ZHCSDE1B February   2015  – July 2016 CC2640

PRODUCTION DATA.  

  1. 1器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
      1. 1.3.1 功能框图
  2. 2修订历史记录
  3. 3 Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram - RGZ Package
    2. 4.2 Signal Descriptions - RGZ Package
    3. 4.3 Pin Diagram - RHB Package
    4. 4.4 Signal Descriptions - RHB Package
    5. 4.5 Pin Diagram - RSM Package
    6. 4.6 Signal Descriptions - RSM Package
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Power Consumption Summary
    5. 5.5  General Characteristics
    6. 5.6  1-Mbps GFSK (Bluetooth low energy) - RX
    7. 5.7  1-Mbps GFSK (Bluetooth low energy) - TX
    8. 5.8  2-Mbps GFSK (Bluetooth 5) - RX
    9. 5.9  2-Mbps GFSK (Bluetooth 5) - TX
    10. 5.10 5-Mbps (Proprietary) - RX
    11. 5.11 5-Mbps (Proprietary) - TX
    12. 5.12 24-MHz Crystal Oscillator (XOSC_HF)
    13. 5.13 32.768-kHz Crystal Oscillator (XOSC_LF)
    14. 5.14 48-MHz RC Oscillator (RCOSC_HF)
    15. 5.15 32-kHz RC Oscillator (RCOSC_LF)
    16. 5.16 ADC Characteristics
    17. 5.17 Temperature Sensor
    18. 5.18 Battery Monitor
    19. 5.19 Continuous Time Comparator
    20. 5.20 Low-Power Clocked Comparator
    21. 5.21 Programmable Current Source
    22. 5.22 Synchronous Serial Interface (SSI)
    23. 5.23 DC Characteristics
    24. 5.24 Thermal Resistance Characteristics
    25. 5.25 Timing Requirements
    26. 5.26 Switching Characteristics
    27. 5.27 Typical Characteristics
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  Functional Block Diagram
    3. 6.3  Main CPU
    4. 6.4  RF Core
    5. 6.5  Sensor Controller
    6. 6.6  Memory
    7. 6.7  Debug
    8. 6.8  Power Management
    9. 6.9  Clock Systems
    10. 6.10 General Peripherals and Modules
    11. 6.11 Voltage Supply Domains
    12. 6.12 System Architecture
  7. 7Application, Implementation, and Layout
    1. 7.1 Application Information
    2. 7.2 5 × 5 External Differential (5XD) Application Circuit
      1. 7.2.1 Layout
    3. 7.3 4 × 4 External Single-ended (4XS) Application Circuit
      1. 7.3.1 Layout
  8. 8器件和文档支持
    1. 8.1  器件命名规则
    2. 8.2  工具与软件
    3. 8.3  文档支持
    4. 8.4  米6体育平台手机版_好二三四 (TI) 低功耗射频网站
    5. 8.5  低功耗射频电子新闻简报
    6. 8.6  社区资源
    7. 8.7  其他信息
    8. 8.8  商标
    9. 8.9  静电放电警告
    10. 8.10 出口管制提示
    11. 8.11 Glossary
  9. 9机械、封装和可订购信息
    1. 9.1 封装信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RSM|32
  • RHB|32
  • RGZ|48
散热焊盘机械数据 (封装 | 引脚)
订购信息

修订历史记录

Changes from October 23, 2015 to July 5, 2016 (from A Revision () to B Revision)

  • Added 分离 VDDS 电源轨特性 Go
  • Added 5Mbps 专用模式Go
  • Added option for up to 80-Ω ESR when CL is 6 pF or lower Go
  • Added tolerance for RCOSC_LF and RTC accuracy content Go
  • Updated the Soc ADC internal voltage reference specification in Section 5.16 Go
  • Moved all SSI parameters to Section 5.22 Go
  • Added 0-dBm setting to the TX Current Consumption vs Supply Voltage (VDDS) graph Go
  • Changed Figure 5-11, Receive Mode Current vs Supply Voltage (VDDS) Go
  • Added Figure 5-20, Supply Current vs Temperature Go

Changes from February 15, 2015 to October 22, 2015 (from * Revision () to A Revision)

  • Removed RHB package option from CC2620Go
  • Added motional inductance recommendation to the 24-MHz XOSC table Go
  • Added SPI timing parameters Go
  • Added VOH and VOL min and max values for 4-mA and 8-mA load Go
  • Added min and max values for VIH and VIL Go
  • Added BLE Sensitivity vs Channel FrequencyGo
  • Added RF Output Power vs Channel FrequencyGo
  • Added Figure 5-11, Receive Mode Current vs Supply Voltage (VDDS)Go
  • Changed Figure 5-19, SoC ADC ENOB vs Sampling Frequency (Input Frequency = FS / 10)Go
  • Clarified Brown Out Detector status and functionality in the Power Modes table. Go
  • Added application circuit schematics and layout for 5XD and 4XS Go