ZHCSQP2B February   2021  – September 2022 CC2652PSIP

PRODUCTION DATA  

1. 1 特性
2. 2 应用
3. 3 说明
4. 4 Functional Block Diagram
5. 5 Revision History
6. 6 Device Comparison
7. 7 Terminal Configuration and Functions
   1. 7.1 Pin Diagram
   2. 7.2 Signal Descriptions – SIP Package
   3. 7.3 Connections for Unused Pins and Modules
8. 8 Specifications
   1. 8.1  Absolute Maximum Ratings
   2. 8.2  ESD Ratings
   3. 8.3  Recommended Operating Conditions
   4. 8.4  Power Supply and Modules
   5. 8.5  Power Consumption - Power Modes
   6. 8.6  Power Consumption - Radio Modes
   7. 8.7  Nonvolatile (Flash) Memory Characteristics
   8. 8.8  Thermal Resistance Characteristics
   9. 8.9  RF Frequency Bands
   10. 8.10 Bluetooth Low Energy - Receive (RX)
   11. 8.11 Bluetooth Low Energy - Transmit (TX)
   12. 8.12 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - RX
   13. 8.13 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - TX
   14. 8.14 Timing and Switching Characteristics
       1. 8.14.1 Reset Timing
       2. 8.14.2 Wakeup Timing
       3. 8.14.3 Clock Specifications
          1. 8.14.3.1 48 MHz Crystal Oscillator (XOSC_HF)
          2. 8.14.3.2 48 MHz RC Oscillator (RCOSC_HF)
          3. 8.14.3.3 2 MHz RC Oscillator (RCOSC_MF)
          4. 8.14.3.4 32.768 kHz Crystal Oscillator (XOSC_LF)
          5. 8.14.3.5 32 kHz RC Oscillator (RCOSC_LF)
       4. 8.14.4 Synchronous Serial Interface (SSI) Characteristics
          1. 8.14.4.1 Synchronous Serial Interface (SSI) Characteristics
          2.       36
       5. 8.14.5 UART
          1.       38
   15. 8.15 Peripheral Characteristics
       1. 8.15.1 ADC
          1.       Analog-to-Digital Converter (ADC) Characteristics
       2. 8.15.2 DAC
          1. 8.15.2.1 Digital-to-Analog Converter (DAC) Characteristics
       3. 8.15.3 Temperature and Battery Monitor
          1. 8.15.3.1 Temperature Sensor
          2. 8.15.3.2 Battery Monitor
       4. 8.15.4 Comparators
          1. 8.15.4.1 Low-Power Clocked Comparator
          2. 8.15.4.2 Continuous Time Comparator
       5. 8.15.5 Current Source
          1. 8.15.5.1 Programmable Current Source
       6. 8.15.6 GPIO
          1. 8.15.6.1 GPIO DC Characteristics
   16. 8.16 Typical Characteristics
       1. 8.16.1 MCU Current
       2. 8.16.2 RX Current
       3. 8.16.3 TX Current
       4. 8.16.4 RX Performance
       5. 8.16.5 TX Performance
       6. 8.16.6 ADC Performance
9. 9 Detailed Description
   1. 9.1  Overview
   2. 9.2  System CPU
   3. 9.3  Radio (RF Core)
      1. 9.3.1 Bluetooth 5.2 Low Energy
      2. 9.3.2 802.15.4 (Thread, Zigbee, 6LoWPAN)
   4. 9.4  Memory
   5. 9.5  Sensor Controller
   6. 9.6  Cryptography
   7. 9.7  Timers
   8. 9.8  Serial Peripherals and I/O
   9. 9.9  Battery and Temperature Monitor
   10. 9.10 µDMA
   11. 9.11 Debug
   12. 9.12 Power Management
   13. 9.13 Clock Systems
   14. 9.14 Network Processor
   15. 9.15 Device Certification and Qualification
       1. 9.15.1 FCC Certification and Statement
       2. 9.15.2 IC/ISED Certification and Statement
       3. 9.15.3 ETSI/CE Certification
       4. 9.15.4 UK Certification
   16. 9.16 Module Markings
   17. 9.17 End Product Labeling
   18. 9.18 Manual Information to the End User
10. 10Application, Implementation, and Layout
    1. 10.1 Application Information
       1. 10.1.1 Typical Application Circuit
    2. 10.2 Device Connection and Layout Fundamentals
       1. 10.2.1 Reset
       2. 10.2.2 Unused Pins
    3. 10.3 PCB Layout Guidelines
       1. 10.3.1 General Layout Recommendations
       2. 10.3.2 RF Layout Recommendations
          1. 10.3.2.1 Antenna Placement and Routing
          2. 10.3.2.2 Transmission Line Considerations
    4. 10.4 Reference Designs
11. 11Environmental Requirements and SMT Specifications
    1. 11.1 PCB Bending
    2. 11.2 Handling Environment
       1. 11.2.1 Terminals
       2. 11.2.2 Falling
    3. 11.3 Storage Condition
       1. 11.3.1 Moisture Barrier Bag Before Opened
       2. 11.3.2 Moisture Barrier Bag Open
    4. 11.4 PCB Assembly Guide
       1. 11.4.1 PCB Land Pattern & Thermal Vias
       2. 11.4.2 SMT Assembly Recommendations
       3. 11.4.3 PCB Surface Finish Requirements
       4. 11.4.4 Solder Stencil
       5. 11.4.5 Package Placement
       6. 11.4.6 Solder Joint Inspection
       7. 11.4.7 Rework and Replacement
       8. 11.4.8 Solder Joint Voiding
    5. 11.5 Baking Conditions
    6. 11.6 Soldering and Reflow Condition
12. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
    2. 12.2 Tools and Software
       1. 12.2.1 SimpleLink™ Microcontroller Platform
    3. 12.3 Documentation Support
    4. 12.4 支持资源
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 术语表
13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Packaging Information