ZHCSRC1 December   2022 BQ34Z100-R2

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: Power-On Reset
    6. 6.6  Electrical Characteristics: LDO Regulator
    7. 6.7  Electrical Characteristics: Internal Temperature Sensor Characteristics
    8. 6.8  Electrical Characteristics: Low-Frequency Oscillator
    9. 6.9  Electrical Characteristics: High-Frequency Oscillator
    10. 6.10 Electrical Characteristics: Integrating ADC (Coulomb Counter) Characteristics
    11. 6.11 Electrical Characteristics: ADC (Temperature and Cell Measurement) Characteristics
    12. 6.12 Electrical Characteristics: Data Flash Memory Characteristics
    13. 6.13 Timing Requirements: HDQ Communication
    14. 6.14 Timing Requirements: I2C-Compatible Interface
    15. 6.15 Typical Characteristics
  7. 7 Functional Block Diagram
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Step-by-Step Design Procedure
          1. 8.2.2.1.1 STEP 1: Review and Modify the Data Flash Configuration Data.
          2. 8.2.2.1.2 STEP 2: Review and Modify the Data Flash Configuration Registers.
          3. 8.2.2.1.3 STEP 3: Design and Configure the Voltage Divider.
          4. 8.2.2.1.4 STEP 4: Determine the Sense Resistor Value.
          5. 8.2.2.1.5 STEP 5: Review and Modify the Data Flash Gas Gauging Configuration, Data, and State.
          6. 8.2.2.1.6 STEP 6: Determine and Program the Chemical ID.
          7. 8.2.2.1.7 STEP 7: Calibrate.
          8. 8.2.2.1.8 STEP 8: Run an Optimization Cycle.
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Introduction
      2. 10.1.2 Power Supply Decoupling Capacitor
      3. 10.1.3 Capacitors
      4. 10.1.4 Communication Line Protection Components
    2. 10.2 Layout Example
      1. 10.2.1 Ground System
      2. 10.2.2 Kelvin Connections
      3. 10.2.3 Board Offset Considerations
      4. 10.2.4 ESD Spark Gap
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
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订购信息

11.3 支持资源

TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解答或提出自己的问题可获得所需的快速设计帮助。

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