ZHCSPQ2 December 2022 BQ28Z620
PRODUCTION DATA
- 1 特性
- 2 应用
- 3 说明
- 4 Revision History
- 5 说明（续）
- 6 BQ28Z620 Changes from BQ28Z610-R1
- 7 Pin Configuration and Functions
-
8 Specifications
- 8.1 Absolute Maximum Ratings
- 8.2 ESD Ratings
- 8.3 Recommended Operating Conditions
- 8.4 Thermal Information
- 8.5 Supply Current
- 8.6 Power Supply Control
- 8.7 Power-On Reset (POR)
- 8.8 Internal 1.8-V LDO
- 8.9 Current Wake Comparator
- 8.10 Coulomb Counter
- 8.11 ADC Digital Filter
- 8.12 ADC Multiplexer
- 8.13 Cell Balancing Support
- 8.14 Internal Temperature Sensor
- 8.15 NTC Thermistor Measurement Support
- 8.16 High-Frequency Oscillator
- 8.17 Low-Frequency Oscillator
- 8.18 Voltage Reference 1
- 8.19 Voltage Reference 2
- 8.20 Instruction Flash
- 8.21 Data Flash
- 8.22 Current Protection Thresholds
- 8.23 Current Protection Timing
- 8.24 N-CH FET Drive (CHG, DSG)
- 8.25 I2C Interface I/O
- 8.26 I2C Interface Timing
- 8.27 Typical Characteristics
-
9 Detailed Description
- 9.1 Overview
- 9.2 Functional Block Diagram
- 9.3
Feature Description
- 9.3.1 Battery Parameter Measurements
- 9.3.2 Coulomb Counter (CC)
- 9.3.3 CC Digital Filter
- 9.3.4 ADC Multiplexer
- 9.3.5 Analog-to-Digital Converter (ADC)
- 9.3.6 ADC Digital Filter
- 9.3.7 Internal Temperature Sensor
- 9.3.8 External Temperature Sensor Support
- 9.3.9 Power Supply Control
- 9.3.10 Power-On Reset
- 9.3.11 Bus Communication Interface
- 9.3.12 I2C Timeout
- 9.3.13 Cell Balancing Support
- 9.3.14 N-Channel Protection FET Drive
- 9.3.15 Low Frequency Oscillator
- 9.3.16 High Frequency Oscillator
- 9.3.17 1.8-V Low Dropout Regulator
- 9.3.18 Internal Voltage References
- 9.3.19 Overcurrent in Discharge Protection
- 9.3.20 Short-Circuit Current in Charge Protection
- 9.3.21 Short-Circuit Current in Discharge 1 and 2 Protection
- 9.3.22 Primary Protection Features
- 9.3.23 Gas Gauging
- 9.3.24 Charge Control Features
- 9.3.25 Authentication
- 9.4 Device Functional Modes
- 10Applications and Implementation
- 11Power Supply Recommendations
- 12Layout
- 13Device and Documentation Support
- 14Mechanical, Packaging, and Orderable Information
8.26 I2C Interface Timing
Typical values stated where TA = 25°C and VCC = 7.2 V,
Min/Max values stated where TA = –40°C to 85°C and VCC = 2.2 V to
10
V (unless otherwise noted)
| PARAMETER | TEST CONDITION | MIN | NOM | MAX | UNIT | |
|---|---|---|---|---|---|---|
| tR | Clock rise time | 10% to 90% | 300 | ns | ||
| tF | Clock fall time | 90% to 10% | 300 | ns | ||
| tHIGH | Clock high period | 600 | ns | |||
| tLOW | Clock low period | 1.3 | µs | |||
| tSU(START) | Repeated start setup time | 600 | ns | |||
| td(START) | Start for first falling edge to SCL | 600 | ns | |||
| tSU(DATA) | Data setup time | 100 | ns | |||
| tHD(DATA) | Data hold time | 0 | µs | |||
| tSU(STOP) | Stop setup time | 600 | ns | |||
| tBUF | Bus free time between stop and start | 1.3 | µs | |||
| fSW | Clock operating frequency | SLAVE mode, SCL 50% duty cycle | 400 | kHz | ||
Figure 8-1 I2C Timing