米6体育平台手机版

ZHCSGW5B January 2017 – October 2020 CC2640R2F-Q1

PRODUCTION DATA

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请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)

RGZ|48

散热焊盘机械数据 (封装 | 引脚)

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8.20 Thermal Resistance Characteristics for RGZ Package

over operating free-air temperature range (unless otherwise noted)

NAME	DESCRIPTION	(°C/W)⁽¹⁾⁽²⁾
Rθ_JA	Junction-to-ambient thermal resistance	29.6
Rθ_JC(top)	Junction-to-case (top) thermal resistance	15.7
Rθ_JB	Junction-to-board thermal resistance	6.2
Psi_JT	Junction-to-top characterization parameter	0.3
Psi_JB	Junction-to-board characterization parameter	6.2
Rθ_JC(bot)	Junction-to-case (bottom) thermal resistance	1.9

(1) °C/W = degrees Celsius per watt.

(2) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [Rθ_JC] value, which is based on a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see the following EIA/JEDEC standards:

JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements

Power dissipation of 2 W and an ambient temperature of 70°C is assumed.