ZHCSMR2B December   2020  – December 2021 BQ76942

PRODUCTION DATA  

1. 1 特性
2. 2 应用
3. 3 说明
4. 4 Revision History
5. 5 Device Comparison Table
6. 6 Pin Configuration and Functions
7. 7 Specifications
   1. 7.1  Absolute Maximum Ratings
   2. 7.2  ESD Ratings
   3. 7.3  Recommended Operating Conditions
   4. 7.4  Thermal Information BQ76942
   5. 7.5  Supply Current
   6. 7.6  Digital I/O
   7. 7.7  LD Pin
   8. 7.8  Precharge (PCHG) and Predischarge (PDSG) FET Drive
   9. 7.9  FUSE Pin Functionality
   10. 7.10 REG18 LDO
   11. 7.11 REG0 Pre-regulator
   12. 7.12 REG1 LDO
   13. 7.13 REG2 LDO
   14. 7.14 Voltage References
   15. 7.15 Coulomb Counter
   16. 7.16 Coulomb Counter Digital Filter (CC1)
   17. 7.17 Current Measurement Digital Filter (CC2)
   18. 7.18 Current Wake Detector
   19. 7.19 Analog-to-Digital Converter
   20. 7.20 Cell Balancing
   21. 7.21 Cell Open Wire Detector
   22. 7.22 Internal Temperature Sensor
   23. 7.23 Thermistor Measurement
   24. 7.24 Internal Oscillators
   25. 7.25 High-Side NFET Drivers
   26. 7.26 Comparator-Based Protection Subsystem
   27. 7.27 Timing Requirements – I2C Interface, 100kHz Mode
   28. 7.28 Timing Requirements – I2C Interface, 400kHz Mode
   29. 7.29 Timing Requirements – HDQ Interface
   30. 7.30 Timing Requirements – SPI Interface
   31. 7.31 Interface Timing Diagrams
   32. 7.32 Typical Characteristics
8. 8 Device Description
   1. 8.1 Overview
   2. 8.2 BQ76942 Device Versions
   3. 8.3 Functional Block Diagram
   4. 8.4 Diagnostics
9. 9 Device Configuration
   1. 9.1 Commands and Subcommands
   2. 9.2 Configuration Using OTP or Registers
   3. 9.3 Device Security
   4. 9.4 Scratchpad Memory
10. 10Measurement Subsystem
    1. 10.1  Voltage Measurement
       1. 10.1.1 Voltage Measurement Schedule
       2. 10.1.2 Usage of VC Pins for Cells Versus Interconnect
       3. 10.1.3 Cell 1 Voltage Validation During SLEEP Mode
    2. 10.2  General Purpose ADCIN Functionality
    3. 10.3  Coulomb Counter and Digital Filters
    4. 10.4  Synchronized Voltage and Current Measurement
    5. 10.5  Internal Temperature Measurement
    6. 10.6  Thermistor Temperature Measurement
    7. 10.7  Factory Trim of Voltage ADC
    8. 10.8  Voltage Calibration (ADC Measurements)
    9. 10.9  Voltage Calibration (COV and CUV Protections)
    10. 10.10 Current Calibration
    11. 10.11 Temperature Calibration
11. 11Primary and Secondary Protection Subsystems
    1. 11.1 Protections Overview
    2. 11.2 Primary Protections
    3. 11.3 Secondary Protections
    4. 11.4 High-Side NFET Drivers
    5. 11.5 Protection FETs Configuration and Control
       1. 11.5.1 FET Configuration
       2. 11.5.2 PRECHARGE and PREDISCHARGE Modes
    6. 11.6 Load Detect Functionality
12. 12Device Hardware Features
    1. 12.1  Voltage References
    2. 12.2  ADC Multiplexer
    3. 12.3  LDOs
       1. 12.3.1 Preregulator Control
       2. 12.3.2 REG1 and REG2 LDO Controls
    4. 12.4  Standalone Versus Host Interface
    5. 12.5  Multifunction Pin Controls
    6. 12.6  RST_SHUT Pin Operation
    7. 12.7  CFETOFF, DFETOFF, BOTHOFF Pin Functionality
    8. 12.8  ALERT Pin Operation
    9. 12.9  DDSG and DCHG Pin Operation
    10. 12.10 Fuse Drive
    11. 12.11 Cell Open Wire
    12. 12.12 Low Frequency Oscillator
    13. 12.13 High Frequency Oscillator
13. 13Device Functional Modes
    1. 13.1 Overview
    2. 13.2 NORMAL Mode
    3. 13.3 SLEEP Mode
    4. 13.4 DEEPSLEEP Mode
    5. 13.5 SHUTDOWN Mode
    6. 13.6 CONFIG_UPDATE Mode
14. 14Serial Communications Interface
    1. 14.1 Serial Communications Overview
    2. 14.2 I2C Communications Subsystem
    3. 14.3 SPI Communications Interface
       1. 14.3.1 SPI Protocol
    4. 14.4 HDQ Communications Interface
15. 15Cell Balancing
    1. 15.1 Cell Balancing Overview
16. 16Application and Implementation
    1. 16.1 Application Information
    2. 16.2 Typical Applications
       1. 16.2.1 Design Requirements (Example)
       2. 16.2.2 Detailed Design Procedure
       3. 16.2.3 Application Performance Plot
       4. 16.2.4 Calibration Process
       5. 16.2.5 Design Example
    3. 16.3 Random Cell Connection Support
    4. 16.4 Startup Timing
    5. 16.5 FET Driver Turn-Off
    6. 16.6 Unused Pins
17. 17Power Supply Requirements
18. 18Layout
    1. 18.1 Layout Guidelines
    2. 18.2 Layout Example
19. 19Device and Documentation Support
    1. 19.1 第三方米6体育平台手机版_好二三四免责声明
    2. 19.2 Documentation Support
       1. 19.2.1 接收文档更新通知
    3. 19.3 支持资源
    4. 19.4 Trademarks
    5. 19.5 Electrostatic Discharge Caution
    6. 19.6 术语表
20. 20Mechanical, Packaging, Orderable Information