ZHCSEJ9D april 2014 – june 2021 BQ28Z610
PRODUCTION DATA
- 1
- 1 特性
- 2 应用
- 3 说明
- 4 Revision History
- 5 Description (Continued)
- 6 Pin Configuration and Functions
-
7 Specifications
- 7.1 Absolute Maximum Ratings
- 7.2 ESD Ratings
- 7.3 Recommended Operating Conditions
- 7.4 Thermal Information
- 7.5 Supply Current
- 7.6 Power Supply Control
- 7.7 Low-Voltage General Purpose I/O, TS1
- 7.8 Power-On Reset (POR)
- 7.9 Internal 1.8-V LDO
- 7.10 Current Wake Comparator
- 7.11 Coulomb Counter
- 7.12 ADC Digital Filter
- 7.13 ADC Multiplexer
- 7.14 Cell Balancing Support
- 7.15 Internal Temperature Sensor
- 7.16 NTC Thermistor Measurement Support
- 7.17 High-Frequency Oscillator
- 7.18 Low-Frequency Oscillator
- 7.19 Voltage Reference 1
- 7.20 Voltage Reference 2
- 7.21 Instruction Flash
- 7.22 Data Flash
- 7.23 Current Protection Thresholds
- 7.24 Current Protection Timing
- 7.25 N-CH FET Drive (CHG, DSG)
- 7.26 I2C Interface I/O
- 7.27 I2C Interface Timing
- 7.28 Typical Characteristics
-
8 Detailed Description
- 8.1 Overview
- 8.2 Functional Block Diagram
- 8.3
Feature Description
- 8.3.1 Battery Parameter Measurements
- 8.3.2 Coulomb Counter (CC)
- 8.3.3 CC Digital Filter
- 8.3.4 ADC Multiplexer
- 8.3.5 Analog-to-Digital Converter (ADC)
- 8.3.6 ADC Digital Filter
- 8.3.7 Internal Temperature Sensor
- 8.3.8 External Temperature Sensor Support
- 8.3.9 Power Supply Control
- 8.3.10 Power-On Reset
- 8.3.11 Bus Communication Interface
- 8.3.12 Cell Balancing Support
- 8.3.13 N-Channel Protection FET Drive
- 8.3.14 Low Frequency Oscillator
- 8.3.15 High Frequency Oscillator
- 8.3.16 1.8-V Low Dropout Regulator
- 8.3.17 Internal Voltage References
- 8.3.18 Overcurrent in Discharge Protection
- 8.3.19 Short-Circuit Current in Charge Protection
- 8.3.20 Short-Circuit Current in Discharge 1 and 2 Protection
- 8.3.21 Primary Protection Features
- 8.3.22 Gas Gauging
- 8.3.23 Charge Control Features
- 8.3.24 Authentication
- 8.4 Device Functional Modes
- 9 Applications and Implementation
- Power Supply Requirements
- 10Layout
- 11Device and Documentation Support
- Mechanical, Packaging, and Orderable Information
6 Pin Configuration and Functions
Table 6-1 Pin Functions
| PIN NUMBER | PIN NAME | TYPE | DESCRIPTION |
|---|---|---|---|
| 1 | VSS | P(1) | Device ground |
| 2 | SRN | AI | Analog input pin connected to the internal coulomb counter peripheral for integrating a small voltage between SRP and SRN where SRP is the top of the sense resistor. |
| 3 | SRP | AI | Analog input pin connected to the internal coulomb counter peripheral for integrating a small voltage between SRP and SRN where SRP is the top of the sense resistor. |
| 4 | TS1 | AI | Temperature input for ADC to the oversampled ADC channel, and optional Battery Trip Point (BTP) output |
| 5 | SCL | I/O | Serial Clock for I2C interface; requires external pullup when used |
| 6 | SDA | I/O | Serial Data for I2C interface; requires external pullup |
| 7 | DSG | O | N-CH FET drive output pin |
| 8 | PACK | AI, P | Pack sense input pin |
| 9 | CHG | O | N-CH FET drive output pin |
| 10 | PBI | P | Power supply backup input pin |
| 11 | VC2 | AI, P | Sense voltage input pin for most positive cell, balance current input for most positive cell. Primary power supply input and battery stack measurement input (BAT) |
| 12 | VC1 | AI | Sense voltage input pin for least positive cell, balance current input for least positive cell |
| PWPD | — | Exposed Pad, electrically connected to VSS (external trace) |
(1) P = Power Connection, O = Digital Output, AI = Analog Input, I
= Digital Input, I/O = Digital Input/Output