ZHCSSG0B
December 2022 – April 2024
CC1314R10
PRODUCTION DATA
1
1
特性
2
应用
3
说明
4
功能方框图
5
Device Comparison
6
Pin Configuration and Functions
6.1
Pin Diagram—RGZ Package (Top View)
6.2
Signal Descriptions—RGZ Package
6.3
Connections for Unused Pins and Modules—RGZ Package
6.4
Pin Diagram—RSK Package (Top View)
6.5
Signal Descriptions—RSK Package
6.6
Connection of Unused Pins and Module—RSK Package
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Power Supply and Modules
7.5
Power Consumption—Power Modes
7.6
Power Consumption—Radio Modes
7.7
Nonvolatile (Flash) Memory Characteristics
7.8
Thermal Resistance Characteristics
7.9
RF Frequency Bands
7.10
861MHz to 1054MHz—Receive (RX)
7.11
861MHz to 1054MHz—Transmit (TX)
7.12
861MHz to 1054MHz - PLL Phase Noise Wideband Mode
7.13
861MHz to 1054MHz - PLL Phase Noise Narrowband Mode
7.14
Timing and Switching Characteristics
7.14.1
Reset Timing
7.14.2
Wakeup Timing
7.14.3
Clock Specifications
7.14.3.1
48MHz Clock Input (TCXO)
7.14.3.2
48MHz Crystal Oscillator (XOSC_HF)
7.14.3.3
48MHz RC Oscillator (RCOSC_HF)
7.14.3.4
2MHz RC Oscillator (RCOSC_MF)
7.14.3.5
32.768 kHz Crystal Oscillator (XOSC_LF)
7.14.3.6
32 kHz RC Oscillator (RCOSC_LF)
7.14.4
Serial Peripheral Interface (SPI) Characteristics
7.14.4.1
SPI Characteristics
7.14.4.2
SPI Master Mode
7.14.4.3
SPI Master Mode Timing Diagrams
7.14.4.4
SPI Slave Mode
7.14.4.5
SPI Slave Mode Timing Diagrams
7.14.5
UART
7.14.5.1
UART Characteristics
7.15
Peripheral Characteristics
7.15.1
ADC
7.15.1.1
Analog-to-Digital Converter (ADC) Characteristics
7.15.2
DAC
7.15.2.1
Digital-to-Analog Converter (DAC) Characteristics
7.15.3
Temperature and Battery Monitor
7.15.3.1
Temperature Sensor
7.15.3.2
Battery Monitor
7.15.4
Comparators
7.15.4.1
Low-Power Clocked Comparator
7.15.4.2
Continuous Time Comparator
7.15.5
Current Source
7.15.5.1
Programmable Current Source
7.15.6
GPIO
7.15.6.1
GPIO DC Characteristics
7.16
Typical Characteristics
7.16.1
MCU Current
7.16.2
RX Current
7.16.3
TX Current
7.16.4
RX Performance
7.16.5
TX Performance
7.16.6
ADC Performance
8
Detailed Description
8.1
Overview
8.2
System CPU
8.3
Radio (RF Core)
8.3.1
Proprietary Radio Formats
8.4
Memory
8.5
Sensor Controller
8.6
Cryptography
8.7
Timers
8.8
Serial Peripherals and I/O
8.9
Battery and Temperature Monitor
8.10
µDMA
8.11
Debug
8.12
Power Management
8.13
Clock Systems
8.14
Network Processor
9
Application, Implementation, and Layout
9.1
Reference Designs
9.2
Junction Temperature Calculation
10
Device and Documentation Support
10.1
Tools and Software
10.1.1
SimpleLink™ Microcontroller Platform
10.2
Documentation Support
10.3
支持资源
10.4
Trademarks
10.5
静电放电警告
10.6
术语表
11
Revision History
12
Mechanical, Packaging, and Orderable Information
12.1
Packaging Information
封装选项
机械数据 (封装 | 引脚)
RSK|64
MPQF192B
RGZ|48
MPQF123F
散热焊盘机械数据 (封装 | 引脚)
RSK|64
QFND742
RGZ|48
QFND031W
订购信息
zhcssg0b_oa
7.15.3.1
Temperature Sensor
Measured on a Texas Instruments reference design with T
c
= 25°C, V
DDS
= 3.0V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Resolution
2
°C
Accuracy
-40°C to 0°C
±5.0
°C
Accuracy
0°C to 105 °C
±3.5
°C
Supply voltage coefficient
(1)
3.6
°C/V
(1)
The temperature sensor is automatically compensated for VDDS variation when using the TI-provided driver.
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