ZHCS692C October   2010  – October 2015

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: Supply Current
    6. 6.6  Power-On Reset (POR)
    7. 6.7  Wake From Sleep
    8. 6.8  RBI RAM Backup
    9. 6.9  3.3-V Regulator
    10. 6.10 2.5-V Regulator
    11. 6.11 PRES, SMBD, SMBC
    12. 6.12 CHG, DSG FET Drive
    13. 6.13 PCHG FET Drive
    14. 6.14 FUSE
    15. 6.15 Coulomb Counter
    16. 6.16 VC1, VC2, VC3, VC4
    17. 6.17 TS1, TS2
    18. 6.18 Internal Temperature Sensor
    19. 6.19 Internal Thermal Shutdown
    20. 6.20 High-Frequency Oscillator
    21. 6.21 Low-Frequency Oscillator
    22. 6.22 Internal Voltage Reference
    23. 6.23 Flash
    24. 6.24 OCD Current Protection
    25. 6.25 SCD1 Current Protection
    26. 6.26 SCD2 Current Protection
    27. 6.27 SCC Current Protection
    28. 6.28 SBS Timing Requirements
    29. 6.29 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Battery Parameter Measurements
      1. 7.1.1 Charge and Discharge Counting
      2. 7.1.2 Voltage
      3. 7.1.3 Current
      4. 7.1.4 Auto Calibration
      5. 7.1.5 Temperature
      6. 7.1.6 Communications
        1. 7.1.6.1 SMBus On and Off State
        2. 7.1.6.2 SBS Commands
  8. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1 Configuration
        1. 8.1.1.1 Oscillator Function
        2. 8.1.1.2 System Present Operation
        3. 8.1.1.3 2-, 3-, or 4-Cell Configuration
        4. 8.1.1.4 Cell Balancing
          1. 8.1.1.4.1 Internal Cell Balancing
          2. 8.1.1.4.2 External Cell Balancing
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Primary (1st Level) Safety Features
      2. 8.3.2 Secondary (2nd Level) Safety Features
      3. 8.3.3 Charge Control Features
      4. 8.3.4 Gas Gauging
      5. 8.3.5 Lifetime Data Logging Features
      6. 8.3.6 Authentication
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 High-Current Path
          1. 9.2.2.1.1 Protection FETs
          2. 9.2.2.1.2 Chemical Fuse
          3. 9.2.2.1.3 Lithium-Ion Cell Connections
          4. 9.2.2.1.4 Sense Resistor
          5. 9.2.2.1.5 ESD Mitigation
        2. 9.2.2.2 Gas Gauge Circuit
          1. 9.2.2.2.1 Differential Low-Pass Filter
          2. 9.2.2.2.2 Power Supply Decoupling and RBI
          3. 9.2.2.2.3 System Present
          4. 9.2.2.2.4 SMBus Communication
          5. 9.2.2.2.5 FUSE Circuitry
          6. 9.2.2.2.6 PFIN Detection
        3. 9.2.2.3 Secondary-Current Protection
          1. 9.2.2.3.1 Cell and Battery Inputs
          2. 9.2.2.3.2 External Cell Balancing
          3. 9.2.2.3.3 PACK and FET Control
          4. 9.2.2.3.4 Regulator Output
          5. 9.2.2.3.5 Temperature Output
        4. 9.2.2.4 Secondary-Overvoltage Protection
          1. 9.2.2.4.1 Cell Inputs
          2. 9.2.2.4.2 Time-Delay Capacitor
      3. 9.2.3 Application Curves
    3. 9.3 System Example
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档
    2. 12.2 社区资源
    3. 12.3 商标
    4. 12.4 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

DBT Package
30-Pin TSSOP
Top View
bq3055 Pin_Out_bq3055.gif

Pin Functions

PIN TYPE(1) DESCRIPTION
NAME NO.
BAT 2 P Alternate power source
CHG 1 O Charge N-FET gate drive
DSG 30 O Discharge N-FET gate drive
FUSE 26 O Fuse drive
NC 14 — Not internally connected. Connect to VSS.
NC 16 — Not internally connected. Connect to VSS.
NC 17 — Not internally connected. Connect to VSS.
NC 18 — Not internally connected. Connect to VSS.
NC 19 — Not internally connected. Connect to VSS.
NC 20 — Not internally connected. Connect to VSS.
PACK 29 P Alternate power source
PCHG 28 I/OD Precharge P-FET gate drive
PRES 12 I Host system present input
RBI 21 P RAM backup
REG25 22 P 2.5-V regulator output
REG33 24 P 3.3-V regulator output
SMBC 15 I/OD SMBus v1.1 clock line
SMBD 13 I/OD SMBus v1.1 data line
SRN 10 AI Differential Coulomb Counter input
SRP 9 AI Differential Coulomb Counter input
TEST 25 — Test pin, connect to VSS through 2-kΩ resistor.
TS1 8 AI Temperature sensor 1 thermistor input
TS2 11 AI Temperature sensor 2 thermistor input
VC1 3 I Sense input for positive voltage of top most cell in stack and cell balancing input for top most cell in stack
VC2 4 I Sense input for positive voltage of third lowest cell in stack and cell balancing input for third lowest cell in stack
VC3 5 I Sense input for positive voltage of second lowest cell in stack and cell balancing input for second lowest cell in stack
VC4 6 I Sense input for positive voltage of lowest cell in stack and cell balancing input for lowest cell in stack
VCC 27 P Power supply voltage
VSS 7 P Device ground
VSS 23 P Device ground
(1) P = Power Connection, O = Digital Output, AI = Analog Input, I = Digital Input, I/OD = Digital Input/Output
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