ZHCSSJ4B December   2022  – April 2024 CC1354R10

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 功能方框图
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagram—RGZ Package (Top View)
    2. 6.2 Signal Descriptions—RGZ Package
    3. 6.3 Connections for Unused Pins and Modules—RGZ Package
    4. 6.4 Pin Diagram—RSK Package (Top View)
    5. 6.5 Signal Descriptions—RSK Package
    6. 6.6 Connection of Unused Pins and Module—RSK Package
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Power Supply and Modules
    5. 7.5  Power Consumption—Power Modes
    6. 7.6  Power Consumption—Radio Modes
    7. 7.7  Nonvolatile (Flash) Memory Characteristics
    8. 7.8  Thermal Resistance Characteristics
    9. 7.9  RF Frequency Bands
    10. 7.10 861MHz to 1054MHz—Receive (RX)
    11. 7.11 861MHz to 1054MHz—Transmit (TX) 
    12. 7.12 861MHz to 1054MHz - PLL Phase Noise Wideband Mode
    13. 7.13 861MHz to 1054MHz - PLL Phase Noise Narrowband Mode
    14. 7.14 Bluetooth Low Energy—Receive (RX)
    15. 7.15 Bluetooth Low Energy—Transmit (TX)
    16. 7.16 Zigbee and Thread - IEEE 802.15.4-2006 2.4GHz (OQPSK DSSS1:8, 250kbps) - RX
    17. 7.17 Zigbee and Thread - IEEE 802.15.4-2006 2.4GHz (OQPSK DSSS1:8, 250kbps) - TX
    18. 7.18 Timing and Switching Characteristics
      1. 7.18.1 Reset Timing
      2. 7.18.2 Wakeup Timing
      3. 7.18.3 Clock Specifications
        1. 7.18.3.1 48MHz Clock Input (TCXO)
        2. 7.18.3.2 48MHz Crystal Oscillator (XOSC_HF)
        3. 7.18.3.3 48MHz RC Oscillator (RCOSC_HF)
        4. 7.18.3.4 2MHz RC Oscillator (RCOSC_MF)
        5. 7.18.3.5 32.768 kHz Crystal Oscillator (XOSC_LF)
        6. 7.18.3.6 32 kHz RC Oscillator (RCOSC_LF)
      4. 7.18.4 Serial Peripheral Interface (SPI) Characteristics
        1. 7.18.4.1 SPI Characteristics
        2. 7.18.4.2 SPI Master Mode
        3. 7.18.4.3 SPI Master Mode Timing Diagrams
        4. 7.18.4.4 SPI Slave Mode
        5. 7.18.4.5 SPI Slave Mode Timing Diagrams
      5. 7.18.5 UART
        1. 7.18.5.1 UART Characteristics
    19. 7.19 Peripheral Characteristics
      1. 7.19.1 ADC
        1. 7.19.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 7.19.2 DAC
        1. 7.19.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 7.19.3 Temperature and Battery Monitor
        1. 7.19.3.1 Temperature Sensor
        2. 7.19.3.2 Battery Monitor
      4. 7.19.4 Comparators
        1. 7.19.4.1 Low-Power Clocked Comparator
        2. 7.19.4.2 Continuous Time Comparator
      5. 7.19.5 Current Source
        1. 7.19.5.1 Programmable Current Source
      6. 7.19.6 GPIO
        1. 7.19.6.1 GPIO DC Characteristics
    20. 7.20 Typical Characteristics
      1. 7.20.1 MCU Current
      2. 7.20.2 RX Current
      3. 7.20.3 TX Current
      4. 7.20.4 RX Performance
      5. 7.20.5 TX Performance
      6. 7.20.6 ADC Performance
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  System CPU
    3. 8.3  Radio (RF Core)
      1. 8.3.1 Proprietary Radio Formats
      2. 8.3.2 Bluetooth 5.3 Low Energy
      3. 8.3.3 802.15.4 Thread, Zigbee, and 6LoWPAN
    4. 8.4  Memory
    5. 8.5  Sensor Controller
    6. 8.6  Cryptography
    7. 8.7  Timers
    8. 8.8  Serial Peripherals and I/O
    9. 8.9  Battery and Temperature Monitor
    10. 8.10 µDMA
    11. 8.11 Debug
    12. 8.12 Power Management
    13. 8.13 Clock Systems
    14. 8.14 Network Processor
  10. 9 Application, Implementation, and Layout
    1. 9.1 Reference Designs
    2. 9.2 Junction Temperature Calculation
  11. 10Device and Documentation Support
    1. 10.1 Tools and Software
      1. 10.1.1 SimpleLink™ Microcontroller Platform
    2. 10.2 Documentation Support
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

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7.19.1.1 Analog-to-Digital Converter (ADC) Characteristics

Tc = 25°C, VDDS = 3.0V and voltage scaling enabled, unless otherwise noted.(1)
Performance numbers require use of offset and gain adjustements in software by TI-provided ADC drivers.
 
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
Input voltage range0VDDSV
Resolution12Bits
Sample Rate200ksps
OffsetInternal 4.3V equivalent reference(2)–0.24LSB
Gain errorInternal 4.3V equivalent reference(2)7.14LSB
DNL(3)Differential nonlinearity>–1LSB
INLIntegral nonlinearity±4LSB
ENOBEffective number of bitsInternal 4.3V equivalent reference(2), 200 kSamples/s,
9.6kHz input tone 		9.8Bits
Internal 4.3V equivalent reference(2), 200 kSamples/s,
9.6kHz input tone, DC/DC enabled 		9.8
VDDS as reference, 200 kSamples/s, 9.6kHz input tone10.1
Internal reference, voltage scaling disabled,
32 samples average, 200 kSamples/s, 300Hz input tone 		11.1
Internal reference, voltage scaling disabled,
14-bit mode, 200 kSamples/s, 300Hz input tone (4) 		11.3
Internal reference, voltage scaling disabled,
15-bit mode, 200 kSamples/s, 300Hz input tone (4) 		11.6
THDTotal harmonic distortionInternal 4.3V equivalent reference(2), 200 kSamples/s,
9.6kHz input tone		–65dB
VDDS as reference, 200 kSamples/s, 9.6kHz input tone–70
Internal reference, voltage scaling disabled,
32 samples average, 200 kSamples/s, 300Hz input tone		–72
SINAD,
SNDR		Signal-to-noise
and
distortion ratio		Internal 4.3V equivalent reference(2), 200 kSamples/s,
9.6kHz input tone		60dB
VDDS as reference, 200 kSamples/s, 9.6kHz input tone63
Internal reference, voltage scaling disabled,
32 samples average, 200 kSamples/s, 300Hz input tone		68
SFDRSpurious-free dynamic rangeInternal 4.3V equivalent reference(2), 200 kSamples/s,
9.6kHz input tone		70dB
VDDS as reference, 200 kSamples/s, 9.6kHz input tone73
Internal reference, voltage scaling disabled,
32 samples average, 200 kSamples/s, 300Hz input tone		75
Conversion timeSerial conversion, time-to-output, 24MHz clock50Clock Cycles
Current consumptionInternal 4.3V equivalent reference(2)0.42mA
Current consumptionVDDS as reference0.6mA
Reference voltageEquivalent fixed internal reference (input voltage scaling enabled). For best accuracy, the ADC conversion should be initiated through the TI-RTOS API in order to include the gain/offset compensation factors stored in FCFG14.3(2)(5)V
Reference voltageFixed internal reference (input voltage scaling disabled). For best accuracy, the ADC conversion should be initiated through the TI-RTOS API in order to include the gain/offset compensation factors stored in FCFG1. This value is derived from the scaled value (4.3V) as follows:
Vref = 4.3V × 1408 / 4095		1.48V
Reference voltageVDDS as reference, input voltage scaling enabledVDDSV
Reference voltageVDDS as reference, input voltage scaling disabledVDDS / 2.82(5)V
Input impedance200 kSamples/s, voltage scaling enabled. Capacitive input, Input impedance depends on sampling frequency and sampling time>1MΩ
(1) Using IEEE Std 1241-2010 for terminology and test methods.
(2) Input signal scaled down internally before conversion, as if voltage range was 0V to 4.3V.
(3) No missing codes.
(4) ADC_output = Σ(4n samples ) >> n, n = desired extra bits.
(5) Applied voltage must be within Absolute Maximum Ratings at all times.
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