ZHCSJJ0C August 2000 – March 2024 BUF634
PRODUCTION DATA
- 1
- 1 特性
- 2 应用
- 3 说明
- 4 Device Comparison Table
- 5 Pin Configuration and Functions
-
6 Specifications
- 6.1 Absolute Maximum Ratings
- 6.2 ESD Ratings
- 6.3 Recommended Operating Conditions
- 6.4 Thermal Information
- 6.5 Electrical Characteristics: TO-220 and TO-263 Packages
- 6.6 Electrical Characteristics: Wide-Bandwidth Mode for SOIC Package
- 6.7 Electrical Characteristics: Low-Quiescent-Current Mode for SOIC Package
- 6.8 Typical Characteristics: TO-220 and TO-263 Packages
- 6.9 Typical Characteristics: SOIC Package
- 7 Detailed Description
- 8 Application and Implementation
- 9 Device and Documentation Support
- 10Revision History
- 11Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
- KTT|5
订购信息
8.2.1 Boosting Op Amp Output Current
The BUF634 device can be connected inside the feedback loop of most op amps to increase output current (see Figure 8-6). When connected inside the feedback loop, the offset voltage of the BUF634 device and other errors are corrected by the feedback of the op amp.
Figure 8-6 Boosting Op Amp Output Current