ZHCSQP2B February   2021  – September 2022 CC2652PSIP

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Functional Block Diagram
  5. Revision History
  6. Device Comparison
  7. Terminal Configuration and Functions
    1. 7.1 Pin Diagram
    2. 7.2 Signal Descriptions – SIP Package
    3. 7.3 Connections for Unused Pins and Modules
  8. Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Supply and Modules
    5. 8.5  Power Consumption - Power Modes
    6. 8.6  Power Consumption - Radio Modes
    7. 8.7  Nonvolatile (Flash) Memory Characteristics
    8. 8.8  Thermal Resistance Characteristics
    9. 8.9  RF Frequency Bands
    10. 8.10 Bluetooth Low Energy - Receive (RX)
    11. 8.11 Bluetooth Low Energy - Transmit (TX)
    12. 8.12 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - RX
    13. 8.13 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - TX
    14. 8.14 Timing and Switching Characteristics
      1. 8.14.1 Reset Timing
      2. 8.14.2 Wakeup Timing
      3. 8.14.3 Clock Specifications
        1. 8.14.3.1 48 MHz Crystal Oscillator (XOSC_HF)
        2. 8.14.3.2 48 MHz RC Oscillator (RCOSC_HF)
        3. 8.14.3.3 2 MHz RC Oscillator (RCOSC_MF)
        4. 8.14.3.4 32.768 kHz Crystal Oscillator (XOSC_LF)
        5. 8.14.3.5 32 kHz RC Oscillator (RCOSC_LF)
      4. 8.14.4 Synchronous Serial Interface (SSI) Characteristics
        1. 8.14.4.1 Synchronous Serial Interface (SSI) Characteristics
        2.       36
      5. 8.14.5 UART
        1.       38
    15. 8.15 Peripheral Characteristics
      1. 8.15.1 ADC
        1.       Analog-to-Digital Converter (ADC) Characteristics
      2. 8.15.2 DAC
        1. 8.15.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 8.15.3 Temperature and Battery Monitor
        1. 8.15.3.1 Temperature Sensor
        2. 8.15.3.2 Battery Monitor
      4. 8.15.4 Comparators
        1. 8.15.4.1 Low-Power Clocked Comparator
        2. 8.15.4.2 Continuous Time Comparator
      5. 8.15.5 Current Source
        1. 8.15.5.1 Programmable Current Source
      6. 8.15.6 GPIO
        1. 8.15.6.1 GPIO DC Characteristics
    16. 8.16 Typical Characteristics
      1. 8.16.1 MCU Current
      2. 8.16.2 RX Current
      3. 8.16.3 TX Current
      4. 8.16.4 RX Performance
      5. 8.16.5 TX Performance
      6. 8.16.6 ADC Performance
  9. Detailed Description
    1. 9.1  Overview
    2. 9.2  System CPU
    3. 9.3  Radio (RF Core)
      1. 9.3.1 Bluetooth 5.2 Low Energy
      2. 9.3.2 802.15.4 (Thread, Zigbee, 6LoWPAN)
    4. 9.4  Memory
    5. 9.5  Sensor Controller
    6. 9.6  Cryptography
    7. 9.7  Timers
    8. 9.8  Serial Peripherals and I/O
    9. 9.9  Battery and Temperature Monitor
    10. 9.10 µDMA
    11. 9.11 Debug
    12. 9.12 Power Management
    13. 9.13 Clock Systems
    14. 9.14 Network Processor
    15. 9.15 Device Certification and Qualification
      1. 9.15.1 FCC Certification and Statement
      2. 9.15.2 IC/ISED Certification and Statement
      3. 9.15.3 ETSI/CE Certification
      4. 9.15.4 UK Certification
    16. 9.16 Module Markings
    17. 9.17 End Product Labeling
    18. 9.18 Manual Information to the End User
  10. 10Application, Implementation, and Layout
    1. 10.1 Application Information
      1. 10.1.1 Typical Application Circuit
    2. 10.2 Device Connection and Layout Fundamentals
      1. 10.2.1 Reset
      2. 10.2.2 Unused Pins
    3. 10.3 PCB Layout Guidelines
      1. 10.3.1 General Layout Recommendations
      2. 10.3.2 RF Layout Recommendations
        1. 10.3.2.1 Antenna Placement and Routing
        2. 10.3.2.2 Transmission Line Considerations
    4. 10.4 Reference Designs
  11. 11Environmental Requirements and SMT Specifications
    1. 11.1 PCB Bending
    2. 11.2 Handling Environment
      1. 11.2.1 Terminals
      2. 11.2.2 Falling
    3. 11.3 Storage Condition
      1. 11.3.1 Moisture Barrier Bag Before Opened
      2. 11.3.2 Moisture Barrier Bag Open
    4. 11.4 PCB Assembly Guide
      1. 11.4.1 PCB Land Pattern & Thermal Vias
      2. 11.4.2 SMT Assembly Recommendations
      3. 11.4.3 PCB Surface Finish Requirements
      4. 11.4.4 Solder Stencil
      5. 11.4.5 Package Placement
      6. 11.4.6 Solder Joint Inspection
      7. 11.4.7 Rework and Replacement
      8. 11.4.8 Solder Joint Voiding
    5. 11.5 Baking Conditions
    6. 11.6 Soldering and Reflow Condition
  12. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
    2. 12.2 Tools and Software
      1. 12.2.1 SimpleLink™ Microcontroller Platform
    3. 12.3 Documentation Support
    4. 12.4 支持资源
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 术语表
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Packaging Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Bluetooth Low Energy - Receive (RX)

Measured on the CC2652xSIP-EM reference design with Tc = 25 °C, VDDS = 3.0 V, fRF= 2440 MHz with
DC/DC enabled and high power PA connected to VDDS unless otherwise noted.
All measurements are performed at the antenna input with a combined RX and TX path, except for high power PA which is measured at a dedicated antenna connection.
 All measurements are performed conducted.
 
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
125 kbps (LE Coded)
Receiver sensitivity Differential mode. BER = 10–3 –103 dBm
Receiver saturation Differential mode. BER = 10–3 >5 dBm
Frequency error tolerance Difference between the incoming carrier frequency and the internally generated carrier frequency > (–300 / 300) kHz
Data rate error tolerance Difference between incoming data rate and the internally generated data rate (37-byte packets) > (–320 / 240) ppm
Data rate error tolerance Difference between incoming data rate and the internally generated data rate (255-byte packets) > (–100 / 100) ppm
Co-channel rejection(1) Wanted signal at –79 dBm, modulated interferer in channel, BER = 10–3 –1.5 dB
Selectivity, ±1 MHz(1) Wanted signal at –79 dBm, modulated interferer at ±1 MHz, BER = 10–3 8 / 4.5(2) dB
Selectivity, ±2 MHz(1) Wanted signal at –79 dBm, modulated interferer at ±2 MHz, BER = 10–3  44 / 37(2) dB
Selectivity, ±3 MHz(1) Wanted signal at –79 dBm, modulated interferer at ±3 MHz, BER = 10–3 46 / 44(2) dB
Selectivity, ±4 MHz(1) Wanted signal at –79 dBm, modulated interferer at ±4 MHz, BER = 10–3 44 / 46(2) dB
Selectivity, ±6 MHz(1) Wanted signal at –79 dBm, modulated interferer at ±6 MHz, BER = 10–3 48 / 44(2) dB
Selectivity, ±7 MHz Wanted signal at –79 dBm, modulated interferer at ≥ ±7 MHz, BER = 10–3 51 / 45(2) dB
Selectivity, Image frequency(1) Wanted signal at –79 dBm, modulated interferer at image frequency, BER = 10–3 37 dB
Selectivity, Image frequency ±1 MHz(1) Note that Image frequency + 1 MHz is the Co- channel –1 MHz. Wanted signal at –79 dBm, modulated interferer at ±1 MHz from image frequency, BER = 10–3 4.5 / 44 (2) dB
500 kbps (LE Coded)
Receiver sensitivity Differential mode. BER = 10–3 –98 dBm
Receiver saturation Differential mode. BER = 10–3 > 5 dBm
Frequency error tolerance Difference between the incoming carrier frequency and the internally generated carrier frequency > (–300 / 300) kHz
Data rate error tolerance Difference between incoming data rate and the internally generated data rate (37-byte packets) > (–350 / 350) ppm
Data rate error tolerance Difference between incoming data rate and the internally generated data rate (255-byte packets) > (–150 / 175) ppm
Co-channel rejection(1) Wanted signal at –72 dBm, modulated interferer in channel, BER = 10–3 –3.5 dB
Selectivity, ±1 MHz(1) Wanted signal at –72 dBm, modulated interferer at ±1 MHz, BER = 10–3 8 / 4(2) dB
Selectivity, ±2 MHz(1) Wanted signal at –72 dBm, modulated interferer at ±2 MHz, BER = 10–3 43 / 35(2) dB
Selectivity, ±3 MHz(1) Wanted signal at –72 dBm, modulated interferer at ±3 MHz, BER = 10–3 46 / 46(2) dB
Selectivity, ±4 MHz(1) Wanted signal at –72 dBm, modulated interferer at ±4 MHz, BER = 10–3 45 / 47(2) dB
Selectivity, ±6 MHz(1) Wanted signal at –72 dBm, modulated interferer at ≥ ±6 MHz, BER = 10–3 46 / 45(2) dB
Selectivity, ±7 MHz Wanted signal at –72 dBm, modulated interferer at ≥ ±7 MHz, BER = 10–3 49 / 45(2) dB
Selectivity, Image frequency(1) Wanted signal at –72 dBm, modulated interferer at image frequency, BER = 10–3 35 dB
Selectivity, Image frequency ±1 MHz(1) Note that Image frequency + 1 MHz is the Co- channel –1 MHz. Wanted signal at –72 dBm, modulated interferer at ±1 MHz from image frequency, BER = 10–3 4 / 46(2) dB
1 Mbps (LE 1M)
Receiver sensitivity Differential mode. BER = 10–3 –96 dBm
Receiver saturation Differential mode. BER = 10–3  > 5 dBm
Frequency error tolerance Difference between the incoming carrier frequency and the internally generated carrier frequency > (–350 / 350) kHz
Data rate error tolerance Difference between incoming data rate and the internally generated data rate (37-byte packets) > (–650 / 750) ppm
Co-channel rejection(1) Wanted signal at –67 dBm, modulated interferer in channel, BER = 10–3 –6 dB
Selectivity, ±1 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±1 MHz, BER = 10–3 7 / 4(2) dB
Selectivity, ±2 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±2 MHz,BER = 10–3 39 / 33(2) dB
Selectivity, ±3 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±3 MHz, BER = 10–3 36 / 40(2) dB
Selectivity, ±4 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±4 MHz, BER = 10–3 36 / 45(2) dB
Selectivity, ±5 MHz or more(1) Wanted signal at –67 dBm, modulated interferer at ≥ ±5 MHz, BER = 10–3 40 dB
Selectivity, image frequency(1) Wanted signal at –67 dBm, modulated interferer at image frequency, BER = 10–3 33 dB
Selectivity, image frequency
±1 MHz(1)
Note that Image frequency + 1 MHz is the Co- channel –1 MHz. Wanted signal at –67 dBm, modulated interferer at ±1 MHz from image frequency, BER = 10–3 4 / 41(2) dB
Out-of-band blocking(3) 30 MHz to 2000 MHz –10 dBm
Out-of-band blocking 2003 MHz to 2399 MHz –18 dBm
Out-of-band blocking 2484 MHz to 2997 MHz –12 dBm
Out-of-band blocking 3000 MHz to 12.75 GHz –2 dBm
Intermodulation Wanted signal at 2402 MHz, –64 dBm. Two interferers at 2405 and 2408 MHz respectively, at the given power level  –42 dBm
Spurious emissions,
30 to 1000 MHz(4)
Measurement in a 50-Ω single-ended load. < –59 dBm
Spurious emissions,
1 to 12.75 GHz(4)
Measurement in a 50-Ω single-ended load. < –47 dBm
RSSI dynamic range 70 dB
RSSI accuracy ±4 dB
2 Mbps (LE 2M)
Receiver sensitivity Differential mode. Measured at SMA connector, BER = 10–3  –90 dBm
Receiver saturation Differential mode. Measured at SMA connector, BER = 10–3 > 5 dBm
Frequency error tolerance Difference between the incoming carrier frequency and the internally generated carrier frequency > (–500 / 500) kHz
Data rate error tolerance Difference between incoming data rate and the internally generated data rate (37-byte packets) > (–700 / 750) ppm
Co-channel rejection(1) Wanted signal at –67 dBm, modulated interferer in channel,BER = 10–3 –7 dB
Selectivity, ±2 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±2 MHz, Image frequency is at –2 MHz, BER = 10–3 8 / 4(2) dB
Selectivity, ±4 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±4 MHz, BER = 10–3 36 / 34(2) dB
Selectivity, ±6 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±6 MHz, BER = 10–3 37 / 36(2) dB
Selectivity, image frequency(1) Wanted signal at –67 dBm, modulated interferer at image frequency, BER = 10–3 4 dB
Selectivity, image frequency
±2 MHz(1)
Note that Image frequency + 2 MHz is the Co-channel. Wanted signal at –67 dBm, modulated interferer at ±2 MHz from image frequency, BER = 10–3 –7 / 36(2) dB
Out-of-band blocking(3) 30 MHz to 2000 MHz –16 dBm
Out-of-band blocking 2003 MHz to 2399 MHz –21 dBm
Out-of-band blocking 2484 MHz to 2997 MHz –15 dBm
Out-of-band blocking 3000 MHz to 12.75 GHz –12 dBm
Intermodulation Wanted signal at 2402 MHz, –64 dBm. Two interferers at 2408 and 2414 MHz respectively, at the given power level –38 dBm
Numbers given as I/C dB
X / Y, where X is +N MHz and Y is –N MHz
Excluding one exception at Fwanted / 2, per Bluetooth Specification
Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan)