ZHCSTD7A December   2021  – November 2023 BQ79631-Q1

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Revision History
  6. 说明(续)
  7. Pin Configuration and Functions
  8. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Measurement System
        1. 8.3.1.1 Voltage Measurement System
          1. 8.3.1.1.1 Main ADC
            1. 8.3.1.1.1.1 VS Voltage Measurements
              1. 8.3.1.1.1.1.1 Analog Front End
              2. 8.3.1.1.1.1.2 VS Channel Measurements
              3. 8.3.1.1.1.1.3 Post-ADC Digital LPF
              4. 8.3.1.1.1.1.4 SRP and SRN Measurements
            2. 8.3.1.1.1.2 Temperature Measurements
              1. 8.3.1.1.1.2.1 DieTemp1 Measurement
              2. 8.3.1.1.1.2.2 GPIOs and TSREF Measurements
            3. 8.3.1.1.1.3 Main ADC Operation Control
              1. 8.3.1.1.1.3.1 Operation Modes and Status
          2. 8.3.1.1.2 AUX ADC
            1. 8.3.1.1.2.1 AUX Voltage Measurements
              1. 8.3.1.1.2.1.1 AUX Analog Front End
              2. 8.3.1.1.2.1.2 AUX Channel Measurements
            2. 8.3.1.1.2.2 AUX Temperature Measurements
              1. 8.3.1.1.2.2.1 DieTemp2 Measurement
              2. 8.3.1.1.2.2.2 AUX GPIO Measurements
            3. 8.3.1.1.2.3 MISC Measurements
            4. 8.3.1.1.2.4 AUX ADC Operation Control
          3. 8.3.1.1.3 Synchronization Between MAIN and AUX ADC Measurements
        2. 8.3.1.2 Current Sense ADC
      2. 8.3.2 OVUV Detection
        1. 8.3.2.1 OVUV Operation Modes
        2. 8.3.2.2 OVUV Control and Status
          1. 8.3.2.2.1 OVUV Control
          2. 8.3.2.2.2 OVUV Status
      3. 8.3.3 Power Supplies
        1. 8.3.3.1 AVAO_REF and AVDD_REF
        2. 8.3.3.2 LDOIN
        3. 8.3.3.3 AVDD
        4. 8.3.3.4 DVDD
        5. 8.3.3.5 CVDD and NEG5V
        6. 8.3.3.6 TSREF
      4. 8.3.4 GPIO Configuration
      5. 8.3.5 Communication, OTP, Diagnostic Control
        1. 8.3.5.1 Communication
          1. 8.3.5.1.1 Serial Interface
            1. 8.3.5.1.1.1 UART Physical Layer
              1. 8.3.5.1.1.1.1 UART Transmitter
              2. 8.3.5.1.1.1.2 UART Receiver
              3. 8.3.5.1.1.1.3 COMM CLEAR
            2. 8.3.5.1.1.2 Command and Response Protocol
              1. 8.3.5.1.1.2.1 Transaction Frame Structure
                1. 8.3.5.1.1.2.1.1 Frame Initialization Byte
                2. 8.3.5.1.1.2.1.2 Device Address Byte
                3. 8.3.5.1.1.2.1.3 Register Address Bytes
                4. 8.3.5.1.1.2.1.4 Data Bytes
                5. 8.3.5.1.1.2.1.5 CRC Bytes
                6. 8.3.5.1.1.2.1.6 Calculating Frame CRC Value
                7. 8.3.5.1.1.2.1.7 Verifying Frame CRC
              2. 8.3.5.1.1.2.2 Transaction Frame Examples
                1. 8.3.5.1.1.2.2.1 Single Device Read/Write
                2. 8.3.5.1.1.2.2.2 Stack Read/Write
                3. 8.3.5.1.1.2.2.3 Broadcast Read/Write
                4. 8.3.5.1.1.2.2.4 Broadcast Write Reverse Direction
          2. 8.3.5.1.2 Daisy-Chain Interface
            1. 8.3.5.1.2.1 Daisy-Chain Transmitter and Receiver Functionality
            2. 8.3.5.1.2.2 Daisy-Chain Protocol
          3. 8.3.5.1.3 Start Communication
            1. 8.3.5.1.3.1 Identify Base and Stack
            2. 8.3.5.1.3.2 Auto-Addressing
              1. 8.3.5.1.3.2.1 Setting Up the Device Addresses
              2. 8.3.5.1.3.2.2 Setting Up COMM_CTRL[STACK_DEV] and [TOP_STACK]
              3. 8.3.5.1.3.2.3 Storing Device Address to OTP
            3. 8.3.5.1.3.3 Synchronize Daisy-Chain DLL
            4. 8.3.5.1.3.4 Ring Communication
          4. 8.3.5.1.4 Communication Timeout
            1. 8.3.5.1.4.1 Short Communication Timeout
            2. 8.3.5.1.4.2 Long Communication Timeout
          5. 8.3.5.1.5 Communication Debug Mode
          6. 8.3.5.1.6 Multidrop Configuration
          7. 8.3.5.1.7 SPI Master
          8. 8.3.5.1.8 SPI Loopback
        2. 8.3.5.2 Fault Handling
          1. 8.3.5.2.1 Fault Status Hierarchy
            1. 8.3.5.2.1.1 Debug Registers
          2. 8.3.5.2.2 Fault Masking and Reset
            1. 8.3.5.2.2.1 Fault Masking
            2. 8.3.5.2.2.2 Fault Reset
          3. 8.3.5.2.3 Fault Signaling
            1. 8.3.5.2.3.1 Fault Status Transmitting in ACTIVE Mode
            2. 8.3.5.2.3.2 Fault Status Transmitting in SLEEP Mode
            3. 8.3.5.2.3.3 Heartbeat and Fault Tone
        3. 8.3.5.3 Nonvolatile Memory
          1. 8.3.5.3.1 OTP Page Status
          2. 8.3.5.3.2 OTP Programming
        4. 8.3.5.4 Diagnostic Control/Status
          1. 8.3.5.4.1 Power Supplies Check
            1. 8.3.5.4.1.1 Power Supply Diagnostic Check
            2. 8.3.5.4.1.2 Power Supply BIST
          2. 8.3.5.4.2 Thermal Shutdown and Warning Check
            1. 8.3.5.4.2.1 Thermal Shutdown
            2. 8.3.5.4.2.2 Thermal Warning
          3. 8.3.5.4.3 Oscillators Watchdog
          4. 8.3.5.4.4 OTP Error Check
            1. 8.3.5.4.4.1 OTP CRC Test and Faults
            2. 8.3.5.4.4.2 OTP Margin Read
            3. 8.3.5.4.4.3 Error Check and Correct (ECC) OTP
          5. 8.3.5.4.5 OVUV Detection Check
            1. 8.3.5.4.5.1 Parity Check
            2. 8.3.5.4.5.2 OVUV DAC Check
            3. 8.3.5.4.5.3 OVUV Protector BIST
          6. 8.3.5.4.6 Diagnostic Through ADC Comparison
            1. 8.3.5.4.6.1 VS Voltage Measurement Check
            2. 8.3.5.4.6.2 Temperature Measurement Check
            3. 8.3.5.4.6.3 VS and AUX Open Wire Check
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power Modes
        1. 8.4.1.1 SHUTDOWN Mode
          1. 8.4.1.1.1 Exit SHUTDOWN Mode
          2. 8.4.1.1.2 Enter SHUTDOWN Mode
        2. 8.4.1.2 SLEEP Mode
          1. 8.4.1.2.1 Exit SLEEP Mode
          2. 8.4.1.2.2 Enter SLEEP Mode
        3. 8.4.1.3 ACTIVE Mode
          1. 8.4.1.3.1 Exit ACTIVE Mode
          2. 8.4.1.3.2 Enter ACTIVE Mode From SHUTDOWN Mode
          3. 8.4.1.3.3 Enter ACTIVE Mode From SLEEP Mode
      2. 8.4.2 Device Reset
      3. 8.4.3 Ping and Tone
        1. 8.4.3.1 Ping
        2. 8.4.3.2 Tone
        3. 8.4.3.3 Ping and Tone Propagation
    5. 8.5 Register Maps
      1. 8.5.1 OTP Shadow Register Summary
      2. 8.5.2 Read/Write Register Summary
      3. 8.5.3 Read-Only Register Summary
      4. 8.5.4 Register Field Descriptions
        1. 8.5.4.1  Device Addressing Setup
          1. 8.5.4.1.1 DIR0_ADDR_OTP
          2. 8.5.4.1.2 DIR1_ADDR_OTP
          3. 8.5.4.1.3 CUST_MISC1 through CUST_MISC8
          4. 8.5.4.1.4 DIR0_ADDR
          5. 8.5.4.1.5 DIR1_ADDR
        2. 8.5.4.2  Device ID and Scratch Pad
          1. 8.5.4.2.1 PARTID
          2. 8.5.4.2.2 DEV_REVID
          3. 8.5.4.2.3 DIE_ID1 through DIE_ID9
        3. 8.5.4.3  General Configuration and Control
          1. 8.5.4.3.1  DEV_CONF
          2. 8.5.4.3.2  PWR_TRANSIT_CONF
          3. 8.5.4.3.3  COMM_TIMEOUT_CONF
          4. 8.5.4.3.4  TX_HOLD_OFF
          5. 8.5.4.3.5  STACK_RESPONSE
          6. 8.5.4.3.6  COMM_CTRL
          7. 8.5.4.3.7  CONTROL1
          8. 8.5.4.3.8  CONTROL2
          9. 8.5.4.3.9  CUST_CRC_HI
          10. 8.5.4.3.10 CUST_CRC_LO
          11. 8.5.4.3.11 CUST_CRC_RSLT_HI
          12. 8.5.4.3.12 CUST_CRC_RSLT_LO
        4. 8.5.4.4  Operation Status
          1. 8.5.4.4.1 DIAG_STAT
          2. 8.5.4.4.2 ADC_STAT1
          3. 8.5.4.4.3 ADC_STAT2
          4. 8.5.4.4.4 GPIO_STAT
          5. 8.5.4.4.5 DEV_STAT
        5. 8.5.4.5  ADC Configuration and Control
          1. 8.5.4.5.1  ADC_CONF1
          2. 8.5.4.5.2  ADC_CONF2
          3. 8.5.4.5.3  MAIN_ADC_CAL1
          4. 8.5.4.5.4  MAIN_ADC_CAL2
          5. 8.5.4.5.5  AUX_ADC_CAL1
          6. 8.5.4.5.6  AUX_ADC_CAL2
          7. 8.5.4.5.7  CS_ADC_CAL1
          8. 8.5.4.5.8  CS_ADC_CAL2
          9. 8.5.4.5.9  ADC_CTRL1
          10. 8.5.4.5.10 ADC_CTRL2
          11. 8.5.4.5.11 ADC_CTRL3
        6. 8.5.4.6  ADC Measurement Results
          1. 8.5.4.6.1  VS16_HI/LO
          2. 8.5.4.6.2  VS15_HI/LO
          3. 8.5.4.6.3  VS14_HI/LO
          4. 8.5.4.6.4  VS13_HI/LO
          5. 8.5.4.6.5  VS12_HI/LO
          6. 8.5.4.6.6  VS11_HI/LO
          7. 8.5.4.6.7  VS10_HI/LO
          8. 8.5.4.6.8  VS9_HI/LO
          9. 8.5.4.6.9  VS8_HI/LO
          10. 8.5.4.6.10 VS7_HI/LO
          11. 8.5.4.6.11 VS6_HI/LO
          12. 8.5.4.6.12 VS5_HI/LO
          13. 8.5.4.6.13 VS4_HI/LO
          14. 8.5.4.6.14 VS3_HI/LO
          15. 8.5.4.6.15 VS2_HI/LO
          16. 8.5.4.6.16 VS1_HI/LO
          17. 8.5.4.6.17 CSAUX_HI/LO
          18. 8.5.4.6.18 TSREF_HI/LO
          19. 8.5.4.6.19 GPIO1_HI/LO
          20. 8.5.4.6.20 GPIO2_HI/LO
          21. 8.5.4.6.21 GPIO3_HI/LO
          22. 8.5.4.6.22 GPIO4_HI/LO
          23. 8.5.4.6.23 GPIO5_HI/LO
          24. 8.5.4.6.24 GPIO6_HI/LO
          25. 8.5.4.6.25 GPIO7_HI/LO
          26. 8.5.4.6.26 GPIO8_HI/LO
          27. 8.5.4.6.27 DIETEMP1_HI/LO
          28. 8.5.4.6.28 DIETEMP2_HI/LO
          29. 8.5.4.6.29 AUX_IN_HI/LO
          30. 8.5.4.6.30 AUX_GPIO_HI/LO
          31. 8.5.4.6.31 AUX_PWR_HI/LO
          32. 8.5.4.6.32 AUX_REFL_HI/LO
          33. 8.5.4.6.33 AUX_VBG2_HI/LO
          34. 8.5.4.6.34 AUX_AVAO_REF_HI/LO
          35. 8.5.4.6.35 AUX_AVDD_REF_HI/LO
          36. 8.5.4.6.36 AUX_OV_DAC_HI/LO
          37. 8.5.4.6.37 AUX_UV_DAC_HI/LO
          38. 8.5.4.6.38 AUX_VCM1_HI/LO
          39. 8.5.4.6.39 REFH_HI/LO
          40. 8.5.4.6.40 DIAG_MAIN_HI/LO
          41. 8.5.4.6.41 DIAG_AUX_HI/LO
          42. 8.5.4.6.42 CURRENT_HI/MID/LO
        7. 8.5.4.7  Protector Configuration and Control
          1. 8.5.4.7.1 OV_THRESH
          2. 8.5.4.7.2 UV_THRESH
          3. 8.5.4.7.3 UV_DISABLE1
          4. 8.5.4.7.4 UV_DISABLE2
          5. 8.5.4.7.5 OVUV_CTRL
        8. 8.5.4.8  GPIO Configuration
          1. 8.5.4.8.1 GPIO_CONF1
          2. 8.5.4.8.2 GPIO_CONF2
          3. 8.5.4.8.3 GPIO_CONF3
          4. 8.5.4.8.4 GPIO_CONF4
        9. 8.5.4.9  SPI Master
          1. 8.5.4.9.1 SPI_CONF
          2. 8.5.4.9.2 SPI_EXE
          3. 8.5.4.9.3 SPI_TX3, SPI_TX2, and SPI_TX1
          4. 8.5.4.9.4 SPI_RX3, SPI_RX2, and SPI_RX1
        10. 8.5.4.10 Diagnostic Control
          1. 8.5.4.10.1 DIAG_OTP_CTRL
          2. 8.5.4.10.2 DIAG_COMM_CTRL
          3. 8.5.4.10.3 DIAG_PWR_CTRL
          4. 8.5.4.10.4 DIAG_COMP_CTRL1
          5. 8.5.4.10.5 DIAG_COMP_CTRL2
          6. 8.5.4.10.6 DIAG_COMP_CTRL3
          7. 8.5.4.10.7 DIAG_COMP_CTRL4
          8. 8.5.4.10.8 DIAG_PROT_CTRL
        11. 8.5.4.11 Fault Configuration and Reset
          1. 8.5.4.11.1 FAULT_MSK1
          2. 8.5.4.11.2 FAULT_MSK2
          3. 8.5.4.11.3 FAULT_RST1
          4. 8.5.4.11.4 FAULT_RST2
        12. 8.5.4.12 Fault Status
          1. 8.5.4.12.1  FAULT_SUMMARY
          2. 8.5.4.12.2  FAULT_COMM1
          3. 8.5.4.12.3  FAULT_COMM2
          4. 8.5.4.12.4  FAULT_COMM3
          5. 8.5.4.12.5  FAULT_OTP
          6. 8.5.4.12.6  FAULT_SYS
          7. 8.5.4.12.7  FAULT_PROT1
          8. 8.5.4.12.8  FAULT_PROT2
          9. 8.5.4.12.9  FAULT_OV1
          10. 8.5.4.12.10 FAULT_OV2
          11. 8.5.4.12.11 FAULT_UV1
          12. 8.5.4.12.12 FAULT_UV2
          13. 8.5.4.12.13 FAULT_COMP_GPIO
          14. 8.5.4.12.14 FAULT_COMP_VSAUX1
          15. 8.5.4.12.15 FAULT_COMP_VSAUX2
          16. 8.5.4.12.16 FAULT_COMP_VSOW1
          17. 8.5.4.12.17 FAULT_COMP_VSOW2
          18. 8.5.4.12.18 FAULT_COMP_AUXOW1
          19. 8.5.4.12.19 FAULT_COMP_AUXOW2
          20. 8.5.4.12.20 FAULT_COMP_MISC
          21. 8.5.4.12.21 FAULT_PWR1
          22. 8.5.4.12.22 FAULT_PWR2
          23. 8.5.4.12.23 FAULT_PWR3
        13. 8.5.4.13 Debug Control and Status
          1. 8.5.4.13.1  DEBUG_CTRL_UNLOCK
          2. 8.5.4.13.2  DEBUG_COMM_CTRL1
          3. 8.5.4.13.3  DEBUG_COMM_CTRL2
          4. 8.5.4.13.4  DEBUG_COMM_STAT
          5. 8.5.4.13.5  DEBUG_UART_RC
          6. 8.5.4.13.6  DEBUG_UART_RR_TR
          7. 8.5.4.13.7  DEBUG_COMH_BIT
          8. 8.5.4.13.8  DEBUG_COMH_RC
          9. 8.5.4.13.9  DEBUG_COMH_RR_TR
          10. 8.5.4.13.10 DEBUG_COML_BIT
          11. 8.5.4.13.11 DEBUG_COML_RC
          12. 8.5.4.13.12 DEBUG_COML_RR_TR
          13. 8.5.4.13.13 DEBUG_UART_DISCARD
          14. 8.5.4.13.14 DEBUG_COMH_DISCARD
          15. 8.5.4.13.15 DEBUG_COML_DISCARD
          16. 8.5.4.13.16 DEBUG_UART_VALID_HI/LO
          17. 8.5.4.13.17 DEBUG_COMH_VALID_HI/LO
          18. 8.5.4.13.18 DEBUG_COML_VALID_HI/LO
          19. 8.5.4.13.19 DEBUG_OTP_SEC_BLK
          20. 8.5.4.13.20 DEBUG_OTP_DED_BLK
        14. 8.5.4.14 OTP Programming Control and Status
          1. 8.5.4.14.1 OTP_PROG_UNLOCK1A through OTP_PROG_UNLOCK1D
          2. 8.5.4.14.2 OTP_PROG_UNLOCK2A through OTP_PROG_UNLOCK2D
          3. 8.5.4.14.3 OTP_PROG_CTRL
          4. 8.5.4.14.4 OTP_ECC_TEST
          5. 8.5.4.14.5 OTP_ECC_DATAIN1 through OTP_ECC_DATAIN9
          6. 8.5.4.14.6 OTP_ECC_DATAOUT1 through OTP_ECC_DATAOUT9
          7. 8.5.4.14.7 OTP_PROG_STAT
          8. 8.5.4.14.8 OTP_CUST1_STAT
          9. 8.5.4.14.9 OTP_CUST2_STAT
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Base Device Application Circuit
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1  PACK+ and FUSE Measurement
          2. 9.2.1.2.2  Insulation Measurement
          3. 9.2.1.2.3  LINK+/- Measurement
          4. 9.2.1.2.4  CHARGE+/– Measurement
          5. 9.2.1.2.5  Overcurrent Detection Scheme Using OVUV Comparators
          6. 9.2.1.2.6  Unused Pins
          7. 9.2.1.2.7  Current Sense Input
          8. 9.2.1.2.8  VPWR and External NPN
          9. 9.2.1.2.9  Power Supplies, Reference Input
          10. 9.2.1.2.10 GPIO For Thermistor Inputs
          11. 9.2.1.2.11 UART, NFAULT
          12. 9.2.1.2.12 Daisy-Chain Isolation
            1. 9.2.1.2.12.1 Devices Connected on the Same PCB
            2. 9.2.1.2.12.2 Devices Connected on Different PCBs
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Daisy Device Application Circuit
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Ground Planes
      2. 11.1.2 Bypass Capacitors for Power Supplies and Reference
      3. 11.1.3 Voltage Sensing
      4. 11.1.4 Daisy-Chain Communication
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 第三方米6体育平台手机版_好二三四免责声明
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 静电放电警告
    6. 12.6 术语表
  14. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息
Stack Read/Write

Stack Read:

The device address, COMM_CTRL[STACK_DEV] bit and [TOP_STACK] bit must be configured before using this command. A stack read command generates a number of response frames depending on the number of devices in the stack (that is, device with COMM_CTRL[STACK_DEV] = 1), whose length depends on the requested number of register bytes read. The stack read command frame must contain the register address to start at (address field) and the number of bytes to return (number of registers to read). The DATA_SIZE field in the initialization byte for the read command is always 0b000.

The command frame travels to all devices in the daisy-chain, but only the device with COMM_CTRL[STACK_DEV] = 1 will respond. During the response, the device with COMM_CTRL[TOP_STACK] = 1 will return the response frame first. Each device (address N) in the stack waits until the device above (address N+1) responds before appending its response frame. The CRC is validated while receiving the responses. If a CRC error occurs in the response frame from address N+1, device N does not append its message and an invalid CRC fault is generated.

Use Figure 8-22 with the example of using reading 16 VS voltages from S1 to S3. The response to this command is three separate response frames (one response frame per device), each frame with a total length of 38 bytes (32 data bytes + 6 protocol bytes). Although the stack read command does not contain the device address field, each response frame will contain the corresponding device address field associating the data to a particular device. The host will receive a response frame from S3 first (ToS), following with a response frame from S2, and finally the response frame from S1.

Stack Write:

The COMM_CTRL[STACK_DEV] must be configured before using this command. A stack write command enables the host to update up to eight consecutive registers for the stack devices (that is, device with COMM_CTRL[STACK_DEV] = 1) with one command. The command frame must contain the register address to start at (address field) and the data bytes to write to the registers. The DATA_SIZE field in the initialization frame is the number of registers to update.

The command frame travels to all devices in the daisy-chain, but only the device with COMM_CTRL[STACK_DEV] = 1 will execute the command.

GUID-8AA5947B-DD54-4B4C-8072-83F66157DEB3-low.gifFigure 8-22 Stack Read/Write
Table 8-15 Stack Read/Write
Stack Read Command Sent by HostStack Write Command Sent by Host
ExampleRead 16 VS Voltages from S1 to S3Write OTP Unlock Code to OTP_PROG_UNLOCK1A to 1D Registers to S1, S2, and S3
Frame FieldDataCommentsDataComments
Initialization Byte0xA0Always 0xA0
FRAME_TYPE = 1
REQ_TYPE = 0b010 = Stack Read
DATA_SIZE = 0b000
0xB30xB0 for 1 byte data read, 0xB1 for 2 bytes data read, 0xB2 for 3 bytes data read, and so on.
For this example:
FRAME_TYPE = 1
REQ_TYPE = 0b011= Stack Write
DATA_SIZE = 0b011 = 4 bytes
Device AddressN/ANo need to include the device address byte in command frameN/ANo need to include the device address byte in command frame
Register Address0x0568Start address of the register block to read (address of VS16_HI in this example)0x0300Start address of the register block to write (address of OTP_PROG_UNLOCK1A in this example)
Data0x1FInstruct each device to return 32 bytes of data (that is, from address 0x0568 to 0x0587), assuming each VSn_HI = 0x80, VSn_LO = 0x00, where n = 1 to 16.0x02B7 78BCThe unlock value to OTP_PROG_UNLOCK1A to OTP_PROG_UNLOCK1D
CRC0x5C2D0x0BD7