SLUS900E December   2008  – August 2015

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 IRQ Function
      2. 7.3.2 VBACK Switchover
      3. 7.3.3 Trickle Charge
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 I2C Serial Interface
    6. 7.6 Register Maps
      1. 7.6.1 I2C Read After Backup Mode
      2. 7.6.2 Normal Register Descriptions
        1. 7.6.2.1  SECONDS Register (address = 0x00) [reset = 0XXXXXXb]
        2. 7.6.2.2  MINUTES Register (address = 0x01) [reset = 1XXXXXXb]
        3. 7.6.2.3  CENT_HOURS Register (address = 0x02) [reset = XXXXXXXXb]
        4. 7.6.2.4  DAY Register (address = 0x03) [reset = 00000XXXb]
        5. 7.6.2.5  DATE Register (address = 0x04) [reset = 00XXXXXXb]
        6. 7.6.2.6  MONTH Register (address = 0x05) [reset = 000XXXXXb]
        7. 7.6.2.7  YEARS Register (address = 0x06) [reset = XXXXXXXXb]
        8. 7.6.2.8  CAL_CFG1 Register (address = 0x07) [reset = 10000000b]
        9. 7.6.2.9  TCH2 Register (address = 0x08) [reset = 10010000b]
        10. 7.6.2.10 CFG2 Register (address = 0x09) [reset = 10101010b]
      3. 7.6.3 Special Function Registers
        1. 7.6.3.1 SF KEY 1 Register (address = 0x20) [reset = 00000000b]
        2. 7.6.3.2 SF KEY 2 Register (address = 0x21) [reset = 00000000b]
        3. 7.6.3.3 SFR Register (address = 0x22) [reset = 00000000b]
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Reading From a Register
        2. 8.2.2.2 Leap Year Compensation
        3. 8.2.2.3 Utilizing the Backup Supply
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from D Revision (November 2011) to E Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. Go
  • Added Storage Temperature to Absolute Maximum RatingsGo
  • Changed VCC = 0 to VCC needs a pulse.Go
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