SWRS269B June   2023  – February 2025 CC2674P10

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagram—RGZ Package (Top View)
    2. 6.2 Signal Descriptions—RGZ Package
    3. 6.3 Connections for Unused Pins and Modules—RGZ Package
    4. 6.4 Pin Diagram—RSK Package (Top View)
    5. 6.5 Signal Descriptions—RSK Package
    6. 6.6 Connection of Unused Pins and Module—RSK Package
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  3VModules
    5. 7.5  Power Consumption—Power Modes
    6. 7.6  Power Consumption—Radio Modes
    7. 7.7  Nonvolatile (Flash) Memory Characteristics
    8. 7.8  Thermal Resistance Characteristics
    9. 7.9  RF Frequency Bands
    10. 7.10 Bluetooth Low Energy—Receive (RX)
    11. 7.11 Bluetooth Low Energy—Transmit (TX)
    12. 7.12 Zigbee and Thread - IEEE 802.15.4-2006 2.4GHz (OQPSK DSSS1:8, 250kbps)—RX
    13. 7.13 Zigbee and Thread - IEEE 802.15.4–2006 2.4GHz (OQPSK DSSS1:8, 250kbps)—TX
    14. 7.14 Timing and Switching Characteristics
      1. 7.14.1 Reset Timing
      2. 7.14.2 Wakeup Timing
      3. 7.14.3 Clock Specifications
        1. 7.14.3.1 48MHz Clock Input (TCXO)
        2. 7.14.3.2 48MHz Crystal Oscillator (XOSC_HF)
        3. 7.14.3.3 48MHzRC Oscillator (RCOSC_HF)
        4. 7.14.3.4 2MHz RC Oscillator (RCOSC_MF)
        5. 7.14.3.5 32.768 kHz Crystal Oscillator (XOSC_LF)
        6. 7.14.3.6 32kHz RC Oscillator (RCOSC_LF)
      4. 7.14.4 Serial Peripheral Interface (SPI) Characteristics
        1. 7.14.4.1 SPI Characteristics
        2. 7.14.4.2 SPI Master Mode
        3. 7.14.4.3 SPI Master Mode Timing Diagrams
        4. 7.14.4.4 SPI Slave Mode
        5. 7.14.4.5 SPI Slave Mode Timing Diagrams
      5. 7.14.5 UART
        1. 7.14.5.1 UART Characteristics
    15. 7.15 Peripheral Characteristics
      1. 7.15.1 ADC
        1. 7.15.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 7.15.2 DAC
        1. 7.15.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 7.15.3 Temperature and Battery Monitor
        1. 7.15.3.1 Temperature Sensor
        2. 7.15.3.2 Battery Monitor
      4. 7.15.4 Comparators
        1. 7.15.4.1 Low-Power Clocked Comparator
        2. 7.15.4.2 Continuous Time Comparator
      5. 7.15.5 Current Source
        1. 7.15.5.1 Programmable Current Source
      6. 7.15.6 GPIO
        1. 7.15.6.1 GPIO DC Characteristics
    16. 7.16 Typical Characteristics
      1. 7.16.1 MCU Current
      2. 7.16.2 RX Current
      3. 7.16.3 TX Current
      4. 7.16.4 RX Performance
      5. 7.16.5 TX Performance
      6. 7.16.6 ADC Performance
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  System CPU
    3. 8.3  Radio (RF Core)
      1. 8.3.1 Bluetooth 5.3 Low Energy
      2. 8.3.2 802.15.4 Thread, Zigbee, and 6LoWPAN
    4. 8.4  Memory
    5. 8.5  Sensor Controller
    6. 8.6  Cryptography
    7. 8.7  Timers
    8. 8.8  Serial Peripherals and I/O
    9. 8.9  Battery and Temperature Monitor
    10. 8.10 µDMA
    11. 8.11 Debug
    12. 8.12 Power Management
    13. 8.13 Clock Systems
    14. 8.14 Network Processor
  10. 9 Application, Implementation, and Layout
    1. 9.1 Reference Designs
    2. 9.2 Junction Temperature Calculation
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
      1. 10.2.1 SimpleLink™ Microcontroller Platform
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

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机械数据 (封装 | 引脚)
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订购信息

11 Revision History

Changes from June 20, 2023 to February 28, 2025 (from Revision A (June 2023) to Revision B (February 2025))

  • Adjusted Tx currents in Features Go
  • Removed preliminary information footnote for RSK packageGo
  • Corrected part number in Description Go
  • Updated Device Comparison Go
  • Updated Receiver sensitivity, 125kbps (LE Coded) in Section 7.10, Bluetooth Low Energy—Receive (RX) Go
  • Updated Max output power, high power PA, 10dBm configuration in Section 7.11, Bluetooth Low Energy—Transmit (TX) Go
  • Updated Max output power, high power PA, 10dBm configuration in Section 7.13, Zigbee and Thread - IEEE 802.15.4-2006 2.4GHz (OQPSK DSSS1:8, 250kbps - TX Go
  • Updated Radio transmit current, 2.4GHz PA (BLE), 0dBm and +5dBm in Section 7.6, Power Consumption - Radio Modes Go
  • Updated Radio transmit current, High power PA, +10 and +20dBm in Section 7.6, Power Consumption - Radio Modes Go
  • Updated Sensor controller power consumption in Section 7.5, Power Consumption - Power Modes Go
  • Updated Flash specifications in Section 7.7, Nonvolatile (Flash) Memory Characteristics Go
  • Updated graphs and tables on Typical characteristics Go
  • Added EnergyTrace information to Section 8.11, Debug Go
  • Added Section 9.2 Junction Temperature Calculation Go
  • Added Section 10.1 Device Nomenclature Go
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