ZHCSFA6B June   2016  – July 2018 CC1350

PRODUCTION DATA.  

  1. 1器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
    4. 1.4 功能框图
  2. 2修订历史记录
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram – RSM Package
    2. 4.2 Signal Descriptions – RSM Package
    3. 4.3 Pin Diagram – RHB Package
    4. 4.4 Signal Descriptions – RHB Package
    5. 4.5 Pin Diagram – RGZ Package
    6. 4.6 Signal Descriptions – RGZ Package
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Power Consumption Summary
    5. 5.5  RF Characteristics
    6. 5.6  Receive (RX) Parameters, 861 MHz to 1054 MHz
    7. 5.7  Receive (RX) Parameters, 431 MHz to 527 MHz
    8. 5.8  Transmit (TX) Parameters, 861 MHz to 1054 MHz
    9. 5.9  Transmit (TX) Parameters, 431 MHz to 527 MHz
    10. 5.10 1-Mbps GFSK (Bluetooth low energy) – RX
    11. 5.11 1-Mbps GFSK (Bluetooth low energy) – TX
    12. 5.12 PLL Parameters
    13. 5.13 ADC Characteristics
    14. 5.14 Temperature Sensor
    15. 5.15 Battery Monitor
    16. 5.16 Continuous Time Comparator
    17. 5.17 Low-Power Clocked Comparator
    18. 5.18 Programmable Current Source
    19. 5.19 DC Characteristics
    20. 5.20 Thermal Characteristics
    21. 5.21 Timing and Switching Characteristics
      1. 5.21.1 Reset Timing
        1. Table 5-1 Reset Timing
      2. 5.21.2 Wakeup Timing
        1. Table 5-2 Wakeup Timing
      3. 5.21.3 Clock Specifications
        1. Table 5-3 24-MHz Crystal Oscillator (XOSC_HF)
        2. Table 5-4 32.768-kHz Crystal Oscillator (XOSC_LF)
        3. Table 5-5 48-MHz RC Oscillator (RCOSC_HF)
        4. Table 5-6 32-kHz RC Oscillator (RCOSC_LF)
      4. 5.21.4 Flash Memory Characteristics
        1. Table 5-7 Flash Memory Characteristics
      5. 5.21.5 Synchronous Serial Interface (SSI) Characteristics
        1. Table 5-8 Synchronous Serial Interface (SSI) Characteristics
    22. 5.22 Typical Characteristics
    23. 5.23 Typical Characteristics – Sub-1 GHz
    24. 5.24 Typical Characteristics – 2.4 GHz
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  Main CPU
    3. 6.3  RF Core
    4. 6.4  Sensor Controller
    5. 6.5  Memory
    6. 6.6  Debug
    7. 6.7  Power Management
    8. 6.8  Clock Systems
    9. 6.9  General Peripherals and Modules
    10. 6.10 Voltage Supply Domains
    11. 6.11 System Architecture
  7. 7Application, Implementation, and Layout
    1. 7.1 Application Information
    2. 7.2 TI Design or Reference Design
  8. 8器件和文档支持
    1. 8.1  器件命名规则
    2. 8.2  工具和软件
    3. 8.3  文档支持
    4. 8.4  米6体育平台手机版_好二三四 (TI) 低功耗射频网站
    5. 8.5  其他信息
    6. 8.6  社区资源
    7. 8.7  商标
    8. 8.8  静电放电警告
    9. 8.9  出口管制提示
    10. 8.10 术语表
  9. 9机械、封装和可订购信息
    1. 9.1 封装信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RSM|32
  • RGZ|48
  • RHB|32
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.4 Power Consumption Summary

Measured on the Texas Instruments CC1310EM-7XD-7793 reference design unless otherwise noted. Tc = 25°C, VDDS = 3.6 V with DC/DC enabled, unless otherwise noted. Using boost mode (increasing VDDR to 1.95 V), will increase currents in this table by 15% (does not apply to TX 14-dBm setting where this current is already included).
PARAMETER TEST CONDITIONS TYP UNIT
Icore Core current
consumption		 Reset. RESET_N pin asserted or VDDS below power-on-reset threshold 100 nA
Shutdown. No clocks running, no retention 185
Standby. With RTC, CPU, RAM, and (partial) register retention. RCOSC_LF 0.7 µA
Standby. With RTC, CPU, RAM, and (partial) register retention. XOSC_LF 0.8
Idle. Supply Systems and RAM powered. 570
Active. MCU running CoreMark at 48 MHz 1.2 mA + 25.5 µA/MHz
Active. MCU running CoreMark at 48 MHz 2.5 mA
Active. MCU running CoreMark at 24 MHz 1.9
Radio RX, measured on CC1350EM-7XD-Dual Band reference design, 868 MHz 5.4 mA
Radio RX, measured on CC1350EM-7XD-Dual Band reference design, Bluetooth low energy, 2440 MHz 6.4 mA
Radio TX, 10-dBm output power, (G)FSK, 868 MHz 13.4 mA
Radio TX, 10-dBm output power, measured on CC1350EM-7XD-DualBand reference design, 868 MHz 14.2 mA
Radio TX, OOK modulation, 10-dBm output power, AVG, 868 MHz 11.2 mA
Radio TX, boost mode (VDDR = 1.95 V), 14-dBm output power, (G)FSK, 868 MHz 23.5 mA
Radio TX, boost mode (VDDR = 1.95 V), 14-dBm output power, measured on CC1350EM-7XD-Dual Band reference design, 868 MHz 24.4 mA
Radio TX, OOK modulation, boost mode (VDDR = 1.95 V), 14-dBm, AVG, 868 MHz 14.8 mA
Radio TX Bluetooth low energy, 0-dBm output power, measured on CC1350EM-7XD-DualBand reference design, 2440 MHz 10.5 mA
Radio TX Bluetooth low energy, boost mode (VDDR = 1.95 V), 9-dBm output power, measured on CC1350EM-7XD-Dual Band reference design, 2440 MHz 22.3 mA
Radio TX, boost mode (VDDR = 1.95 V), 15-dBm output power, (G)FSK, measured on CC1310EM-7XD-4251, 433.92 MHz 25.1 mA
Radio TX, 10-dBm output power, measured on CC1310EM-7XD-4251, 433.92 MHz 13.2 mA
PERIPHERAL CURRENT CONSUMPTION
Iperi Peripheral power domain Delta current with domain enabled 20 µA
Serial power domain Delta current with domain enabled 13
RF core Delta current with power domain enabled,
clock enabled, RF core idle		 237
µDMA Delta current with clock enabled, module idle 130
Timers Delta current with clock enabled, module idle 113
I2C Delta current with clock enabled, module idle 12
I2S Delta current with clock enabled, module idle 36
SSI Delta current with clock enabled, module idle 93
UART Delta current with clock enabled, module idle 164
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