ZHCS416F August 2011 – October 2014 CC1175
PRODUCTION DATA.
- 1 器件概述
- 2修订历史记录
- 3Terminal Configuration and Functions
-
4Specifications
- 4.1 Absolute Maximum Ratings
- 4.2 Handling Ratings
- 4.3 Recommended Operating Conditions (General Characteristics)
- 4.4 Thermal Resistance Characteristics for RHB Package
- 4.5 RF Characteristics
- 4.6 Regulatory Standards
- 4.7 Current Consumption, Static Modes
- 4.8 Current Consumption, Transmit Modes
- 4.9 Transmit Parameters
- 4.10 PLL Parameters
- 4.11 Wake-up and Timing
- 4.12 High-Speed Crystal Oscillator
- 4.13 High-Speed Clock Input (TCXO)data to TCXO table
- 4.14 32-kHz Clock Input
- 4.15 Low-Speed RC Oscillator
- 4.16 I/O and Reset
- 4.17 Temperature Sensor
- 4.18 Typical Characteristics
- 5Detailed Description
- 6Typical Application Circuit
- 7器件和文档支持
- 8机械封装和可订购信息
6 Typical Application Circuit
NOTE
This section is intended only as an introduction.
Very few external components are required for the operation of the CC1175 device. Figure 6-1 shows a typical application circuit. The board layout will greatly influence the RF performance of the CC1175 device. Figure 6-1 does not show decoupling capacitors for power pins.
Figure 6-1 Typical Application Circuit
For more information, see the reference designs available for the CC1175 device in Section 7.2, Documentation Support.