ZHCSSG0B December   2022  – April 2024 CC1314R10

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 功能方框图
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagram—RGZ Package (Top View)
    2. 6.2 Signal Descriptions—RGZ Package
    3. 6.3 Connections for Unused Pins and Modules—RGZ Package
    4. 6.4 Pin Diagram—RSK Package (Top View)
    5. 6.5 Signal Descriptions—RSK Package
    6. 6.6 Connection of Unused Pins and Module—RSK Package
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Power Supply and Modules
    5. 7.5  Power Consumption—Power Modes
    6. 7.6  Power Consumption—Radio Modes
    7. 7.7  Nonvolatile (Flash) Memory Characteristics
    8. 7.8  Thermal Resistance Characteristics
    9. 7.9  RF Frequency Bands
    10. 7.10 861MHz to 1054MHz—Receive (RX)
    11. 7.11 861MHz to 1054MHz—Transmit (TX) 
    12. 7.12 861MHz to 1054MHz - PLL Phase Noise Wideband Mode
    13. 7.13 861MHz to 1054MHz - PLL Phase Noise Narrowband Mode
    14. 7.14 Timing and Switching Characteristics
      1. 7.14.1 Reset Timing
      2. 7.14.2 Wakeup Timing
      3. 7.14.3 Clock Specifications
        1. 7.14.3.1 48MHz Clock Input (TCXO)
        2. 7.14.3.2 48MHz Crystal Oscillator (XOSC_HF)
        3. 7.14.3.3 48MHz RC Oscillator (RCOSC_HF)
        4. 7.14.3.4 2MHz RC Oscillator (RCOSC_MF)
        5. 7.14.3.5 32.768 kHz Crystal Oscillator (XOSC_LF)
        6. 7.14.3.6 32 kHz RC Oscillator (RCOSC_LF)
      4. 7.14.4 Serial Peripheral Interface (SPI) Characteristics
        1. 7.14.4.1 SPI Characteristics
        2. 7.14.4.2 SPI Master Mode
        3. 7.14.4.3 SPI Master Mode Timing Diagrams
        4. 7.14.4.4 SPI Slave Mode
        5. 7.14.4.5 SPI Slave Mode Timing Diagrams
      5. 7.14.5 UART
        1. 7.14.5.1 UART Characteristics
    15. 7.15 Peripheral Characteristics
      1. 7.15.1 ADC
        1. 7.15.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 7.15.2 DAC
        1. 7.15.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 7.15.3 Temperature and Battery Monitor
        1. 7.15.3.1 Temperature Sensor
        2. 7.15.3.2 Battery Monitor
      4. 7.15.4 Comparators
        1. 7.15.4.1 Low-Power Clocked Comparator
        2. 7.15.4.2 Continuous Time Comparator
      5. 7.15.5 Current Source
        1. 7.15.5.1 Programmable Current Source
      6. 7.15.6 GPIO
        1. 7.15.6.1 GPIO DC Characteristics
    16. 7.16 Typical Characteristics
      1. 7.16.1 MCU Current
      2. 7.16.2 RX Current
      3. 7.16.3 TX Current
      4. 7.16.4 RX Performance
      5. 7.16.5 TX Performance
      6. 7.16.6 ADC Performance
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  System CPU
    3. 8.3  Radio (RF Core)
      1. 8.3.1 Proprietary Radio Formats
    4. 8.4  Memory
    5. 8.5  Sensor Controller
    6. 8.6  Cryptography
    7. 8.7  Timers
    8. 8.8  Serial Peripherals and I/O
    9. 8.9  Battery and Temperature Monitor
    10. 8.10 µDMA
    11. 8.11 Debug
    12. 8.12 Power Management
    13. 8.13 Clock Systems
    14. 8.14 Network Processor
  10. 9 Application, Implementation, and Layout
    1. 9.1 Reference Designs
    2. 9.2 Junction Temperature Calculation
  11. 10Device and Documentation Support
    1. 10.1 Tools and Software
      1. 10.1.1 SimpleLink™ Microcontroller Platform
    2. 10.2 Documentation Support
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.2 Signal Descriptions—RGZ Package

Table 6-1 Signal Descriptions—RGZ Package
PINI/OTYPEDESCRIPTION
NAMENO.
DCDC_SW33—PowerOutput from internal DC/DC converter(1)
DCOUPL23—PowerFor decoupling of internal 1.27V regulated digital-supply (2)
DIO_16I/ODigitalGPIO
DIO_27I/ODigitalGPIO
DIO_38I/ODigitalGPIO
DIO_49I/ODigitalGPIO
DIO_510I/ODigitalGPIO, high-drive capability
DIO_611I/ODigitalGPIO, high-drive capability
DIO_712I/ODigitalGPIO, high-drive capability
DIO_814I/ODigitalGPIO
DIO_915I/ODigitalGPIO
DIO_1016I/ODigitalGPIO
DIO_1117I/ODigitalGPIO
DIO_1218I/ODigitalGPIO
DIO_1319I/ODigitalGPIO
DIO_1420I/ODigitalGPIO
DIO_1521I/ODigitalGPIO
DIO_1626I/ODigitalGPIO, JTAG_TDO, high-drive capability
DIO_1727I/ODigitalGPIO, JTAG_TDI, high-drive capability
DIO_1828I/ODigitalGPIO
DIO_1929I/ODigitalGPIO
DIO_2030I/ODigitalGPIO
DIO_2131I/ODigitalGPIO
DIO_2232I/ODigitalGPIO
DIO_2336I/ODigital or AnalogGPIO, analog capability
DIO_2437I/ODigital or AnalogGPIO, analog capability
DIO_2538I/ODigital or AnalogGPIO, analog capability
DIO_2639I/ODigital or AnalogGPIO, analog capability
DIO_2740I/ODigital or AnalogGPIO, analog capability
DIO_2841I/ODigital or AnalogGPIO, analog capability
DIO_2942I/ODigital or AnalogGPIO, analog capability
DIO_3043I/ODigital or AnalogGPIO, analog capability
EGP——GNDGround—exposed ground pad(3)
JTAG_TMSC24I/ODigitalJTAG TMSC, high-drive capability
JTAG_TCKC25IDigitalJTAG TCKC
RESET_N35IDigitalReset, active low. No internal pullup resistor
RF_P1—RFPositive RF input signal to LNA during RX
Positive RF output signal from PA during TX
RF_N2—RFNegative RF input signal to LNA during RX
Negative RF output signal from PA during TX
RX_TX3—RFOptional bias pin for the RF LNA
VDDR45—PowerInternal supply, must be powered from the internal DC/DC converter or the internal LDO(2)(4)(6)
VDDR_RF48—PowerInternal supply, must be powered from the internal DC/DC converter or the internal LDO(2)(5)(6)
VDDS44—Power1.8V to 3.8V main chip supply(1)
VDDS213—Power1.8V to 3.8V DIO supply(1)
VDDS322—Power1.8V to 3.8V DIO supply(1)
VDDS_DCDC34—Power1.8V to 3.8V DC/DC converter supply
X48M_N46—Analog48MHz crystal oscillator pin N
X48M_P47—Analog48MHz crystal oscillator pin P
X32K_Q14—Analog32kHz crystal oscillator pin 1
X32K_Q25—Analog32kHz crystal oscillator pin 2
(1) For more details, see the technical reference manual listed in Section 10.2.
(2) Do not supply external circuitry from this pin.
(3) EGP is the only ground connection for the device. A good electrical connection to the device ground on a printed circuit board (PCB) is imperative for proper device operation.
(4) If an internal DC/DC converter is not used, this pin is supplied internally from the main LDO.
(5) If an internal DC/DC converter is not used, this pin must be connected to VDDR for supply from the main LDO.
(6) Output from internal DC/DC and LDO is trimmed to 1.68V.

 
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