SWRS037B January   2006  – March 2015 CC1150

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Terminal Configuration and Functions
    1. 3.1 Pin Attributes
  4. 4Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Recommended Operating Conditions
    4. 4.4  General Characteristics
    5. 4.5  Current Consumption
    6. 4.6  RF Transmit
    7. 4.7  Crystal Oscillator
    8. 4.8  Frequency Synthesizer Characteristics
    9. 4.9  Analog Temperature Sensor
    10. 4.10 DC Characteristics
    11. 4.11 Power-On Reset
    12. 4.12 Thermal Resistance Characteristics for VQFNP Package
  5. 5Detailed Description
    1. 5.1  Overview
    2. 5.2  Functional Block Diagram
    3. 5.3  Configuration Overview
    4. 5.4  Configuration Software
    5. 5.5  4-wire Serial Configuration and Data Interface
      1. 5.5.1 Chip Status Byte
      2. 5.5.2 Register Access
      3. 5.5.3 SPI Read
      4. 5.5.4 Command Strobes
      5. 5.5.5 FIFO Access
      6. 5.5.6 PATABLE Access
    6. 5.6  Microcontroller Interface and Pin Configuration
      1. 5.6.1 Configuration Interface
      2. 5.6.2 General Control and Status Pins
      3. 5.6.3 Optional Radio Control Feature
    7. 5.7  Data Rate Programming
    8. 5.8  Packet Handling Hardware Support
      1. 5.8.1 Data Whitening
      2. 5.8.2 Packet Format
        1. 5.8.2.1 Arbitrary Length Field Configuration
      3. 5.8.3 Packet Handling in Transmit Mode
      4. 5.8.4 Packet Handling in Firmware
    9. 5.9  Modulation Formats
      1. 5.9.1 Frequency Shift Keying
      2. 5.9.2 Minimum Shift Keying
      3. 5.9.3 Amplitude Modulation
    10. 5.10 Forward Error Correction with Interleaving
      1. 5.10.1 Forward Error Correction (FEC)
      2. 5.10.2 Interleaving
    11. 5.11 Radio Control
      1. 5.11.1 Power On Start-up Sequence
        1. 5.11.1.1 Automatic POR
        2. 5.11.1.2 Manual Reset
      2. 5.11.2 Crystal Control
      3. 5.11.3 Voltage Regulator Control
      4. 5.11.4 Active Mode
      5. 5.11.5 Timing
    12. 5.12 Data FIFO
    13. 5.13 Frequency Programming
    14. 5.14 VCO
      1. 5.14.1 VCO and PLL Self-Calibration
    15. 5.15 Voltage Regulators
    16. 5.16 Output Power Programming
      1. 5.16.1 Shaping and PA Ramping
    17. 5.17 General Purpose and Test Output Control Pins
    18. 5.18 Asynchronous and Synchronous Serial Operation
      1. 5.18.1 Asynchronous Serial Operation
      2. 5.18.2 Synchronous Serial Operation
    19. 5.19 System Considerations and Guidelines
      1. 5.19.1 SRD Regulations
      2. 5.19.2 Frequency Hopping and Multi-Channel Systems
      3. 5.19.3 Wideband Modulation Not Using Spread Spectrum
      4. 5.19.4 Data Burst Transmissions
      5. 5.19.5 Continuous Transmissions
      6. 5.19.6 Low-Cost Systems
      7. 5.19.7 Battery-Operated Systems
      8. 5.19.8 Increasing Output Power
    20. 5.20 Memory
      1. 5.20.1 Configuration Register Details
      2. 5.20.2 Status Register Details
  6. 6Applications, Implementation, and Layout
    1. 6.1 Application Information
      1. 6.1.1 Typical Application
    2. 6.2 Design Requirements
      1. 6.2.1 Bias Resistor
      2. 6.2.2 Balun and RF Matching
      3. 6.2.3 Crystal
      4. 6.2.4 Reference Signal
      5. 6.2.5 Additional Filtering
      6. 6.2.6 Power Supply Decoupling
    3. 6.3 PCB Layout Recommendations
      1. 6.3.1 Package Description (QLP 16)
  7. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Device Nomenclature
    2. 7.2 Documentation Support
      1. 7.2.1 Community Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Export Control Notice
    6. 7.6 Glossary
  8. 8Mechanical Packaging and Orderable Information
    1. 8.1 Packaging Information

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订购信息

7 Device and Documentation Support

7.1 Device Support

7.1.1 Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers. Each device has one of three prefixes: X, P, or null (no prefix) (for example, CC1150 is in production; therefore, no prefix is assigned).

Device development evolutionary flow:

    XExperimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow.
    PPrototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications.
    nullProduction version of the silicon die that is fully qualified.

Production devices have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, RGV).

For orderable part numbers of CC1150 devices in the RGV package types, see the Package Option Addendum of this document, the TI website (www.ti.com), or contact your TI sales representative.

7.2 Documentation Support

The following documents describe the CC1150 device. Copies of these documents are available on the Internet at www.ti.com.

  1. [1] CC1150EM 315 – 433 MHz Reference Design (SWRR041)
  2. [2] CC1150EM 868 – 915 MHz Reference Design (SWRR042)
  3. [3] DN012 Programming Output Power on CC1100 and CC1150 (SWRA150)
  4. [5] DN006 CC11xx Settings for FCC 15.247 Solutions (SWRA123)
  5. [6] DN017 CC11xx 868/915 MHz Matching (SWRA168)
  6. [7] AN058 Antenna Selection Guide (SWRA161)
  7. [8] CC1150 Errata Notes (SWRZ018)
  8. [9] DN501 PATABLE Access (SWRA110)
  9. [10] AN001 SRD Regulations for Licence Free Transceiver Operation (SWRA090)
  10. [11] (SmartRF Studio)
  11. [12] CC1100/CC1150DK and CC2500/CC2550DK Development Kit Examples and Libraries User Manual (SWRU109)

7.2.1 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to help developers get started with Embedded Processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices.

7.3 Trademarks

E2E is a trademark of Texas Instruments.

SmartRF is a trademark of TI.

7.4 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

7.5 Export Control Notice

Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data (as defined by the U.S., EU, and other Export Administration Regulations) including software, or any controlled product restricted by other applicable national regulations, received from disclosing party under nondisclosure obligations (if any), or any direct product of such technology, to any destination to which such export or re-export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from U.S. Department of Commerce and other competent Government authorities to the extent required by those laws.

7.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.
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