ZHCSEU2C February   2015  – July 2016 CC2620

PRODUCTION DATA.  

  1. 1器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
      1. 1.3.1 功能框图
  2. 2修订历史记录
  3. 3 Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram - RGZ Package
    2. 4.2 Signal Descriptions - RGZ Package
    3. 4.3 Pin Diagram - RSM Package
    4. 4.4 Signal Descriptions - RSM Package
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Power Consumption Summary
    5. 5.5  General Characteristics
    6. 5.6  IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) - RX
    7. 5.7  IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) - TX
    8. 5.8  24-MHz Crystal Oscillator (XOSC_HF)
    9. 5.9  32.768-kHz Crystal Oscillator (XOSC_LF)
    10. 5.10 48-MHz RC Oscillator (RCOSC_HF)
    11. 5.11 32-kHz RC Oscillator (RCOSC_LF)
    12. 5.12 ADC Characteristics
    13. 5.13 Temperature Sensor
    14. 5.14 Battery Monitor
    15. 5.15 Continuous Time Comparator
    16. 5.16 Low-Power Clocked Comparator
    17. 5.17 Programmable Current Source
    18. 5.18 Synchronous Serial Interface (SSI)
    19. 5.19 DC Characteristics
    20. 5.20 Thermal Resistance Characteristics
    21. 5.21 Timing Requirements
    22. 5.22 Switching Characteristics
    23. 5.23 Typical Characteristics
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  Functional Block Diagram
    3. 6.3  Main CPU
    4. 6.4  RF Core
    5. 6.5  Sensor Controller
    6. 6.6  Memory
    7. 6.7  Debug
    8. 6.8  Power Management
    9. 6.9  Clock Systems
    10. 6.10 General Peripherals and Modules
    11. 6.11 Voltage Supply Domains
    12. 6.12 System Architecture
  7. 7Application, Implementation, and Layout
    1. 7.1 Application Information
    2. 7.2 4 × 4 External Single-ended (4XS) Application Circuit
      1. 7.2.1 Layout
  8. 8器件和文档支持
    1. 8.1  器件命名规则
    2. 8.2  工具与软件
    3. 8.3  文档支持
    4. 8.4  米6体育平台手机版_好二三四 (TI) 低功耗射频网站
    5. 8.5  低功耗射频电子新闻简报
    6. 8.6  社区资源
    7. 8.7  其他信息
    8. 8.8  商标
    9. 8.9  静电放电警告
    10. 8.10 出口管制提示
    11. 8.11 Glossary
  9. 9机械、封装和可订购信息
    1. 9.1 封装信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Terminal Configuration and Functions

4.1 Pin Diagram – RGZ Package

CC2620 PO_CC26xx_QFN32_7x7.gif Figure 4-1 RGZ Package
48-Pin VQFN
(7-mm × 7-mm) Pinout, 0.5-mm Pitch

I/O pins marked in Figure 4-1 in bold have high-drive capabilities; they are the following:

  • Pin 10, DIO_5
  • Pin 11, DIO_6
  • Pin 12, DIO_7
  • Pin 24, JTAG_TMSC
  • Pin 26, DIO_16
  • Pin 27, DIO_17

I/O pins marked in Figure 4-1 in italics have analog capabilities; they are the following:

  • Pin 36, DIO_23
  • Pin 37, DIO_24
  • Pin 38, DIO_25
  • Pin 39, DIO_26
  • Pin 40, DIO_27
  • Pin 41, DIO_28
  • Pin 42, DIO_29
  • Pin 43, DIO_30

4.2 Signal Descriptions – RGZ Package

Table 4-1 Signal Descriptions – RGZ Package

NAME NO. TYPE DESCRIPTION
DCDC_SW 33 Power Output from internal DC-DC(1)
DCOUPL 23 Power 1.27-V regulated digital-supply decoupling capacitor(2)
DIO_0 5 Digital I/O GPIO, Sensor Controller
DIO_1 6 Digital I/O GPIO, Sensor Controller
DIO_2 7 Digital I/O GPIO, Sensor Controller
DIO_3 8 Digital I/O GPIO, Sensor Controller
DIO_4 9 Digital I/O GPIO, Sensor Controller
DIO_5 10 Digital I/O GPIO, Sensor Controller, high-drive capability
DIO_6 11 Digital I/O GPIO, Sensor Controller, high-drive capability
DIO_7 12 Digital I/O GPIO, Sensor Controller, high-drive capability
DIO_8 14 Digital I/O GPIO
DIO_9 15 Digital I/O GPIO
DIO_10 16 Digital I/O GPIO
DIO_11 17 Digital I/O GPIO
DIO_12 18 Digital I/O GPIO
DIO_13 19 Digital I/O GPIO
DIO_14 20 Digital I/O GPIO
DIO_15 21 Digital I/O GPIO
DIO_16 26 Digital I/O GPIO, JTAG_TDO, high-drive capability
DIO_17 27 Digital I/O GPIO, JTAG_TDI, high-drive capability
DIO_18 28 Digital I/O GPIO
DIO_19 29 Digital I/O GPIO
DIO_20 30 Digital I/O GPIO
DIO_21 31 Digital I/O GPIO
DIO_22 32 Digital I/O GPIO
DIO_23 36 Digital/Analog I/O GPIO, Sensor Controller, Analog
DIO_24 37 Digital/Analog I/O GPIO, Sensor Controller, Analog
DIO_25 38 Digital/Analog I/O GPIO, Sensor Controller, Analog
DIO_26 39 Digital/Analog I/O GPIO, Sensor Controller, Analog
DIO_27 40 Digital/Analog I/O GPIO, Sensor Controller, Analog
DIO_28 41 Digital/Analog I/O GPIO, Sensor Controller, Analog
DIO_29 42 Digital/Analog I/O GPIO, Sensor Controller, Analog
DIO_30 43 Digital/Analog I/O GPIO, Sensor Controller, Analog
JTAG_TMSC 24 Digital I/O JTAG TMSC, high-drive capability
JTAG_TCKC 25 Digital I/O JTAG TCKC
RESET_N 35 Digital input Reset, active-low. No internal pullup.
RF_P 1 RF I/O Positive RF input signal to LNA during RX
Positive RF output signal to PA during TX
RF_N 2 RF I/O Negative RF input signal to LNA during RX
Negative RF output signal to PA during TX
VDDR 45 Power 1.7-V to 1.95-V supply, typically connect to output of internal DC-DC(2)(3)
VDDR_RF 48 Power 1.7-V to 1.95-V supply, typically connect to output of internal DC-DC(2)(4)
VDDS 44 Power 1.8-V to 3.8-V main chip supply(1)
VDDS2 13 Power 1.8-V to 3.8-V DIO supply(1)
VDDS3 22 Power 1.8-V to 3.8-V DIO supply(1)
VDDS_DCDC 34 Power 1.8-V to 3.8-V DC-DC supply
X32K_Q1 3 Analog I/O 32-kHz crystal oscillator pin 1
X32K_Q2 4 Analog I/O 32-kHz crystal oscillator pin 2
X24M_N 46 Analog I/O 24-MHz crystal oscillator pin 1
X24M_P 47 Analog I/O 24-MHz crystal oscillator pin 2
EGP Power Ground – Exposed Ground Pad
(1) For more details, see the technical reference manual (listed in Section 8.3).
(2) Do not supply external circuitry from this pin.
(3) If internal DC-DC is not used, this pin is supplied internally from the main LDO.
(4) If internal DC-DC is not used, this pin must be connected to VDDR for supply from the main LDO.

4.3 Pin Diagram – RSM Package

CC2620 PO_CC26xx_QFN32_DCDC.gif Figure 4-2 RSM Package
32-Pin VQFN
(4-mm × 4-mm) Pinout, 0.4-mm Pitch

I/O pins marked in Figure 4-2 in bold have high-drive capabilities; they are as follows:

  • Pin 8, DIO_0
  • Pin 9, DIO_1
  • Pin 10, DIO_2
  • Pin 13, JTAG_TMSC
  • Pin 15, DIO_3
  • Pin 16, DIO_4

I/O pins marked in Figure 4-2 in italics have analog capabilities; they are as follows:

  • Pin 22, DIO_5
  • Pin 23, DIO_6
  • Pin 24, DIO_7
  • Pin 25, DIO_8
  • Pin 26, DIO_9

4.4 Signal Descriptions – RSM Package

Table 4-2 Signal Descriptions – RSM Package

NAME NO. TYPE DESCRIPTION
DCDC_SW 18 Power Output from internal DC-DC.(1). Tie to ground for external regulator mode (1.7-V to 1.95-V operation)
DCOUPL 12 Power 1.27-V regulated digital-supply decoupling capacitor(2)
DIO_0 8 Digital I/O GPIO, Sensor Controller, high-drive capability
DIO_1 9 Digital I/O GPIO, Sensor Controller, high-drive capability
DIO_2 10 Digital I/O GPIO, Sensor Controller, high-drive capability
DIO_3 15 Digital I/O GPIO, High-drive capability, JTAG_TDO
DIO_4 16 Digital I/O GPIO, High-drive capability, JTAG_TDI
DIO_5 22 Digital/Analog I/O GPIO, Sensor Controller, Analog
DIO_6 23 Digital/Analog I/O GPIO, Sensor Controller, Analog
DIO_7 24 Digital/Analog I/O GPIO, Sensor Controller, Analog
DIO_8 25 Digital/Analog I/O GPIO, Sensor Controller, Analog
DIO_9 26 Digital/Analog I/O GPIO, Sensor Controller, Analog
JTAG_TMSC 13 Digital I/O JTAG TMSC
JTAG_TCKC 14 Digital I/O JTAG TCKC
RESET_N 21 Digital Input Reset, active-low. No internal pullup.
RF_N 2 RF I/O Negative RF input signal to LNA during RX
Negative RF output signal to PA during TX
RF_P 1 RF I/O Positive RF input signal to LNA during RX
Positive RF output signal to PA during TX
RX_TX 4 RF I/O Optional bias pin for the RF LNA
VDDR 28 Power 1.7-V to 1.95-V supply, typically connect to output of internal DC-DC.(2)(3)
VDDR_RF 32 Power 1.7-V to 1.95-V supply, typically connect to output of internal DC-DC(2)(4)
VDDS 27 Power 1.8-V to 3.8-V main chip supply(1)
VDDS2 11 Power 1.8-V to 3.8-V GPIO supply(1)
VDDS_DCDC 19 Power 1.8-V to 3.8-V DC-DC supply. Tie to ground for external regulator mode (1.7-V to 1.95-V operation).
VSS 3, 7, 17, 20, 29 Power Ground
X32K_Q1 5 Analog I/O 32-kHz crystal oscillator pin 1
X32K_Q2 6 Analog I/O 32-kHz crystal oscillator pin 2
X24M_N 30 Analog I/O 24-MHz crystal oscillator pin 1
X24M_P 31 Analog I/O 24-MHz crystal oscillator pin 2
EGP Power Ground – Exposed Ground Pad
(1) See technical reference manual (listed in Section 8.3) for more details.
(2) Do not supply external circuitry from this pin.
(3) If internal DC-DC is not used, this pin is supplied internally from the main LDO.
(4) If internal DC-DC is not used, this pin must be connected to VDDR for supply from the main LDO.
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