ZHCS926C May   2012  – May 2021 BQ34Z100

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: Power-On Reset
    6. 6.6  Electrical Characteristics: LDO Regulator
    7. 6.7  Electrical Characteristics: Internal Temperature Sensor Characteristics
    8. 6.8  Electrical Characteristics: Low-Frequency Oscillator
    9. 6.9  Electrical Characteristics: High-Frequency Oscillator
    10. 6.10 Electrical Characteristics: Integrating ADC (Coulomb Counter) Characteristics
    11. 6.11 Electrical Characteristics: ADC (Temperature and Cell Measurement) Characteristics
    12. 6.12 Electrical Characteristics: Data Flash Memory Characteristics
    13. 6.13 Timing Requirements: HDQ Communication
    14. 6.14 Timing Requirements: I2C-Compatible Interface
    15. 6.15 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Feature Description
      1. 7.2.1  Data Commands
        1. 7.2.1.1 Standard Data Commands
        2. 7.2.1.2 Control(): 0x00/0x01
          1. 7.2.1.2.1  CONTROL_STATUS: 0x0000
          2. 7.2.1.2.2  DEVICE TYPE: 0x0001
          3. 7.2.1.2.3  FW_VERSION: 0x0002
          4. 7.2.1.2.4  HW_VERSION: 0x0003
          5. 7.2.1.2.5  RESET_DATA: 0x0005
          6. 7.2.1.2.6  PREV_MACWRITE: 0x0007
          7. 7.2.1.2.7  CHEM ID: 0x0008
          8. 7.2.1.2.8  BOARD_OFFSET: 0x0009
          9. 7.2.1.2.9  CC_OFFSET: 0x000A
          10. 7.2.1.2.10 CC_OFFSET_SAVE: 0x000B
          11. 7.2.1.2.11 DF_VERSION: 0x000C
          12. 7.2.1.2.12 SET_FULLSLEEP: 0x0010
          13. 7.2.1.2.13 STATIC_CHEM_DF_CHKSUM: 0x0017
          14. 7.2.1.2.14 SEALED: 0x0020
          15. 7.2.1.2.15 IT ENABLE: 0x0021
          16. 7.2.1.2.16 RESET: 0x0041
          17. 7.2.1.2.17 EXIT_CAL: 0x0080
          18. 7.2.1.2.18 ENTER_CAL: 0x0081
          19. 7.2.1.2.19 OFFSET_CAL: 0x0082
        3. 7.2.1.3 StateOfCharge(): 0x02/0x03
        4. 7.2.1.4 RemainingCapacity(): 0x04/0x05
        5. 7.2.1.5 FullChargeCapacity(): 0x06/07
        6. 7.2.1.6 Voltage(): 0x08/0x09
        7. 7.2.1.7 AverageCurrent(): 0x0A/0x0B
        8. 7.2.1.8 Temperature(): 0x0C/0x0D
        9. 7.2.1.9 Flags(): 0x0E/0x0F
      2. 7.2.2  Extended Data Commands
        1. 7.2.2.1  AtRate(): 0X10/0x11
        2. 7.2.2.2  AtRateTimeToEmpty(): 0x12/0x13
        3. 7.2.2.3  Current(): 0x10/0x11
        4. 7.2.2.4  NominalAvailableCapacity(): 0x14/0x15
        5. 7.2.2.5  FullAvailableCapacity(): 0x16/0x17
        6. 7.2.2.6  TimeToEmpty(): 0x18/0x19
        7. 7.2.2.7  TimeToFull(): 0x1A/0x1B
        8. 7.2.2.8  StandbyCurrent(): 0x1C/0x1D
        9. 7.2.2.9  StandbyTimeToEmpty(): 0x1E/0x1F
        10. 7.2.2.10 MaxLoadCurrent(): 0x20/0x21
        11. 7.2.2.11 MaxLoadTimeToEmpty(): 0x22/0x23
        12. 7.2.2.12 AvailableEnergy(): 0x24/0x25
        13. 7.2.2.13 AveragePower(): 0x26/0x27
        14. 7.2.2.14 TimeToEmptyAtConstantPower(): 0x28/0x29
        15. 7.2.2.15 InternalTemp(): 0x2A/0x2B
        16. 7.2.2.16 CycleCount(): 0x2C/0x2D
        17. 7.2.2.17 StateOfHealth(): 0x2E/0x2F
        18. 7.2.2.18 ChargeVoltage(): 0x30/0x31
        19. 7.2.2.19 ChargeCurrent(): 0x32/0x33
        20. 7.2.2.20 PassedCharge(): 0x34/0x35
        21. 7.2.2.21 DOD0(): 0x36/0x37
        22. 7.2.2.22 SelfDischargeCurrent(): 0x38/0x39
        23. 7.2.2.23 PackConfiguration(): 0x3A/0x3B
        24. 7.2.2.24 DesignCapacity(): 0x3C/0x3D
        25. 7.2.2.25 DataFlashClass(): 0x3E
        26. 7.2.2.26 DataFlashBlock(): 0x3F
        27. 7.2.2.27 AuthenticateData/BlockData(): 0x40…0x53
        28. 7.2.2.28 AuthenticateChecksum/BlockData(): 0x54
        29. 7.2.2.29 BlockData(): 0x55…0x5F
        30. 7.2.2.30 BlockDataChecksum(): 0x60
        31. 7.2.2.31 BlockDataControl(): 0x61
        32. 7.2.2.32 DeviceNameLength(): 0x62
        33. 7.2.2.33 DeviceName(): 0x63…0x6A
      3. 7.2.3  Data Flash Interface
        1. 7.2.3.1 Accessing Data Flash
        2. 7.2.3.2 Manufacturer Information Block
        3. 7.2.3.3 Access Modes
        4. 7.2.3.4 Sealing/Unsealing Data Flash Access
      4. 7.2.4  Data Flash Summary
      5. 7.2.5  Fuel Gauging
      6. 7.2.6  Impedance Track Variables
        1. 7.2.6.1  Load Mode
        2. 7.2.6.2  Load Select
        3. 7.2.6.3  Reserve Cap-mAh
        4. 7.2.6.4  Reserve Cap-mWh/cWh
        5. 7.2.6.5  Design Energy Scale
        6. 7.2.6.6  Dsg Current Threshold
        7. 7.2.6.7  Chg Current Threshold
        8. 7.2.6.8  Quit Current, Dsg Relax Time, Chg Relax Time, and Quit Relax Time
        9. 7.2.6.9  Qmax
        10. 7.2.6.10 Update Status
        11. 7.2.6.11 Avg I Last Run
        12. 7.2.6.12 Avg P Last Run
        13. 7.2.6.13 Delta Voltage
        14. 7.2.6.14 Ra Tables
        15. 7.2.6.15 Pack Configuration Register
          1. 7.2.6.15.1 Pack Configuration B Register
          2. 7.2.6.15.2 Pack Configuration C Register
      7. 7.2.7  Voltage Division and Calibration
        1. 7.2.7.1 1S Example
        2. 7.2.7.2 7S Example
        3. 7.2.7.3 Autocalibration
      8. 7.2.8  Temperature Measurement
      9. 7.2.9  Overtemperature Indication
        1. 7.2.9.1 Overtemperature: Charge
        2. 7.2.9.2 Overtemperature: Discharge
      10. 7.2.10 Charging and Charge Termination Indication
      11. 7.2.11 X10 Mode
      12. 7.2.12 Remaining State of Charge LED Indication
      13. 7.2.13 Alert Signal
      14. 7.2.14 Communications
        1. 7.2.14.1 Authentication
        2. 7.2.14.2 Key Programming
        3. 7.2.14.3 Executing an Authentication Query
        4. 7.2.14.4 HDQ Single-Pin Serial Interface
        5. 7.2.14.5 I2C Interface
      15. 7.2.15 Power Control
        1. 7.2.15.1 Reset Functions
        2. 7.2.15.2 Wake-Up Comparator
        3. 7.2.15.3 Flash Updates
    3. 7.3 Device Functional Modes
      1. 7.3.1 NORMAL Mode
      2. 7.3.2 SLEEP Mode
      3. 7.3.3 FULL SLEEP Mode
  8. 8 Application and Implementation
    1. 8.1 Typical Applications
      1. 8.1.1 Design Requirements
      2. 8.1.2 Detailed Design Procedure
        1. 8.1.2.1 Step-by-Step Design Procedure
          1. 8.1.2.1.1 STEP 1: Review and Modify the Data Flash Configuration Data.
          2. 8.1.2.1.2 STEP 2: Review and Modify the Data Flash Configuration Registers.
          3. 8.1.2.1.3 STEP 3: Design and Configure the Voltage Divider.
          4. 8.1.2.1.4 STEP 4: Determine the Sense Resistor Value.
          5. 8.1.2.1.5 STEP 5: Review and Modify the Data Flash Gas Gauging Configuration, Data, and State.
          6. 8.1.2.1.6 STEP 6: Determine and Program the Chemical ID.
          7. 8.1.2.1.7 STEP 7: Calibrate.
          8. 8.1.2.1.8 STEP 8: Run an Optimization Cycle.
      3. 8.1.3 Battery Chemistry Configuration
        1. 8.1.3.1 Battery Chemistry Charge Termination
      4. 8.1.4 Replaceable Battery Systems
      5. 8.1.5 Digital Interface Options
      6. 8.1.6 Display Options
      7. 8.1.7 Application Curves
      8. 8.1.8 Special Applications
        1. 8.1.8.1 Operation Configuration B Register
        2. 8.1.8.2 Operation Configuration C Register
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Introduction
      2. 10.1.2 Power Supply Decoupling Capacitor
      3. 10.1.3 Capacitors
      4. 10.1.4 Communication Line Protection Components
    2. 10.2 Layout Example
      1. 10.2.1 Ground System
      2. 10.2.2 Kelvin Connections
      3. 10.2.3 Board Offset Considerations
      4. 10.2.4 ESD Spark Gap
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

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7.2.2 Extended Data Commands

Extended commands offer additional functionality beyond the standard set of commands. They are used in the same manner; however, unlike standard commands, extended commands are not limited to 2-byte words. The number of command bytes for a given extended command ranges in size from single to multiple bytes, as specified in Table 7-6. For details on the SEALED and UNSEALED states, refer to Section 7.2.3.3.

Table 7-6 Extended Commands
NAME COMMAND CODE UNIT SEALED ACCESS(1)(2) UNSEALED ACCESS(1)(2)
AtRate() AR 0X10/0x11 mA R/W R/W
Current() I 0X10/0x11 mA R R
AtRateTimeToEmpty() ARTTE 0x12/0x13 Minutes R R
NominalAvailableCapacity() NAC 0x14/0x15 mAh R R
FullAvailableCapacity() FAC 0x16/0x17 mAh R R
TimeToEmpty() TTE 0x18/0x19 Minutes R R
TimeToFull() TTF 0x1A/0x1B Minutes R R
StandbyCurrent() SI 0x1C/0x1D mA R R
StandbyTimeToEmpty() STTE 0x1E/0x1F Minutes R R
MaxLoadCurrent() MLI 0x20/0x21 mA R R
MaxLoadTimeToEmpty() MLTTE 0x22/0x23 Minutes R R
AvailableEnergy() AE 0x24/0x25 10 mW/h R R
AveragePower() AP 0x26/0x27 10 mW R R
TTEatConstantPower() TTECP 0x28/0x29 Minutes R R
Internal_Temp() INTTEMP 0x2A/0x2B 0.1 K R R
CycleCount() CC 0x2C/0x2D Counts R R
StateOfHealth() SOH 0x2E/0x2F % R R
ChargeVoltage() CHGV 0x30/0x31 mV R R
ChargeCurrent() CHGI 0x32/0x33 mA R R
PassedCharge() PCHG 0x34/0x35 mAh R R
DOD0() DOD0 0x36/0x37 HEX# R R
SelfDischargeCurrent SDSG 0x38/0x39 mA R R
PackConfiguration() PKCFG 0x3A/0x3B N/A R R
DesignCapacity() DCAP 0x3C/0x3D mAh R R
DataFlashClass() (2) DFCLS 0x3E N/A N/A R/W
DataFlashBlock() (2) DFBLK 0x3F N/A R/W R/W
Authenticate()/BlockData() A/DF 0x40…0x53 N/A R/W R/W
AuthenticateCheckSum()/BlockData() ACKS/DFD 0x54 N/A R/W R/W
BlockData() DFD 0x55…0x5F N/A R R/W
BlockDataCheckSum() DFDCKS 0x60 N/A R/W R/W
BlockDataControl() DFDCNTL 0x61 N/A N/A R/W
DeviceNameLength() DNAMELEN 0x62 N/A R R
DeviceName() DNAME 0x63...0x69 N/A R R
Reserved RSVD 0x6A...0x7F N/A R R
(1) SEALED and UNSEALED states are entered via commands to CNTL 0x00/0x01.
(2) In SEALED mode, data flash cannot be accessed through commands 0x3E and 0x3F.
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