ZHCSEU2C February   2015  – July 2016 CC2620

PRODUCTION DATA.  

  1. 1器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
      1. 1.3.1 功能框图
  2. 2修订历史记录
  3. 3 Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram - RGZ Package
    2. 4.2 Signal Descriptions - RGZ Package
    3. 4.3 Pin Diagram - RSM Package
    4. 4.4 Signal Descriptions - RSM Package
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Power Consumption Summary
    5. 5.5  General Characteristics
    6. 5.6  IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) - RX
    7. 5.7  IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) - TX
    8. 5.8  24-MHz Crystal Oscillator (XOSC_HF)
    9. 5.9  32.768-kHz Crystal Oscillator (XOSC_LF)
    10. 5.10 48-MHz RC Oscillator (RCOSC_HF)
    11. 5.11 32-kHz RC Oscillator (RCOSC_LF)
    12. 5.12 ADC Characteristics
    13. 5.13 Temperature Sensor
    14. 5.14 Battery Monitor
    15. 5.15 Continuous Time Comparator
    16. 5.16 Low-Power Clocked Comparator
    17. 5.17 Programmable Current Source
    18. 5.18 Synchronous Serial Interface (SSI)
    19. 5.19 DC Characteristics
    20. 5.20 Thermal Resistance Characteristics
    21. 5.21 Timing Requirements
    22. 5.22 Switching Characteristics
    23. 5.23 Typical Characteristics
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  Functional Block Diagram
    3. 6.3  Main CPU
    4. 6.4  RF Core
    5. 6.5  Sensor Controller
    6. 6.6  Memory
    7. 6.7  Debug
    8. 6.8  Power Management
    9. 6.9  Clock Systems
    10. 6.10 General Peripherals and Modules
    11. 6.11 Voltage Supply Domains
    12. 6.12 System Architecture
  7. 7Application, Implementation, and Layout
    1. 7.1 Application Information
    2. 7.2 4 × 4 External Single-ended (4XS) Application Circuit
      1. 7.2.1 Layout
  8. 8器件和文档支持
    1. 8.1  器件命名规则
    2. 8.2  工具与软件
    3. 8.3  文档支持
    4. 8.4  米6体育平台手机版_好二三四 (TI) 低功耗射频网站
    5. 8.5  低功耗射频电子新闻简报
    6. 8.6  社区资源
    7. 8.7  其他信息
    8. 8.8  商标
    9. 8.9  静电放电警告
    10. 8.10 出口管制提示
    11. 8.11 Glossary
  9. 9机械、封装和可订购信息
    1. 9.1 封装信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

2 修订历史记录

Changes from January 20, 2016 to July 5, 2016

  • Added 分离 VDDS 电源轨特性 Go
  • Added option for up to 80-Ω ESR when CL is 6 pF or lower Go
  • Added tolerance for RCOSC_LF and RTC accuracy content Go
  • Added Figure 5-20, Supply Current vs Temperature Go

Changes from December 2, 2015 to January 19, 2016

  • Updated the Soc ADC internal voltage reference specification in Section 5.12 Go
  • Moved all SSI parameters to Section 5.18 Go
  • Added 0-dBm setting to the TX Current Consumption vs Supply Voltage (VDDS) graph Go
  • Changed Figure 5-11, Receive Mode Current vs Supply Voltage (VDDS) Go
  • Changed Section 8.3中列出的勘误表Go

Changes from February 22, 2015 to December 2, 2015

  • Removed RHB package option from CC2620Go
  • Added motional inductance recommendation to the 24-MHz XOSC table Go
  • Added SPI timing parameters Go
  • Added VOH and VOL min and max values for 4-mA and 8-mA load Go
  • Added min and max values for VIH and VIL Go
  • Added IEEE 802.15.4 Sensitivity vs Channel FrequencyGo
  • Added RF Output Power vs Channel FrequencyGo
  • Added Figure 5-11, Receive Mode Current vs Supply Voltage (VDDS)Go
  • Changed Figure 5-19, SoC ADC ENOB vs Sampling Frequency (Input Frequency = FS / 10)Go
  • Clarified Brown Out Detector status and functionality in the Power Modes table. Go
  • Added application circuit schematics and layout for 5XD and 4XS Go
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