ZHCSDE0A February   2015  – October 2015 CC2650

PRODUCTION DATA.  

  1. 1器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
      1. 1.3.1 功能框图
  2. 2修订历史记录
  3. 3 Device Comparison
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram - RGZ Package
    2. 4.2 Signal Descriptions - RGZ Package
    3. 4.3 Pin Diagram - RHB Package
    4. 4.4 Signal Descriptions - RHB Package
    5. 4.5 Pin Diagram - RSM Package
    6. 4.6 Signal Descriptions - RSM Package
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Power Consumption Summary
    5. 5.5  General Characteristics
    6. 5.6  1-Mbps GFSK (Bluetooth Low Energy) - RX
    7. 5.7  1-Mbps GFSK (Bluetooth Low Energy) - TX
    8. 5.8  IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) - RX
    9. 5.9  IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) - TX
    10. 5.10 24-MHz Crystal Oscillator (XOSC_HF)
    11. 5.11 32.768-kHz Crystal Oscillator (XOSC_LF)
    12. 5.12 48-MHz RC Oscillator (RCOSC_HF)
    13. 5.13 32-kHz RC Oscillator (RCOSC_LF)
    14. 5.14 ADC Characteristics
    15. 5.15 Temperature Sensor
    16. 5.16 Battery Monitor
    17. 5.17 Continuous Time Comparator
    18. 5.18 Low-Power Clocked Comparator
    19. 5.19 Programmable Current Source
    20. 5.20 DC Characteristics
    21. 5.21 Thermal Characteristics
    22. 5.22 Timing Requirements
    23. 5.23 Switching Characteristics
    24. 5.24 Typical Characteristics
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  Functional Block Diagram
    3. 6.3  Main CPU
    4. 6.4  RF Core
    5. 6.5  Sensor Controller
    6. 6.6  Memory
    7. 6.7  Debug
    8. 6.8  Power Management
    9. 6.9  Clock Systems
    10. 6.10 General Peripherals and Modules
    11. 6.11 System Architecture
  7. 7Application, Implementation, and Layout
    1. 7.1 Application Information
    2. 7.2 5 × 5 External Differential (5XD) Application Circuit
      1. 7.2.1 Layout
    3. 7.3 4 × 4 External Single-ended (4XS) Application Circuit
      1. 7.3.1 Layout
  8. 8器件和文档支持
    1. 8.1  器件支持
      1. 8.1.1 开发支持
      2. 8.1.2 器件命名规则
    2. 8.2  文档支持
    3. 8.3  社区资源
    4. 8.4  米6体育平台手机版_好二三四 (TI) 低功耗射频网站
    5. 8.5  低功耗射频在线社区
    6. 8.6  米6体育平台手机版_好二三四 (TI) 低功耗射频开发者网络
    7. 8.7  低功耗射频电子新闻简报
    8. 8.8  其他信息
    9. 8.9  商标
    10. 8.10 静电放电警告
    11. 8.11 Export Control Notice
    12. 8.12 Glossary
  9. 9机械、封装和可订购信息
    1. 9.1 封装信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RSM|32
  • RHB|32
  • RGZ|48
散热焊盘机械数据 (封装 | 引脚)
订购信息

3 Device Comparison

Table 3-1 Device Family Overview

DEVICE PHY SUPPORT FLASH (KB) RAM (KB) GPIO PACKAGE(1)
CC2650F128xxx Multi-Protocol(2) 128 20 31, 15, 10 RGZ, RHB, RSM
CC2640F128xxx Bluetooth low energy 128 20 31, 15, 10 RGZ, RHB, RSM
CC2630F128xxx IEEE 802.15.4 Zigbee(/6LoWPAN) 128 20 31, 15, 10 RGZ, RHB, RSM
CC2620F128xxx IEEE 802.15.4 (RF4CE) 128 20 31, 10 RGZ, RSM
(1) Package designator replaces the xxx in device name to form a complete device name, RGZ is 7-mm × 7-mm VQFN48, RHB is
5-mm × 5-mm VQFN32, and RSM is 4-mm × 4-mm VQFN32.
(2) The CC2650 device supports all PHYs and can be reflashed to run all the supported standards.
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