ZHCSG63C December   2013  – July 2018

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     无线电源联盟（WPC 或者 Qi）感应式充电系统
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1 A Brief Description of the Wireless System
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Details of a Qi Wireless Power System and bq51003 Power Transfer Flow Diagrams
      2. 8.3.2  Dynamic Rectifier Control
      3. 8.3.3  Dynamic Efficiency Scaling
      4. 8.3.4  RILIM Calculations
      5. 8.3.5  Input Overvoltage
      6. 8.3.6  Adapter Enable Functionality and EN1/EN2 Control
      7. 8.3.7  End Power Transfer Packet (WPC Header 0x02)
      8. 8.3.8  Status Outputs
      9. 8.3.9  WPC Communication Scheme
      10. 8.3.10 Communication Modulator
      11. 8.3.11 Adaptive Communication Limit
      12. 8.3.12 Synchronous Rectification
      13. 8.3.13 Temperature Sense Resistor Network (TS)
      14. 8.3.14 3-State Driver Recommendations for the TS-CTRL Pin
      15. 8.3.15 Thermal Protection
      16. 8.3.16 WPC v1.2 Compliance – Foreign Object Detection
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 bq51003 Wireless Power Receiver Used as a Power Supply
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Using the bq51003 as a Wireless Power Supply
          2. 9.2.1.2.2 Series and Parallel Resonant Capacitor Selection
          3. 9.2.1.2.3 COMM, CLAMP, and BOOT Capacitors
          4. 9.2.1.2.4 Control Pins and CHG
          5. 9.2.1.2.5 Current Limit and FOD
          6. 9.2.1.2.6 RECT and OUT Capacitance
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Dual Power Path: Wireless Power and DC Input
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 开发支持
    2. 12.2 接收文档更新通知
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 术语表
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
Input voltage AC1, AC2 –0.8 20 V
RECT, COMM1, COMM2, OUT, CHG, CLAMP1, CLAMP2 –0.3 20
AD, AD-EN –0.3 30
BOOT1, BOOT2 -0.3 26
EN1, EN2, FOD, TS-CTRL, ILIM –0.3 7
Input current AC1, AC2 1 A(RMS)
Output current OUT 525 mA
Output sink current CHG 15 mA
COMM1, COMM2 1 A
Junction temperature, TJ –40 150 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to the VSS terminal, unless otherwise noted.
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