΩ
ZADC2(1) Effective input resistance (BAT) Device not measuring cell voltage 8 MΩ
Device measuring cell voltage 100 kΩ
Ilkg(ADC)(1) Input leakage current 0.3 μA
(1) Specified by design. Not tested in production.

7.11 Integrating ADC (Coulomb Counter) Characteristics

TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VSR Input voltage range,
V(SRP) and V(SRN)		 VSR = V(SRP) – V(SRN) –0.125 0.125 V
tSR_CONV Conversion time Single conversion 1 s
Resolution 14 15 bits
VOS(SR) Input offset 10 μV
INL Integral nonlinearity error ±0.007 ±0.034 % FSR
ZIN(SR) (1) Effective input resistance 2.5 MΩ
Ilkg(SR)(1) Input leakage current 0.3 μA
(1) Specified by design. Not tested in production.

7.12 Data Flash Memory Characteristics

TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted)
PARAMETER MIN TYP MAX UNIT
tDR(1) Data retention 10 Years
Flash-programming write cycles(1) 20,000 Cycles
tWORDPROG(1) Word programming time 2 ms
ICCPROG(1) Flash-write supply current 5 10 mA
tDFERASE(1) Data flash master erase time 200 ms
tIFERASE(1) Instruction flash master erase time 200 ms
tPGERASE(1) Flash page erase time 20 ms
(1) Specified by design. Not production tested

7.13 I2C-compatible Interface Communication Timing Characteristics

TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted)
PARAMETER MIN TYP MAX UNIT
tr SCL or SDA rise time 300 ns
tf SCL or SDA fall time 300 ns
tw(H) SCL pulse duration (high) 600 ns
tw(L) SCL pulse duration (low) 1.3 μs
tsu(STA) Setup for repeated start 600 ns
td(STA) Start to first falling edge of SCL 600 ns
tsu(DAT) Data setup time 100 ns
th(DAT) Data hold time 0 ns
tsu(STOP) Setup time for stop 600 ns
t(BUF) Bus free time between stop and start 66 μs
fSCL Clock frequency (1) 400 kHz
(1) If the clock frequency (fSCL) is > 100 kHz, use 1-byte write commands for proper operation. All other transactions types are supported at 400 kHz (see I2C Interface and I2C Command Waiting Time).
i2c_timing_diagram.gifFigure 1. I2C-compatible Interface Timing Diagrams

7.14 Typical Characteristics

D001_SLUSBU6.gif
Figure 2. Regulator Output Voltage vs. Temperature
D003_SLUSBU6.gif
Figure 4. Low-Frequency Oscillator Frequency vs. Temperature
D002_SLUSBU6.gif
Figure 3. High-Frequency Oscillator Frequency vs. Temperature
D004_SLUSBU6.gif
Figure 5. Reported Internal Temperature Measurement vs. Temperature
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