ZHCSQS1B february   2022  – august 2023 CC2651R3SIPA

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 功能方框图
  6. 5 Revision History
  7. 6 Device Comparison
  8. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram
    2. 7.2 Signal Descriptions – SIPA Package
    3. 7.3 Connections for Unused Pins and Modules
  9. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Supply and Modules
    5. 8.5  Power Consumption - Power Modes
    6. 8.6  Power Consumption - Radio Modes
    7. 8.7  Nonvolatile (Flash) Memory Characteristics
    8. 8.8  Thermal Resistance Characteristics
    9. 8.9  RF Frequency Bands
    10. 8.10 Antenna Characteristics
    11. 8.11 Bluetooth Low Energy - Receive (RX)
    12. 8.12 Bluetooth Low Energy - Transmit (TX)
    13. 8.13 Zigbee - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - RX
    14. 8.14 Zigbee - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - TX
    15. 8.15 Timing and Switching Characteristics
      1. 8.15.1 Reset Timing
      2. 8.15.2 Wakeup Timing
      3. 8.15.3 Clock Specifications
        1. 8.15.3.1 48 MHz Crystal Oscillator (XOSC_HF)
        2. 8.15.3.2 48 MHz RC Oscillator (RCOSC_HF)
        3. 8.15.3.3 32.768 kHz Crystal Oscillator (XOSC_LF)
        4. 8.15.3.4 32 kHz RC Oscillator (RCOSC_LF)
      4. 8.15.4 Synchronous Serial Interface (SSI) Characteristics
        1. 8.15.4.1 Synchronous Serial Interface (SSI) Characteristics
        2.       37
      5. 8.15.5 UART
        1. 8.15.5.1 UART Characteristics
    16. 8.16 Peripheral Characteristics
      1. 8.16.1 ADC
        1. 8.16.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 8.16.2 DAC
        1. 8.16.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 8.16.3 Temperature and Battery Monitor
        1. 8.16.3.1 Temperature Sensor
        2. 8.16.3.2 Battery Monitor
      4. 8.16.4 Comparators
        1. 8.16.4.1 Continuous Time Comparator
      5. 8.16.5 Current Source
        1. 8.16.5.1 Programmable Current Source
      6. 8.16.6 GPIO
        1. 8.16.6.1 GPIO DC Characteristics
    17. 8.17 Typical Characteristics
      1. 8.17.1 MCU Current
      2. 8.17.2 RX Current
      3. 8.17.3 TX Current
      4. 8.17.4 RX Performance
      5. 8.17.5 TX Performance
      6. 8.17.6 ADC Performance
  10. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  System CPU
    3. 9.3  Radio (RF Core)
      1. 9.3.1 Bluetooth 5.2 Low Energy
      2. 9.3.2 802.15.4 (Zigbee)
    4. 9.4  Memory
    5. 9.5  Cryptography
    6. 9.6  Timers
    7. 9.7  Serial Peripherals and I/O
    8. 9.8  Battery and Temperature Monitor
    9. 9.9  µDMA
    10. 9.10 Debug
    11. 9.11 Power Management
    12. 9.12 Clock Systems
    13. 9.13 Network Processor
    14. 9.14 Device Certification and Qualification
      1. 9.14.1 FCC Certification and Statement
      2. 9.14.2 IC/ISED Certification and Statement
      3. 9.14.3 ETSI/CE Certification
      4. 9.14.4 UK Certification
      5. 9.14.5 MIC Certification
      6. 9.14.6 Korea Certification
      7. 9.14.7 NCC Certification and Statement
    15. 9.15 Module Markings
    16. 9.16 End Product Labeling
    17. 9.17 Manual Information to the End User
  11. 10Application, Implementation, and Layout
    1. 10.1 Typical Application Circuit
    2. 10.2 Alternate Application Circuit
    3. 10.3 Device Connections
      1. 10.3.1 Reset
      2. 10.3.2 Unused Pins
    4. 10.4 PCB Layout Guidelines
      1. 10.4.1 General Layout Recommendations
      2. 10.4.2 Typical RF Layout Recommendations with Integrated Antenna
      3. 10.4.3 RF Layout Recommendations with External Antenna
        1. 10.4.3.1 External Antenna Placement and Routing
        2. 10.4.3.2 Transmission Line Considerations
      4. 10.4.4 Alternate PCB Layout Guidelines
    5. 10.5 Reference Designs
    6. 10.6 Junction Temperature Calculation
  12. 11Environmental Requirements and SMT Specifications
    1. 11.1 PCB Bending
    2. 11.2 Handling Environment
      1. 11.2.1 Terminals
      2. 11.2.2 Falling
    3. 11.3 Storage Condition
      1. 11.3.1 Moisture Barrier Bag Before Opened
      2. 11.3.2 Moisture Barrier Bag Open
    4. 11.4 PCB Assembly Guide
      1. 11.4.1 PCB Land Pattern & Thermal Vias
      2. 11.4.2 SMT Assembly Recommendations
      3. 11.4.3 PCB Surface Finish Requirements
      4. 11.4.4 Solder Stencil
      5. 11.4.5 Package Placement
      6. 11.4.6 Solder Joint Inspection
      7. 11.4.7 Rework and Replacement
      8. 11.4.8 Solder Joint Voiding
    5. 11.5 Baking Conditions
    6. 11.6 Soldering and Reflow Condition
  13. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
    2. 12.2 Tools and Software
      1. 12.2.1 SimpleLink™ Microcontroller Platform
    3. 12.3 Documentation Support
    4. 12.4 支持资源
    5. 12.5 Trademarks
    6. 12.6 静电放电警告
    7. 12.7 术语表
  14. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

12.3 Documentation Support

To receive notification of documentation updates on data sheets, errata, application notes and similar, navigate to the device product folder on ti.com/product/CC2651R3SIPA In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

The current documentation that describes the MCU, related peripherals, and other technical collateral is listed as follows.

TI Resource Explorer

    TI Resource Explorer

    Software examples, libraries, executables, and documentation are available for your device and development board.

Errata

    CC2651R3SIPA Silicon Errata

    The silicon errata describes the known exceptions to the functional specifications for each silicon revision of the device and description on how to recognize a device revision.

Application Reports

All application reports for the CC2651R3SIPA device are found on the device product folder at: ti.com/product/CC2651R3SIPA/technicaldocuments.

Technical Reference Manual (TRM)
千亿体育app官网登录(中国)官方网站IOS/安卓通用版/手机APP | 米乐app下载官网（中国）|ios|Android/通用版APP最新版 | 米乐|米乐·M6（中国大陆）官方网站 | 千亿体育登陆地址 | 华体会体育（中国）HTH·官方网站 | 千赢qy国际_全站最新版千赢qy国际V6.2.14安卓/IOS下载 | 18新利网v1.2.5|中国官方网站 | bob电竞真人（中国官网）安卓/ios苹果/电脑版【1.97.95版下载】 | 千亿体育app官方下载(中国)官方网站IOS/安卓/手机APP下载安装 |