ZHCSJJ0C August   2000  – March 2024 BUF634

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: TO-220 and TO-263 Packages
    6. 6.6 Electrical Characteristics: Wide-Bandwidth Mode for SOIC Package
    7. 6.7 Electrical Characteristics: Low-Quiescent-Current Mode for SOIC Package
    8. 6.8 Typical Characteristics: TO-220 and TO-263 Packages
    9. 6.9 Typical Characteristics: SOIC Package
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Current
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 High Frequency Applications
    2. 8.2 Typical Application
      1. 8.2.1 Boosting Op Amp Output Current
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Power Dissipation
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 TINA-TI™ 仿真软件(免费下载)
        2. 9.1.1.2 TI 参考设计
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 接收文档更新通知
    4. 9.4 支持资源
    5. 9.5 Trademarks
    6. 9.6 静电放电警告
    7. 9.7 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Electrical Characteristics: Wide-Bandwidth Mode for SOIC Package

at TA = 25°C, VS = ±15 V, BW pin connected to V–, and RL = 100 Ω connected to mid-supply (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
AC PERFORMANCE
BW Bandwidth, –3 dB R= 1 kΩ 210 MHz
R= 100 Ω 200
Bandwidth for 0.1-dB flatness VO = 10 mVPP, R= 100 Ω, RS = 50 Ω 50 MHz
SR Slew rate V= 20-V step, VIN-SR = 4000 V/µs 3750 V/µs
Rise and fall time VO = 200-mV step 1.3 ns
Settling time to 0.1% VO = 20-V step, VIN-SR = 2500 V/µs 90 ns
Settling time to 1% VO = 20-V step, VIN-SR = 2500 V/µs 20 ns
en Voltage noise f = 1 kHz 3.4 nV/√Hz
in Current noise f = 100 kHz 0.85 pA/√Hz
HD2 2nd-harmonic distortion VO = 2 VPP, f = 20 kHz –77 dBc
VO = 10 VPP, f = 20 kHz –69
HD3 3rd-harmonic distortion VO = 2 VPP, f = 20 kHz –77 dBc
VO = 10 VPP, f = 20 kHz –56
DC PERFORMANCE
VOS Input offset voltage TA = 25℃ 36 65 mV
Input offset voltage drift(1) TA = –40℃ to 125℃ 175 µV/℃
IB Input bias current VIN = 0 V 0.25 2 µA
G Gain V= ±10 V, R= 1 kΩ 0.95 0.99 V/V
V= ±10 V, R= 100 Ω 0.93 0.95
V= ±10 V, R= 67 Ω 0.91 0.93
INPUT
Linear input voltage range RL = 1 kΩ, IB < 10 µA –13 13 V
ZIN Input impedance R= 100 Ω 180 || 5 MΩ || pF
OUTPUT
Output headroom to supplies I= ±10 mA 1.6 1.8 V
I= ±100 mA 2.0 2.2
I= ±150 mA 2.2 2.5
IO Current output, continuous ±250 mA
ISC Short-circuit current ±375 ±550 mA
ZO Output impedance DC, I= 10 mA 5 Ω
POWER SUPPLY
VS Operating voltage range ±2.25 ±18 V
IQ Quiescent current I= 0 mA 8.5 12 mA
PSRR Power-supply rejection ratio V= ±2.25 V to ±18 V 64 75 dB
THERMAL SHUTDOWN
Thermal shutdown temperature 180
Based on electrical characterization over temperature of 35 devices.