ZHCSGW5B January   2017  – October 2020 CC2640R2F-Q1

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. 功能方框图
  5. Revision History
  6. Device Comparison
    1. 6.1 Related Products
  7. Terminal Configuration and Functions
    1. 7.1 Pin Diagram – RGZ Package
    2. 7.2 Signal Descriptions – RGZ Package
    3. 7.3 Wettable Flanks
  8. Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Consumption Summary
    5. 8.5  General Characteristics
    6. 8.6  1-Mbps GFSK (Bluetooth low energy Technology) – RX
    7. 8.7  1-Mbps GFSK (Bluetooth low energy Technology) – TX
    8. 8.8  24-MHz Crystal Oscillator (XOSC_HF)
    9. 8.9  32.768-kHz Crystal Oscillator (XOSC_LF)
    10. 8.10 48-MHz RC Oscillator (RCOSC_HF)
    11. 8.11 32-kHz RC Oscillator (RCOSC_LF)
    12. 8.12 ADC Characteristics
    13. 8.13 Temperature Sensor
    14. 8.14 Battery Monitor
    15. 8.15 Continuous Time Comparator
    16. 8.16 Low-Power Clocked Comparator
    17. 8.17 Programmable Current Source
    18. 8.18 Synchronous Serial Interface (SSI)
    19. 8.19 DC Characteristics
    20. 8.20 Thermal Resistance Characteristics for RGZ Package
    21. 8.21 Timing Requirements
    22. 8.22 Switching Characteristics
    23. 8.23 Typical Characteristics
  9. Detailed Description
    1. 9.1  Overview
    2. 9.2  Main CPU
    3. 9.3  RF Core
    4. 9.4  Sensor Controller
    5. 9.5  Memory
    6. 9.6  Debug
    7. 9.7  Power Management
    8. 9.8  Clock Systems
    9. 9.9  General Peripherals and Modules
    10. 9.10 System Architecture
  10. 10Application, Implementation, and Layout
    1. 10.1 Application Information
    2. 10.2 7 × 7 Internal Differential (7ID) Application Circuit
      1. 10.2.1 Layout
  11. 11Device and Documentation Support
    1. 11.1 Device Nomenclature
    2. 11.2 Tools and Software
    3. 11.3 Documentation Support
    4. 11.4 Texas Instruments Low-Power RF Website
    5. 11.5 Support Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Export Control Notice
    9. 11.9 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RGZ|48
散热焊盘机械数据 (封装 | 引脚)
订购信息

DC Characteristics

PARAMETERTEST CONDITIONSMINTYPMAXUNIT
TA = 25°C, VDDS = 1.8 V
GPIO VOH at 8-mA loadIOCURR = 2, high-drive GPIOs only1.321.54V
GPIO VOL at 8-mA loadIOCURR = 2, high-drive GPIOs only0.260.32V
GPIO VOH at 4-mA loadIOCURR = 11.321.58V
GPIO VOL at 4-mA loadIOCURR = 10.210.32V
GPIO pullup currentInput mode, pullup enabled, V(pad) = 0 V71.7µA
GPIO pulldown currentInput mode, pulldown enabled, V(pad) = VDDS21.1µA
GPIO high/low input transition,
no hysteresis
IH = 0, transition between reading 0 and reading 10.88V
GPIO low-to-high input transition,
with hysteresis
IH = 1, transition voltage for input read as 0 → 11.07V
GPIO high-to-low input transition,
with hysteresis
IH = 1, transition voltage for input read as 1 → 00.74V
GPIO input hysteresisIH = 1, difference between 0 → 1 and 1 → 0 points0.33V
TA = 25°C, VDDS = 3.0 V
GPIO VOH at 8-mA loadIOCURR = 2, high-drive GPIOs only2.68V
GPIO VOL at 8-mA loadIOCURR = 2, high-drive GPIOs only0.33V
GPIO VOH at 4-mA loadIOCURR = 12.72V
GPIO VOL at 4-mA loadIOCURR = 10.28V
TA = 25°C, VDDS = 3.8 V
GPIO pullup currentInput mode, pullup enabled, V(pad) = 0 V277µA
GPIO pulldown currentInput mode, pulldown enabled, V(pad) = VDDS113µA
GPIO high/low input transition,
no hysteresis
IH = 0, transition between reading 0 and reading 11.67V
GPIO low-to-high input transition,
with hysteresis
IH = 1, transition voltage for input read as 0 → 11.94V
GPIO high-to-low input transition,
with hysteresis
IH = 1, transition voltage for input read as 1 → 01.54V
GPIO input hysteresisIH = 1, difference between 0 → 1 and 1 → 0 points0.4V
TA = 25°C
V(IH)Lowest GPIO input voltage reliably interpreted as a «High»0.8VDDS(1)
V(IL)Highest GPIO input voltage reliably interpreted as a «Low»0.2VDDS(1)
Each GPIO is referenced to a specific VDDS pin. See the technical reference manual listed in Section 11.3 for more details.