ZHCSJJ0C August   2000  – March 2024 BUF634

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: TO-220 and TO-263 Packages
    6. 6.6 Electrical Characteristics: Wide-Bandwidth Mode for SOIC Package
    7. 6.7 Electrical Characteristics: Low-Quiescent-Current Mode for SOIC Package
    8. 6.8 Typical Characteristics: TO-220 and TO-263 Packages
    9. 6.9 Typical Characteristics: SOIC Package
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Current
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 High Frequency Applications
    2. 8.2 Typical Application
      1. 8.2.1 Boosting Op Amp Output Current
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Power Dissipation
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 TINA-TI™ 仿真软件(免费下载)
        2. 9.1.1.2 TI 参考设计
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 接收文档更新通知
    4. 9.4 支持资源
    5. 9.5 Trademarks
    6. 9.6 静电放电警告
    7. 9.7 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

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订购信息

Typical Characteristics: TO-220 and TO-263 Packages

at TA = 25°C, VS = ±15 V (unless otherwise noted)

GUID-45CE0B9E-75F4-4E7D-883A-674EB9D3B1DB-low.gif
 
Figure 6-1 Gain and Phase vs Frequency vs Quiescent Current
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Figure 6-3 Gain and Phase vs Frequency vs Source Resistance
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Figure 6-5 Gain and Phase vs Frequency vs Load Capacitance
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Figure 6-7 Gain and Phase vs Frequency vs Power Supply Voltage
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Figure 6-9 Quiescent Current vs Bandwidth Control Resistance
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Figure 6-11 Quiescent Current vs Temperature
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Figure 6-13 Output Voltage Swing vs Output Current
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Figure 6-15 Maximum Power Dissipation vs Temperature
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RS = 50 Ω, RL = 100 Ω
Figure 6-17 Small-Signal Response
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Figure 6-2 Gain and Phase vs Frequency vs Temperature
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Figure 6-4 Gain and Phase vs Frequency vs Load Resistance
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Figure 6-6 Gain and Phase vs Frequency vs Load Capacitance
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Figure 6-8 Power Supply Rejection vs Frequency
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Figure 6-10 Short-Circuit Current vs Temperature
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Figure 6-12 Quiescent Current vs Temperature
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Figure 6-14 Output Voltage Swing vs Output Current
GUID-3FB2AFA8-060E-4DE3-9E91-66F26BAA9F04-low.gif
 
Figure 6-16 Maximum Power Dissipation vs Temperature
GUID-6AFD7D36-BFF2-408F-BDE7-A3D85B29C651-low.gif
RS = 50 Ω, RL = 100 Ω
Figure 6-18 Large-Signal Response