SWRS269A december   2022  – june 2023 CC2674P10

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Revision History
  7. 6 Device Comparison
  8. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram – RGZ Package (Top View)
    2. 7.2 Signal Descriptions – RGZ Package
    3. 7.3 Connections for Unused Pins and Modules – RGZ Package
    4. 7.4 Pin Diagram – RSK Package (Top View)
    5. 7.5 Signal Descriptions – RSK Package
    6. 7.6 Connection of Unused Pins and Module – RSK Package
  9. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Supply and Modules
    5. 8.5  Power Consumption - Power Modes
    6. 8.6  Power Consumption - Radio Modes
    7. 8.7  Nonvolatile (Flash) Memory Characteristics
    8. 8.8  Thermal Resistance Characteristics
    9. 8.9  RF Frequency Bands
    10. 8.10 Bluetooth Low Energy - Receive (RX)
    11. 8.11 Bluetooth Low Energy - Transmit (TX)
    12. 8.12 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - RX
    13. 8.13 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - TX
    14. 8.14 Timing and Switching Characteristics
      1. 8.14.1 Reset Timing
      2. 8.14.2 Wakeup Timing
      3. 8.14.3 Clock Specifications
        1. 8.14.3.1 48 MHz Clock Input (TCXO)
        2. 8.14.3.2 48 MHz Crystal Oscillator (XOSC_HF)
        3. 8.14.3.3 48 MHz RC Oscillator (RCOSC_HF)
        4. 8.14.3.4 2 MHz RC Oscillator (RCOSC_MF)
        5. 8.14.3.5 32.768 kHz Crystal Oscillator (XOSC_LF)
        6. 8.14.3.6 32 kHz RC Oscillator (RCOSC_LF)
      4. 8.14.4 Serial Peripheral Interface (SPI) Characteristics
        1. 8.14.4.1 SPI Characteristics
        2. 8.14.4.2 SPI Master Mode
        3. 8.14.4.3 SPI Master Mode Timing Diagrams
        4. 8.14.4.4 SPI Slave Mode
        5. 8.14.4.5 SPI Slave Mode Timing Diagrams
      5. 8.14.5 UART
        1. 8.14.5.1 UART Characteristics
    15. 8.15 Peripheral Characteristics
      1. 8.15.1 ADC
        1. 8.15.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 8.15.2 DAC
        1. 8.15.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 8.15.3 Temperature and Battery Monitor
        1. 8.15.3.1 Temperature Sensor
        2. 8.15.3.2 Battery Monitor
      4. 8.15.4 Comparators
        1. 8.15.4.1 Low-Power Clocked Comparator
        2. 8.15.4.2 Continuous Time Comparator
      5. 8.15.5 Current Source
        1. 8.15.5.1 Programmable Current Source
      6. 8.15.6 GPIO
        1. 8.15.6.1 GPIO DC Characteristics
    16. 8.16 Typical Characteristics
      1. 8.16.1 MCU Current
      2. 8.16.2 RX Current
      3. 8.16.3 TX Current
      4. 8.16.4 RX Performance
      5. 8.16.5 TX Performance
      6. 8.16.6 ADC Performance
  10. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  System CPU
    3. 9.3  Radio (RF Core)
      1. 9.3.1 Bluetooth 5.3 Low Energy
      2. 9.3.2 802.15.4 Thread, Zigbee, and 6LoWPAN
    4. 9.4  Memory
    5. 9.5  Sensor Controller
    6. 9.6  Cryptography
    7. 9.7  Timers
    8. 9.8  Serial Peripherals and I/O
    9. 9.9  Battery and Temperature Monitor
    10. 9.10 µDMA
    11. 9.11 Debug
    12. 9.12 Power Management
    13. 9.13 Clock Systems
    14. 9.14 Network Processor
  11. 10Application, Implementation, and Layout
    1. 10.1 Reference Designs
  12. 11Device and Documentation Support
    1. 11.1 Tools and Software
      1. 11.1.1 SimpleLink™ Microcontroller Platform
    2. 11.2 Documentation Support
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

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8.11 Bluetooth Low Energy - Transmit (TX)

Measured on the LP-EM-CC1354P10-1 reference design with Tc = 25 °C, VDDS = 3.0 V, fRF= 2440 MHz with
DC/DC enabled and high power PA connected to VDDS unless otherwise noted.
All measurements are performed at the antenna input with a combined RX and TX path, except for high power PA which is measured at a dedicated antenna connection. All measurements are performed conducted.
 
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
General Parameters
Max output power,
high power PA		 Differential mode, delivered to a single-ended 50 Ω load through a balun 19.5 dBm
Output power programmable range
high power PA		 Differential mode, delivered to a single-ended 50 Ω load through a balun 6 dB
Max output power,
high power PA, 10 dBm configuration(3)		 Differential mode, delivered to a single-ended 50 Ω load through a balun 10.5 dBm
Output power programmable range
high power PA, 10 dBm configuration(3)		 Differential mode, delivered to a single-ended 50 Ω load through a balun 5 dB
Max output power, regular PA Differential mode, delivered to a single-ended 50 Ω load through a balun 5 dBm
Output power programmable range,
regular PA		 Differential mode, delivered to a single-ended 50 Ω load through a balun 26 dB
Spurious emissions and harmonics
Spurious emissions,
high-power PA(1)		 f < 1 GHz, outside restricted bands +20 dBm setting < -36 dBm
f < 1 GHz, restricted bands FCC < -55 dBm
f > 1 GHz, including harmonics -37 dBm
Harmonics,
high-power PA(2)		 Second harmonic -35 dBm
Third harmonic -42 dBm
Spurious emissions,
high-power PA, 10 dBm configuration(1)(3) 		 f < 1 GHz, outside restricted bands +10 dBm setting(3) < -36 dBm
f < 1 GHz, restricted bands ETSI < -54 dBm
f < 1 GHz, restricted bands FCC < -55 dBm
f > 1 GHz, including harmonics -41 dBm
Harmonics,
high-power PA, 10 dBm configuration(3) 		 Second harmonic < -42 dBm
Third harmonic < -42 dBm
Spurious emissions,
regular PA		 f < 1 GHz, outside restricted bands +5 dBm setting < –36 dBm
f < 1 GHz, restricted bands ETSI < –54 dBm
f < 1 GHz, restricted bands FCC < –55 dBm
f > 1 GHz, including harmonics < –42 dBm
Harmonics,
regular PA		 Second harmonic < –42 dBm
Third harmonic < –42 dBm
(1) To ensure margins for passing FCC band edge requirements at 2483.5 MHz, a lower than maximum output-power setting or less than 100% duty cycle may be used when operating at the upper Bluetooth Low Energy channel(s). 
(2) To ensure margins for passing FCC requirements for harmonic emission, a reduction of maximum output-power may be required.
(3) Measured on LP-EM-CC1354P10-1 reference design.
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