SWRS121E July   2012  – January 2016 CC2560B , CC2564

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Attributes
    2. 4.2 Connections for Unused Signals
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
      1. 5.1.1 ESD Ratings
      2. 5.1.2 Power-On Hours
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Power Consumption Summary
      1. 5.3.1 Static Current Consumption
      2. 5.3.2 Dynamic Current Consumption
        1. 5.3.2.1 Current Consumption for Different Bluetooth BR/EDR Scenarios
        2. 5.3.2.2 Current Consumption for Different LE Scenarios
    4. 5.4 Electrical Characteristics
    5. 5.5 Timing and Switching Characteristics
      1. 5.5.1 Device Power Supply
        1. 5.5.1.1 Power Sources
        2. 5.5.1.2 Device Power-Up and Power-Down Sequencing
        3. 5.5.1.3 Power Supplies and Shutdown - Static States
        4. 5.5.1.4 I/O States in Various Power Modes
        5. 5.5.1.5 nSHUTD Requirements
      2. 5.5.2 Clock Specifications
        1. 5.5.2.1 Slow Clock Requirements
        2. 5.5.2.2 External Fast Clock Crystal Requirements and Operation
        3. 5.5.2.3 Fast Clock Source Requirements (-40°C to +85°C)
      3. 5.5.3 Peripherals
        1. 5.5.3.1 UART
        2. 5.5.3.2 PCM
      4. 5.5.4 RF Performance
        1. 5.5.4.1 Bluetooth BR/EDR RF Performance
          1. 5.5.4.1.1 Bluetooth Receiver—In-Band Signals
          2. 5.5.4.1.2 Bluetooth Receiver—General Blocking
          3. 5.5.4.1.3 Bluetooth Transmitter—GFSK
          4. 5.5.4.1.4 Bluetooth Transmitter—EDR
          5. 5.5.4.1.5 Bluetooth Modulation—GFSK
          6. 5.5.4.1.6 Bluetooth Modulation—EDR
          7. 5.5.4.1.7 Bluetooth Transmitter—Out-of-Band and Spurious Emissions
        2. 5.5.4.2 Bluetooth LE RF Performance
          1. 5.5.4.2.1 BLE Receiver—In-Band Signals
          2. 5.5.4.2.2 BLE Receiver—General Blocking
          3. 5.5.4.2.3 BLE Transmitter
          4. 5.5.4.2.4 BLE Modulation
          5. 5.5.4.2.5 BLE Transceiver, Out-Of-Band and Spurious Emissions
  6. 6Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Clock Inputs
      1. 6.3.1 Slow Clock
      2. 6.3.2 Fast Clock Using External Clock Source
        1. 6.3.2.1 External FREF DC-Coupled
        2. 6.3.2.2 External FREF Sine Wave, AC-Coupled
        3. 6.3.2.3 Fast Clock Using External Crystal
    4. 6.4 Functional Blocks
      1. 6.4.1 RF
        1. 6.4.1.1 Receiver
        2. 6.4.1.2 Transmitter
      2. 6.4.2 Host Controller Interface
        1. 6.4.2.1 4-Wire UART Interface—H4 Protocol
        2. 6.4.2.2 3-Wire UART Interface—H5 Protocol (CC2560B and CC2564B Devices)
      3. 6.4.3 Digital Codec Interface
        1. 6.4.3.1 Hardware Interface
        2. 6.4.3.2 I2S
        3. 6.4.3.3 Data Format
        4. 6.4.3.4 Frame Idle Period
        5. 6.4.3.5 Clock-Edge Operation
        6. 6.4.3.6 Two-Channel Bus Example
        7. 6.4.3.7 Improved Algorithm For Lost Packets
        8. 6.4.3.8 Bluetooth and Codec Clock Mismatch Handling
      4. 6.4.4 Assisted Modes (CC2560B and CC2564B Devices)
        1. 6.4.4.1 Assisted HFP 1.6 (WBS)
        2. 6.4.4.2 Assisted A2DP
          1. 6.4.4.2.1 Assisted A2DP Sink
          2. 6.4.4.2.2 Assisted A2DP Source
    5. 6.5 Bluetooth BR/EDR Features
    6. 6.6 Bluetooth LE Description
    7. 6.7 Bluetooth Transport Layers
    8. 6.8 Changes from CC2560A and CC2564 to CC2560B and CC2564B Devices
  7. 7Applications, Implementation, and Layout
    1. 7.1 Reference Design Schematics and BOM for Power and Radio Connections
  8. 8Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
      2. 8.1.2 Device Nomenclature
    2. 8.2 Documentation Support
    3. 8.3 Related Links
    4. 8.4 Community Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 mrQFN Mechanical Data
    2. 9.2 Packaging and Ordering
      1. 9.2.1 Package and Ordering Information
      2. 9.2.2 Empty Tape Portion
      3. 9.2.3 Device Quantity and Direction
      4. 9.2.4 Insertion of Device
      5. 9.2.5 Tape Specification
      6. 9.2.6 Reel Specification
      7. 9.2.7 Packing Method
      8. 9.2.8 Packing Specification
        1. 9.2.8.1 Reel Box
        2. 9.2.8.2 Reel Box Material
        3. 9.2.8.3 Shipping Box
        4. 9.2.8.4 Shipping Box Material

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

2 Revision History

Changes from D Revision (January 2014) to E Revision

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