ZHCSD75D March 2014 – January 2018
PRODUCTION DATA.
The additional capacitors placed across the CHG and DSF FET source pins as well as between PACK+ and ground help to bolster and greatly improve the ESD robustness of the pack design. The former components shunt damaging transients around the FETs and the latter components attempt to bypass such pulses to PACK– before they couple further into the battery pack PCB. Two series capacitors are used for each of these protection areas to prevent a battery short in the event of a single capacitor failure.