ZHCSM59B November   2014  – September 2020 CC3100MOD

PRODUCTION DATA  

1. 1 特性
2. 2 应用
3. 3 说明
4. 4 功能方框图
5. 5 功能方框图
6. 6 Revision History
7. 7 Terminal Configuration and Functions
   1. 7.1 CC3100MOD Pin Diagram
   2. 7.2 Pin Attributes
      1.      10
8. 8 Specifications
   1. 8.1  Absolute Maximum Ratings
   2. 8.2  ESD Ratings
   3. 8.3  Power-On Hours (POH)
   4. 8.4  Recommended Operating Conditions
   5. 8.5  Power Consumption Summary
   6. 8.6  TX Power and IBAT versus TX Power Level Settings
   7. 8.7  Brownout and Blackout Conditions
   8. 8.8  Electrical Characteristics (3.3 V, 25°C)
   9. 8.9  WLAN RF Characteristics
      1. 8.9.1 WLAN Receiver Characteristics
      2. 8.9.2 WLAN Transmitter Characteristics
   10. 8.10 Reset Requirement
   11. 8.11 Thermal Resistance Characteristics for MOB Package
   12. 8.12 Timing and Switching Characteristics
       1. 8.12.1 Wake-Up Sequence
       2. 8.12.2 Wake Up From Hibernate
          1. 8.12.2.1 nHIB Timing Requirements (1)
       3. 8.12.3 Interfaces
          1. 8.12.3.1 Host SPI Interface Timing
          2. 8.12.3.2 SPI Host Interface
   13. 8.13 Host UART
       1. 8.13.1 5-Wire UART Topology
       2. 8.13.2 4-Wire UART Topology
       3. 8.13.3 3-Wire UART Topology
9. 9 Detailed Description
   1. 9.1 Overview
   2. 9.2 Module Features
      1. 9.2.1 WLAN
      2. 9.2.2 Network Stack
      3. 9.2.3 Host Interface and Driver
      4. 9.2.4 System
   3. 9.3 Functional Block Diagram
   4. 9.4 Wi-Fi Network Processor Subsystem
   5. 9.5 Power-Management Subsystem
      1. 9.5.1 VBAT Wide-Voltage Connection
   6. 9.6 Low-Power Operating Modes
      1. 9.6.1 Low-Power Deep Sleep
      2. 9.6.2 Hibernate
10. 10Applications, Implementation, and Layout
    1. 10.1 Reference Schematics
    2. 10.2 Design Requirements
    3. 10.3 Layout Recommendations
       1. 10.3.1 RF Section (Placement and Routing)
       2. 10.3.2 Antenna Placement and Routing
       3. 10.3.3 Transmission Line Considerations
11. 11Environmental Requirements and Specifications
    1. 11.1 Temperature
       1. 11.1.1 PCB Bending
    2. 11.2 Handling Environment
       1. 11.2.1 Terminals
       2. 11.2.2 Falling
    3. 11.3 Storage Condition
       1. 11.3.1 Moisture Barrier Bag Before Opened
       2. 11.3.2 Moisture Barrier Bag Open
    4. 11.4 Baking Conditions
    5. 11.5 Soldering and Reflow Condition
12. 12Device and Documentation Support
    1. 12.1 Device Support
       1. 12.1.1 Development Support
          1. 12.1.1.1 Firmware Updates
       2. 12.1.2 Device Nomenclature
    2. 12.2 Documentation Support
    3. 12.3 Trademarks
    4. 12.4 静电放电警告
    5. 12.5 术语表
13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Mechanical Drawing
    2. 13.2 Package Option
       1. 13.2.1 Packaging Information
       2. 13.2.2 Tape and Reel Information