ZHCSHI1H
january 2018 – november 2020
CC1312R
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Functional Block Diagram
5
Revision History
6
Device Comparison
7
Terminal Configuration and Functions
7.1
Pin Diagram – RGZ Package (Top View)
7.2
Signal Descriptions – RGZ Package
7.3
Connections for Unused Pins and Modules
8
Specifications
8.1
Absolute Maximum Ratings
8.2
ESD Ratings
8.3
Recommended Operating Conditions
8.4
Power Supply and Modules
8.5
Power Consumption - Power Modes
8.6
Power Consumption - Radio Modes
8.7
Nonvolatile (Flash) Memory Characteristics
8.8
Thermal Resistance Characteristics
8.9
RF Frequency Bands
8.10
861 MHz to 1054 MHz - Receive (RX)
8.11
861 MHz to 1054 MHz - Transmit (TX)
8.12
861 MHz to 1054 MHz - PLL Phase Noise Wideband Mode
8.13
861 MHz to 1054 MHz - PLL Phase Noise Narrowband Mode
8.14
359 MHz to 527 MHz - Receive (RX)
8.15
359 MHz to 527 MHz - Transmit (TX)
8.16
359 MHz to 527 MHz - PLL Phase Noise
8.17
143 MHz to 176 MHz - Receive (RX)
8.18
143 MHz to 176 MHz - Transmit (TX)
8.19
143 MHz to 176 MHz - PLL Phase Noise
8.20
Timing and Switching Characteristics
8.20.1
Reset Timing
8.20.2
Wakeup Timing
8.20.3
Clock Specifications
8.20.3.1
48 MHz Clock Input (TCXO)
8.20.3.2
48 MHz Crystal Oscillator (XOSC_HF)
8.20.3.3
48 MHz RC Oscillator (RCOSC_HF)
8.20.3.4
2 MHz RC Oscillator (RCOSC_MF)
8.20.3.5
32.768 kHz Crystal Oscillator (XOSC_LF)
8.20.3.6
32 kHz RC Oscillator (RCOSC_LF)
8.20.4
Synchronous Serial Interface (SSI) Characteristics
8.20.4.1
Synchronous Serial Interface (SSI) Characteristics
43
8.20.5
UART
8.20.5.1
UART Characteristics
8.21
Peripheral Characteristics
8.21.1
ADC
8.21.1.1
Analog-to-Digital Converter (ADC) Characteristics
8.21.2
DAC
8.21.2.1
Digital-to-Analog Converter (DAC) Characteristics
8.21.3
Temperature and Battery Monitor
8.21.3.1
Temperature Sensor
8.21.3.2
Battery Monitor
8.21.4
Comparators
8.21.4.1
Low-Power Clocked Comparator
8.21.4.2
Continuous Time Comparator
8.21.5
Current Source
8.21.5.1
Programmable Current Source
8.21.6
GPIO
8.21.6.1
GPIO DC Characteristics
8.22
Typical Characteristics
8.22.1
MCU Current
8.22.2
RX Current
8.22.3
TX Current
8.22.4
RX Performance
8.22.5
TX Performance
8.22.6
ADC Performance
9
Detailed Description
9.1
Overview
9.2
System CPU
9.3
Radio (RF Core)
9.3.1
Proprietary Radio Formats
9.4
Memory
9.5
Sensor Controller
9.6
Cryptography
9.7
Timers
9.8
Serial Peripherals and I/O
9.9
Battery and Temperature Monitor
9.10
µDMA
9.11
Debug
9.12
Power Management
9.13
Clock Systems
9.14
Network Processor
10
Application, Implementation, and Layout
10.1
Reference Designs
10.2
Junction Temperature Calculation
11
Device and Documentation Support
11.1
Tools and Software
11.1.1
SimpleLink™ Microcontroller Platform
11.2
Documentation Support
11.3
支持资源
11.4
Trademarks
11.5
静电放电警告
11.6
术语表
12
Mechanical, Packaging, and Orderable Information
12.1
Packaging Information
封装选项
请参考 PDF 数据表获取器件具体的封装图。
机械数据 (封装 | 引脚)
RGZ|48
散热焊盘机械数据 (封装 | 引脚)
RGZ|48
QFND031W
订购信息
zhcshi1h_oa
zhcshi1h_pm
8.22.6
ADC Performance
Figure 8-25
ENOB vs.
Input Frequency
Figure 8-26
ENOB vs.
Sampling Frequency
Figure 8-27
INL vs.
ADC Code
Figure 8-28
DNL vs.
ADC Code
Figure 8-29
ADC Accuracy vs.
Temperature
Figure 8-30
ADC Accuracy vs.
Supply Voltage (VDDS)
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