ZHCSQS1B february   2022  – august 2023 CC2651R3SIPA

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 功能方框图
  6. 5 Revision History
  7. 6 Device Comparison
  8. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram
    2. 7.2 Signal Descriptions – SIPA Package
    3. 7.3 Connections for Unused Pins and Modules
  9. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Supply and Modules
    5. 8.5  Power Consumption - Power Modes
    6. 8.6  Power Consumption - Radio Modes
    7. 8.7  Nonvolatile (Flash) Memory Characteristics
    8. 8.8  Thermal Resistance Characteristics
    9. 8.9  RF Frequency Bands
    10. 8.10 Antenna Characteristics
    11. 8.11 Bluetooth Low Energy - Receive (RX)
    12. 8.12 Bluetooth Low Energy - Transmit (TX)
    13. 8.13 Zigbee - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - RX
    14. 8.14 Zigbee - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - TX
    15. 8.15 Timing and Switching Characteristics
      1. 8.15.1 Reset Timing
      2. 8.15.2 Wakeup Timing
      3. 8.15.3 Clock Specifications
        1. 8.15.3.1 48 MHz Crystal Oscillator (XOSC_HF)
        2. 8.15.3.2 48 MHz RC Oscillator (RCOSC_HF)
        3. 8.15.3.3 32.768 kHz Crystal Oscillator (XOSC_LF)
        4. 8.15.3.4 32 kHz RC Oscillator (RCOSC_LF)
      4. 8.15.4 Synchronous Serial Interface (SSI) Characteristics
        1. 8.15.4.1 Synchronous Serial Interface (SSI) Characteristics
        2.       37
      5. 8.15.5 UART
        1. 8.15.5.1 UART Characteristics
    16. 8.16 Peripheral Characteristics
      1. 8.16.1 ADC
        1. 8.16.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 8.16.2 DAC
        1. 8.16.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 8.16.3 Temperature and Battery Monitor
        1. 8.16.3.1 Temperature Sensor
        2. 8.16.3.2 Battery Monitor
      4. 8.16.4 Comparators
        1. 8.16.4.1 Continuous Time Comparator
      5. 8.16.5 Current Source
        1. 8.16.5.1 Programmable Current Source
      6. 8.16.6 GPIO
        1. 8.16.6.1 GPIO DC Characteristics
    17. 8.17 Typical Characteristics
      1. 8.17.1 MCU Current
      2. 8.17.2 RX Current
      3. 8.17.3 TX Current
      4. 8.17.4 RX Performance
      5. 8.17.5 TX Performance
      6. 8.17.6 ADC Performance
  10. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  System CPU
    3. 9.3  Radio (RF Core)
      1. 9.3.1 Bluetooth 5.2 Low Energy
      2. 9.3.2 802.15.4 (Zigbee)
    4. 9.4  Memory
    5. 9.5  Cryptography
    6. 9.6  Timers
    7. 9.7  Serial Peripherals and I/O
    8. 9.8  Battery and Temperature Monitor
    9. 9.9  µDMA
    10. 9.10 Debug
    11. 9.11 Power Management
    12. 9.12 Clock Systems
    13. 9.13 Network Processor
    14. 9.14 Device Certification and Qualification
      1. 9.14.1 FCC Certification and Statement
      2. 9.14.2 IC/ISED Certification and Statement
      3. 9.14.3 ETSI/CE Certification
      4. 9.14.4 UK Certification
      5. 9.14.5 MIC Certification
      6. 9.14.6 Korea Certification
      7. 9.14.7 NCC Certification and Statement
    15. 9.15 Module Markings
    16. 9.16 End Product Labeling
    17. 9.17 Manual Information to the End User
  11. 10Application, Implementation, and Layout
    1. 10.1 Typical Application Circuit
    2. 10.2 Alternate Application Circuit
    3. 10.3 Device Connections
      1. 10.3.1 Reset
      2. 10.3.2 Unused Pins
    4. 10.4 PCB Layout Guidelines
      1. 10.4.1 General Layout Recommendations
      2. 10.4.2 Typical RF Layout Recommendations with Integrated Antenna
      3. 10.4.3 RF Layout Recommendations with External Antenna
        1. 10.4.3.1 External Antenna Placement and Routing
        2. 10.4.3.2 Transmission Line Considerations
      4. 10.4.4 Alternate PCB Layout Guidelines
    5. 10.5 Reference Designs
    6. 10.6 Junction Temperature Calculation
  12. 11Environmental Requirements and SMT Specifications
    1. 11.1 PCB Bending
    2. 11.2 Handling Environment
      1. 11.2.1 Terminals
      2. 11.2.2 Falling
    3. 11.3 Storage Condition
      1. 11.3.1 Moisture Barrier Bag Before Opened
      2. 11.3.2 Moisture Barrier Bag Open
    4. 11.4 PCB Assembly Guide
      1. 11.4.1 PCB Land Pattern & Thermal Vias
      2. 11.4.2 SMT Assembly Recommendations
      3. 11.4.3 PCB Surface Finish Requirements
      4. 11.4.4 Solder Stencil
      5. 11.4.5 Package Placement
      6. 11.4.6 Solder Joint Inspection
      7. 11.4.7 Rework and Replacement
      8. 11.4.8 Solder Joint Voiding
    5. 11.5 Baking Conditions
    6. 11.6 Soldering and Reflow Condition
  13. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
    2. 12.2 Tools and Software
      1. 12.2.1 SimpleLink™ Microcontroller Platform
    3. 12.3 Documentation Support
    4. 12.4 支持资源
    5. 12.5 Trademarks
    6. 12.6 静电放电警告
    7. 12.7 术语表
  14. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

10.1 Typical Application Circuit

Figure 10-3 shows the typical application schematic using the CC2651R3SIPA module. Note that C15 should be assembled when using the integrated antenna option within the module and when the layout design guidelines in Section 10.4.2 are strictly followed. If the layout guidelines described in Section 10.4.2 cannot be followed, it is recommended to implement the alternate application circuit schematic in Section 10.2 and follow the alternate layout guidelines in Section 10.4.4.

If using the external antenna option, C14 should be assembled. In addition, Pin 15 of the module should be connected to GND as shown in Figure 10-2. For the full reference schematic, download the LP-CC2651R3SIPA Design Files.

Note:

The following guidelines are recommended for implementation of the RF design when using an external antenna on the RF path, pin 14:

  • Ensure an RF path is designed with an impedance of 50 Ω.
  • Tuning of the antenna impedance π matching network is recommended after manufacturing of the PCB to account for PCB parasitics.
  • π or L matching and tuning may be required between RF out path, pin 14, and the external connection as shown in Figure 10-2.
GUID-20220224-SS0I-0M5C-1XSM-CRQD9FHTXPJ9-low.svg Figure 10-1 CC2651R3SIPA Typical Application Schematic
GUID-20221013-SS0I-3LT4-ZCPL-WC7P8KRPVXNH-low.svg Figure 10-2 CC2651R3SIPA Typical Application Schematic for External Antenna Connection

Table 10-3 provides the bill of materials for a typical application using the CC2651R3SIPA module with the internal antenna as shown in Figure 10-3, while Table 10-2 provides the bill of materials for a typical application using the CC2651R3SIPA module with an external antenna as shown in Figure 10-2

Table 10-1 Bill of Materials for Internal Antenna Configuration
PART REFERENCE VALUE MANUFACTURER PART NUMBER DESCRIPTION
C14, C15, C91(1) 15 pF Murata GRM0335C1E150JA01D Capacitor, ceramic, 15 pF, 50 V, ±5%, C0G/NP0, 0201
C81 12 pF Murata GRT0335C1H120JA02D Capacitor, ceramic, 12 pF, 50 V, ±5%, C0G/NP0, 0201
J7 U.FL Hirose U.FL-R-SMT-1(01) U.FL (UMCC) connector receptacle, male pin 50 Ω, surface mount solder
U1 CC2651R3SIPA Texas Instruments CC2651R3SIPAT0MOUR SimpleLink™ multiprotocol 2.4-GHz wireless MCU with integrated power amplifier and Antenna
Y6 32.768kHz TAI-SAW TZ1166C Crystal, resonator, 32.768kHz, -40oC / +125oC, SMD
(1) C15 is placed when using the integrated antenna. C14 is placed when using an external antenna

Table 10-2 Bill of Materials for External Antenna Configuration
PART REFERENCE VALUE MANUFACTURER PART NUMBER DESCRIPTION
C1, C91 15 pF Murata GRM0335C1E150JA01D Capacitor, ceramic, 15 pF, 50 V, ±5%, C0G/NP0, 0201
C81 12 pF Murata GRT0335C1H120JA02D Capacitor, ceramic, 12 pF, 50 V, ±5%, C0G/NP0, 0201
J1 SMA HUS-TSAN SMA-10V21-TGG Connector, coax, RF, female, Straight, 1 pin, SMD
U2 CC2651R3SIPA Texas Instruments CC2651R3SIPAT0MOUR SimpleLink™ multiprotocol 2.4-GHz wireless MCU with integrated power amplifier and Antenna
Y6 32.768kHz TAI-SAW TZ1166C Crystal, resonator, 32.768kHz, -40oC / +125oC, SMD
Z2(1) 15 pF Murata GRM0335C1E150JA01D Capacitor, ceramic, 15 pF, 50 V, ±5%, C0G/NP0, 0201
(1) Z2 is the recommended series matching component to use when using connecting to an SMA connector. Additional Shunt components Z1 and Z3 can be used for additional tuning for external antenna performance.
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