ZHCSQR6C december   2020  – july 2023 CC2662R-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Functional Block Diagram
  6. 5 Revision History
  7. 6 Device Comparison
  8. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram – RGZ Package (Top View)
    2. 7.2 Signal Descriptions
    3. 7.3 Connections for Unused Pins and Modules
  9. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Supply and Modules
    5. 8.5  Power Consumption - Power Modes
    6. 8.6  Power Consumption - Radio Modes
    7. 8.7  Nonvolatile (Flash) Memory Characteristics
    8. 8.8  Thermal Resistance Characteristics
    9. 8.9  Receive (RX)
    10. 8.10 Transmit (TX)
    11. 8.11 Timing and Switching Characteristics
      1. 8.11.1 Reset Timing
      2. 8.11.2 Wakeup Timing
      3. 8.11.3 Clock Specifications
        1. 8.11.3.1 48 MHz Crystal Oscillator (XOSC_HF)
        2. 8.11.3.2 48 MHz RC Oscillator (RCOSC_HF)
        3. 8.11.3.3 2 MHz RC Oscillator (RCOSC_MF)
        4. 8.11.3.4 32.768 kHz Crystal Oscillator (XOSC_LF)
        5. 8.11.3.5 32 kHz RC Oscillator (RCOSC_LF)
      4. 8.11.4 Synchronous Serial Interface (SSI) Characteristics
        1. 8.11.4.1 Synchronous Serial Interface (SSI) Characteristics
        2.       34
      5. 8.11.5 UART
        1. 8.11.5.1 UART Characteristics
    12. 8.12 Peripheral Characteristics
      1. 8.12.1 ADC
        1.       Analog-to-Digital Converter (ADC) Characteristics
      2. 8.12.2 DAC
        1. 8.12.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 8.12.3 Temperature and Battery Monitor
        1. 8.12.3.1 Temperature Sensor
        2. 8.12.3.2 Battery Monitor
      4. 8.12.4 Comparators
        1. 8.12.4.1 Continuous Time Comparator
        2. 8.12.4.2 Low-Power Clocked Comparator
      5. 8.12.5 Current Source
        1. 8.12.5.1 Programmable Current Source
      6. 8.12.6 GPIO
        1. 8.12.6.1 GPIO DC Characteristics
    13. 8.13 Typical Characteristics
      1. 8.13.1 MCU Current
      2. 8.13.2 RX Current
      3. 8.13.3 TX Current
      4. 8.13.4 RX Performance
      5. 8.13.5 TX Performance
      6. 8.13.6 ADC Performance
  10. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  System CPU
    3. 9.3  Radio (RF Core)
    4. 9.4  Memory
    5. 9.5  Sensor Controller
    6. 9.6  Cryptography
    7. 9.7  Timers
    8. 9.8  Serial Peripherals and I/O
    9. 9.9  Battery and Temperature Monitor
    10. 9.10 µDMA
    11. 9.11 Debug
    12. 9.12 Power Management
    13. 9.13 Clock Systems
    14. 9.14 Network Processor
  11. 10Application, Implementation, and Layout
    1. 10.1 Reference Designs
    2. 10.2 Junction Temperature Calculation
  12. 11Device and Documentation Support
    1. 11.1 Device Nomenclature
    2. 11.2 Tools and Software
      1. 11.2.1 SimpleLink™ Microcontroller Platform
    3. 11.3 Documentation Support
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 静电放电警告
    7. 11.7 术语表
  13. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11.4 支持资源

TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解答或提出自己的问题可获得所需的快速设计帮助。

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