ZHCSIL5F July   2018  – February 2021 CC1352P

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Functional Block Diagram
  5. 修订历史记录
  6. Device Comparison
  7. Terminal Configuration and Functions
    1. 7.1 Pin Diagram – RGZ Package (Top View)
    2. 7.2 Signal Descriptions – RGZ Package
    3. 7.3 Connections for Unused Pins and Modules
  8. Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Supply and Modules
    5. 8.5  Power Consumption - Power Modes
    6. 8.6  Power Consumption - Radio Modes
    7. 8.7  Nonvolatile (Flash) Memory Characteristics
    8. 8.8  Thermal Resistance Characteristics
    9. 8.9  RF Frequency Bands
    10. 8.10 861 MHz to 1054 MHz - Receive (RX)
    11. 8.11 861 MHz to 1054 MHz - Transmit (TX) 
    12. 8.12 861 MHz to 1054 MHz - PLL Phase Noise Wideband Mode
    13. 8.13 861 MHz to 1054 MHz - PLL Phase Noise Narrowband Mode
    14. 8.14 359 MHz to 527 MHz - Receive (RX)
    15. 8.15 359 MHz to 527 MHz - Transmit (TX) 
    16. 8.16 359 MHz to 527 MHz - PLL Phase Noise
    17. 8.17 143 MHz to 176 MHz - Receive (RX)
    18. 8.18 143 MHz to 176 MHz  - Transmit (TX) 
    19. 8.19 143 MHz to 176 MHz - PLL Phase Noise
    20. 8.20 Bluetooth Low Energy - Receive (RX)
    21. 8.21 Bluetooth Low Energy - Transmit (TX)
    22. 8.22 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - RX
    23. 8.23 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - TX
    24. 8.24 Timing and Switching Characteristics
      1. 8.24.1 Reset Timing
      2. 8.24.2 Wakeup Timing
      3. 8.24.3 Clock Specifications
        1. 8.24.3.1 48 MHz Clock Input (TCXO)
        2. 8.24.3.2 48 MHz Crystal Oscillator (XOSC_HF)
        3. 8.24.3.3 48 MHz RC Oscillator (RCOSC_HF)
        4. 8.24.3.4 2 MHz RC Oscillator (RCOSC_MF)
        5. 8.24.3.5 32.768 kHz Crystal Oscillator (XOSC_LF)
        6. 8.24.3.6 32 kHz RC Oscillator (RCOSC_LF)
      4. 8.24.4 Synchronous Serial Interface (SSI) Characteristics
        1. 8.24.4.1 Synchronous Serial Interface (SSI) Characteristics
        2.       47
      5. 8.24.5 UART
        1. 8.24.5.1 UART Characteristics
    25. 8.25 Peripheral Characteristics
      1. 8.25.1 ADC
        1. 8.25.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 8.25.2 DAC
        1. 8.25.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 8.25.3 Temperature and Battery Monitor
        1. 8.25.3.1 Temperature Sensor
        2. 8.25.3.2 Battery Monitor
      4. 8.25.4 Comparators
        1. 8.25.4.1 Low-Power Clocked Comparator
        2. 8.25.4.2 Continuous Time Comparator
      5. 8.25.5 Current Source
        1. 8.25.5.1 Programmable Current Source
      6. 8.25.6 GPIO
        1. 8.25.6.1 GPIO DC Characteristics
    26. 8.26 Typical Characteristics
      1. 8.26.1 MCU Current
      2. 8.26.2 RX Current
      3. 8.26.3 TX Current
      4. 8.26.4 RX Performance
      5. 8.26.5 TX Performance
      6. 8.26.6 ADC Performance
  9. Detailed Description
    1. 9.1  Overview
    2. 9.2  System CPU
    3. 9.3  Radio (RF Core)
      1. 9.3.1 Proprietary Radio Formats
      2. 9.3.2 Bluetooth 5.2 Low Energy
      3. 9.3.3 802.15.4 (Thread, Zigbee, 6LoWPAN)
    4. 9.4  Memory
    5. 9.5  Sensor Controller
    6. 9.6  Cryptography
    7. 9.7  Timers
    8. 9.8  Serial Peripherals and I/O
    9. 9.9  Battery and Temperature Monitor
    10. 9.10 µDMA
    11. 9.11 Debug
    12. 9.12 Power Management
    13. 9.13 Clock Systems
    14. 9.14 Network Processor
  10. 10Application, Implementation, and Layout
    1. 10.1 Reference Designs
  11. 11Device and Documentation Support
    1. 11.1 Device Nomenclature
    2. 11.2 Tools and Software
      1. 11.2.1 SimpleLink™ Microcontroller Platform
    3. 11.3 Documentation Support
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 静电放电警告
    7. 11.7 术语表
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RGZ|48
散热焊盘机械数据 (封装 | 引脚)
订购信息

Bluetooth 5.2 Low Energy

The RF Core offers full support for Bluetooth 5.2 Low Energy, including the high-sped 2-Mbps physical layer and the 500-kbps and 125-kbps long range PHYs (Coded PHY) through the TI provided Bluetooth 5.2 stack or through a high-level Bluetooth API. The Bluetooth 5.2 PHY and part of the controller are in radio and system ROM, providing significant savings in memory usage and more space available for applications.

The new high-speed mode allows data transfers up to 2 Mbps, twice the speed of Bluetooth 4.2 and five times the speed of Bluetooth 4.0, without increasing power consumption. In addition to faster speeds, this mode offers significant improvements for energy efficiency and wireless coexistence with reduced radio communication time.

Bluetooth 5.2 also enables unparalleled flexibility for adjustment of speed and range based on application needs, which capitalizes on the high-speed or long-range modes respectively. Data transfers are now possible at 2 Mbps, enabling development of applications using voice, audio, imaging, and data logging that were not previously an option using Bluetooth low energy. With high-speed mode, existing applications deliver faster responses, richer engagement, and longer battery life. Bluetooth 5.2 enables fast, reliable firmware updates.