ZHCSD75D March 2014 – January 2018
PRODUCTION DATA.
THERMAL METRIC(1) | bq27742-G1 | UNIT | |
---|---|---|---|
YZF (DSBGA) | |||
15 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 70 | °C/W |
RθJCtop | Junction-to-case (top) thermal resistance | 17 | °C/W |
RθJB | Junction-to-board thermal resistance | 20 | °C/W |
ψJT | Junction-to-top characterization parameter | 1 | °C/W |
ψJB | Junction-to-board characterization parameter | 18 | °C/W |
RθJCbot | Junction-to-case (bottom) thermal resistance | NA | °C/W |