米6体育平台手机版

ZHCSE10T November 2013 – August 2022 BQ2961 , BQ2962

PRODMIX

7.4 Thermal Information

THERMAL METRIC⁽¹⁾		BQ296xxx	UNIT
		DSG (WSON)
		8 PINS
R_θJA	Junction-to-ambient thermal resistance	62	°C/W
R_θJC(top)	Junction-to-case(top) thermal resistance	72	°C/W
R_θJB	Junction-to-board thermal resistance	32.5	°C/W
ψ_JT	Junction-to-top characterization parameter	1.6	°C/W
ψ_JB	Junction-to-board characterization parameter	33	°C/W
R_θJC(bot)	Junction-to-case(bottom) thermal resistance	10	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.